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GLOBALFOUNDRIES


2600 Great American Way     Santa Clara CA 95054 USA
T (408) 462-3900     www.globalfoundries.com

General Information

  • Year Founded: 2009
  • Number of Employees: 10000

Social Media

GLOBALFOUNDRIES is the world's first full-service semiconductor foundry with a truly global footprint. The company provides a unique combination of advanced technology and manufacturing to more than 160 customers. GLOBALFOUNDRIES' three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia.

Service Type

  • Wafer Foundry

Fab Details

Fab Name: Fab 1
  • Location: Dresden
  • Technology: CMOS, SOI
  • Geometry: 45nm, 40nm, 32nm, 28nm
  • Wafer Size: 12-INCH
Fab Name: Fab 7
  • Location: Singapore
  • Technology: CMOS, SOI
  • Geometry: 40nm, 45nm, 65nm, 90nm, 0.13um
  • Wafer Size: 12-INCH
Fab Name: Fab 2
  • Location: Singapore
  • Technology: CMOS, MEMS
  • Geometry: 0.35UM to 0.6UM
  • Wafer Size: 08-INCH
Fab Name: Fab 3
  • Location: Singapore
  • Technology: CMOS, MEMS
  • Geometry: 0.153UM to 0.35UM
  • Wafer Size: 08-INCH
Fab Name: Fab 3E
  • Location: Singapore
  • Technology: CMOS, MEMS
  • Geometry: 0.22UM, 0.153UM, 0.14UM
  • Wafer Size: 08-INCH
Fab Name: Fab 5
  • Location: Singapore
  • Technology: CMOS, MEMS
  • Geometry: 0.153UM to 0.35UM
  • Wafer Size: 08-INCH
Fab Name: Fab 6
  • Location: Singapore
  • Technology: CMOS, RF CMOS, MEMS
  • Geometry: 0.11UM to 0.18UM
  • Wafer Size: 08-INCH
Fab Name: Fab 8
  • Location: Malta, NY
  • Technology: Not Available
  • Geometry: 28nm to 14nm
  • Wafer Size: 12-INCH
Fab Name: Fab 9
  • Location: Burlington, Vermont
  • Technology: CMOS, RF CMOS, SiGe
  • Geometry: 350NM to 90NM
  • Wafer Size: 08-INCH
Fab Name: Fab 10
  • Location: East Fishkill, New York
  • Technology: CMOS
  • Geometry: 90NM to 22NM
  • Wafer Size: 12-INCH
Fab Name: Fab 11
  • Location: Chengdu
  • Technology: Not Available
  • Geometry: Not Available
  • Wafer Size: Not Available

Financials

  • Private

Mergers & Acquisitions

IBM (semiconductor unit)
Transaction Type: ACQUIRE
Announced Date: 2014-10-20
Payment Method: Cash
ProMOS Technologies Inc. (production equipment from 12-inch wafer fab)
Transaction Type: ACQUIRE
Announced Date: 2013-03-28
Payment Method: Undisclosed
Powerchip Technology Corporation (portion of production equipment form 12-inch P3 fab)
Transaction Type: ACQUIRE
Announced Date: 2013-01-30
Payment Method: Undisclosed
AMD (AMD's 9% stake in Globalfoundries)
Transaction Type: ACQUIRE
Announced Date: 2012-03-05
Amount Paid: 425.0M
Payment Method: Cash
Powerchip Technology (P3 12-inch wafer fabrication facility in Taiwan)
Transaction Type: ACQUIRE
Announced Date: 2011-12-29
Payment Method: Undisclosed

Key Management

  • Thomas Caulfield - CEO
  • Gregg Bartlett - Sr. VP, Product Management
  • Dr. John Goldsberry - Chief Accounting Officer & Acting CFO
  • Dr. Gary Patton - CTO and Sr. VP, Worldwide R&D
  • Leonard Stephens - Chief Human Resources Officer and Sr. Vice President
  • Kay Chai Ang - Sr. Vice President and General Manager, Singapore Operations
  • Dr. Bami Bastani - Sr. VP, Business Units
  • James Doyle - Sr. VP & GM Fabs 9 & 10
  • Charles Fox - Sr. VP, Global Sales
  • Mark Ireland - VP, Business Development
  • Alexie Lee - Chief of Staff, Office of The CEO
  • Dr. Rutger Wijburg - Sr. Vice President and General Manager, Fab 1
  • Matteo Recagni - Director, Strategy

Updated: 2017-07-07

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