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Taiwan Semiconductor Manufacturing Corporation (TSMC)


8, Li-Hsin Rd. VI, Hsinchu Science Park,     Hsinchu 300-78 Taiwan, R.O.C.
T 886-3-563-6688     F 886-3-566-2051     www.tsmc.com

General Information

  • Year Founded: 1987
  • Number of Employees: 46968

Taiwan Semiconductor Manufacturing Corporation (TSMC) is one of the largest dedicated semiconductor foundries in the world, providing the industry's leading process technology and one of the foundry industry's largest portfolios of process-proven libraries, IP, design tools and reference flows.

The company's owned capacity is expected to be above 9 million (12-inch equivalent) wafers, including capacity from three advanced 12-inch GIGAFABT facilities, four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech and TSMC China. TSMC is the first foundry to provide both 20nm and 16nm production capabilities.

As a pure-play semiconductor foundry, TSMC does not design, manufacture, or market semiconductor products under its own brand name, but rather to offer ULSI and VLSI wafer foundry manufacturing, wafer probing, assembly and testing, mask production and design services.

Service Type

  • Wafer Foundry
  • Outsourced Semiconductor Assembly and Test

Fab Details

Fab Name: Fab 2
  • Location: Hsinchu
  • Technology: CMOS, MEMS
  • Geometry: 50UM
  • Wafer Size: 06-INCH
Fab Name: Fab 3
  • Location: Hsinchu
  • Technology: CMOS, MEMS
  • Geometry: 15UM
  • Wafer Size: 08-INCH
Fab Name: Fab 5
  • Location: Hsinchu
  • Technology: CMOS
  • Geometry: 13UM
  • Wafer Size: 08-INCH
Fab Name: Fab 6
  • Location: Tainan
  • Technology: CMOS
  • Geometry: 13UM
  • Wafer Size: 08-INCH
Fab Name: Fab 8
  • Location: Hsinchu
  • Technology: CMOS
  • Geometry: 13UM
  • Wafer Size: 08-INCH
Fab Name: Fab 12A
  • Location: Hsinchu
  • Technology: CMOS
  • Geometry: 28NM, 40NM, 65NM, 90NM, 0.13UM
  • Wafer Size: 12-INCH
Fab Name: Fab 14
  • Location: Tainan
  • Technology: CMOS
  • Geometry: 28NM, 40NM, 65NM, 90NM
  • Wafer Size: 12-INCH
Fab Name: WaferTech (Fab 11)
  • Location: Camas, Washington
  • Technology: CMOS
  • Geometry: 15UM
  • Wafer Size: 08-INCH
Fab Name: TSMC China (Fab 10)
  • Location: Shanghai
  • Technology: CMOS, BCD
  • Geometry: 25UM
  • Wafer Size: 08-INCH
Fab Name: Fab 15
  • Location: Taichung
  • Technology: CMOS
  • Geometry: 45NM, 28NM, 90NM, 65NM
  • Wafer Size: 12-INCH
Fab Name: Fab 12B
  • Location: Hsinchu
  • Technology: Not Available
  • Geometry: Not Available
  • Wafer Size: 12-INCH
Fab Name: (SSMC) TSMC-NXP JV
  • Location: Pasir Ris
  • Technology: Not Available
  • Geometry: Not Available
  • Wafer Size:

Financials

  • Public: TPE;NYSE: 2330;TSM
  • For additional financial information for all public semiconductor companies, and select suppliers, click here:

Mergers & Acquisitions

VisEra Technologies Company Ltd. (86.9% share)
Transaction Type: ACQUIRE
Announced Date: 2016-08-02
XinTec Inc. (6.9% share)
Transaction Type: ACQUIRE
Announced Date: 2016-08-02
Tela Innovations, Inc. (25% stake)
Transaction Type: ACQUIRE
Announced Date: 2015-11-12
QUALCOMM Incorporated (Taiwan factory)
Transaction Type: ACQUIRE
Announced Date: 2014-11-19
Powerchip Technology (Hsinchu Science Park Fab and Additional Land)
Transaction Type: ACQUIRE
Announced Date: 2011-01-12
Stion (21% Stake)
Transaction Type: ACQUIRE
Announced Date: 2010-06-22
Motech Industries (20% stake)
Transaction Type: ACQUIRE
Announced Date: 2009-12-09

Key Management

  • Dr. Morris Chang - Chairman
  • Dr. F.C. Tseng - Vice Chairman
  • David Keller - President, TSMC North America
  • Dr. Mark Liu - Chairman
  • Dr. C.C. Wei - CEO & Vice Chairman
  • Rick Cassidy - Senior Vice President, Corporate Strategy Office
  • C.H. Chen - President - China
  • Lora Ho - CFO and Vice President
  • Dr. Maria Marced - President, TSMC Europe
  • Makoto Onodera - President, TSMC Japan
  • Dr. Jack Sun - CTO and VP, Research & Development

Updated: 2017-07-17

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