Global Semiconductor Alliance has re-launched the IoT Security Working Group as the Trusted IoT Ecosystem Security (TIES) Group to address end-to-end issues in IoT Security across the value chain and is comprised of various IoT ecosystem security stakeholders including chipset vendors, ODMs, OEMs, platform companies, cloud vendors and service providers. TIES is a collaborative group of companies focusing on promoting secure and trusted chip-to-cloud solutions across the IoT value chain to maximize economic value.
The goal of TIES is to promote Trusted End-to-End solutions in the IoT value chain that accelerate the adoption, growth, and field use of connected chips, devices, systems, and IoT applications while enabling recurring services revenue streams and high value business models.
Members of the TIES Group will seek to influence the requirements for security that will eventually be shared with the value chain and supply chain actors. The group has already identified and commenced on special projects such as;
Security Requirements for Connected MCUs and MPUs
Secure Chip-to-Cloud Solutions for Enablement of Automotive IoT Services
Enabling Trusted & Secure IoT Services with Scalable Platforms
Anti-counterfeiting End-to-End Technology with Silicon Inborn Root of Trust
Pre-Silicon Security Evaluation for Future-Proof Device Certification
Machine Learning and Security – Threats and Opportunities to Silicon Subsystems
Reducing Liabilities and Risk with Supply Chain Provenance and Traceability