The Global Semiconductor Alliance Trusted IoT Ecosystem Security (TIES) group has grown rapidly to over 40 member companies across the ecosystem that consists of chipset vendors, ODMs, OEMs, IoT platform companies, software suppliers, and cloud service providers with a common interest in secure silicon and trusted supply chain. The diversity of the group allows leveraging of ecosystem IQ to reduce barriers of IoT adoption and enable new services for all participating stakeholders in the IoT value chain.

Members of the TIES group are working on multiple projects on Trust and Security, including;

  • Security Requirements for Connected MCUs, MPUs, SoC and Subsystems
  • Secure Chip-to-Cloud Solutions for Enablement of Automotive IoT Services
  • Trusted & Secure IoT Services Enablement with Scalable Ecosystem Platforms
  • Silicon Inborn Root of Trust for Anti-counterfeiting and Supply Chain Security
  • Pre-Silicon Security Assessment for Future-Proof Device Certification
  • Machine Learning and Security – Opportunities and Threats to Silicon Subsystems
  • Reducing Liabilities and Risk with Trusted Supply Chain Provenance and Traceability

Details on each of the projects are available to view at TIES SWG Projects.

As a product of these projects, the TIES group has released the first whitepaper posted on the TIES website – “Security Requirements for Connected MCU and MPUs” available to all GSA members.

About the TIES Group

The Trusted IoT Ecosystem Security (TIES) group was established to identify use cases in the connected IoT value chain and promote secure and trusted end-to-end solutions. The ecosystem consists of chipset, hardware, software, platform and services vendors collaborating in Solutions Working Groups (SWGs) aiming to accelerate adoption, growth and field use of securely connected chips, devices, systems, applications and infrastructure. The collective GSA member based platform business ecosystem can enable new recurring services revenue streams and high value business models.

Click TIES PORTAL to learn more on TIES and any of the special projects. If interested in participating in the group, please contact Shungo Saito at