STATS ChipPAC Ltd.
10 Ang Mo Kio Street 65 #04-08/09 Techpoint Singapore 569059 Singapore
T 65-6824-7777 F 65-6720-7829 www.statschippac.com
STATS ChipPAC Ltd. is a leading service provider of advanced semiconductor packaging design, assembly, test and distribution solutions. A trusted partner and supplier to leading semiconductor companies worldwide, STATS ChipPAC provides fully integrated, multi-site, end-to-end packaging and testing solutions that bring products to the market faster. The company provides a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base for the computing, communications and consumer markets.
- Outsourced Semiconductor Assembly and Test
- Dr. Byung Joon Han - Chairman
- Chih-Ming Lai - CEO
- Shim Kwon - CTO
- Hal Lasky - Chief Sales Officer & Exec. Vice President/ SVP of JCET
- Kwek Kiong Woo - CFO & Sr. Vice President
- Cindy Palar - Vice President, Corporate Planning
- Scott Sikorski - VP, Business Development
- Prasad Swaminath - VP, Sales