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Capital Lite Working Group

  • Overview
  • Meeting Schedule
  • Presentations
  • Papers
  • Minutes
  • Group Members
  • News


The Capital Lite Working Group is a result of discussions that took place during multiple VC panel discussions in 2011 that were chaired by GSA’s ECCEO Council and the publication of the paper The Capital-Lite Semiconductor Model: Revitalizing Semiconductor Startup Investment. The purpose of this Working Group is to foster discussion regarding the current state of funding for semiconductor start-ups; postulate alternative models and solutions; and ultimately turn our discussion into actionable events that will benefit our industry by encouraging entrepreneurship and innovation.


To create a seamless consortium of representatives from the entire semiconductor ecosystem that fully cooperate in enabling start-ups to prosper and return significant multiples to all its constituents and to establish a pipeline of funded, innovative semiconductor companies with an appropriate capital structure to make this the largest segment in tech financing.


To develop, promote and execute expanded investment models that can be used by semiconductor start-ups to innovate and prosper.

  • Invigorate semiconductor start-up investment and subsequent returns
  • Enable high quality innovation
  • Stimulate sustainable M&A and new IPO deal flow
  • CEOs, CFOs, and senior leadership from within the entire semiconductor ecosystem, OEMs, VCs, Finance, Banking and M&A executives
  • Identify concerns in existing funding models for semiconductor start-ups
  • Quantify the problem within the semiconductor industry
  • Postulate the impact of the problem to the semiconductor industry and the markets served by this industry
  • Propose alternative solutions; e.g. Capital-lite
  • Build internal consensus and solicit external feedback
  • Solicit industry participation and support
  • Agree on and implement solution(s)

Contact Information

Working Group Chair
Matt Rhodes, CEO, Semitech Semiconductor

Meeting Schedule

No meetings are scheduled at this time.  Please check back at a later date.







May 1, 2013

Nov 7, 2012

Mar 14, 2012

Jan 24, 2012

Dec 7, 2011

Oct 13, 2011

Oct 6, 2011

Sept 13, 2011

Sept 1, 2011

May 24, 2011


Innovation Center (PDF, 269 KB)
This white paper by SK telecom Americas outlines their funding model to seed new start-ups, mitigate risk, and ensure a successful exit.

Innovation Evolution in the Semiconductor Industry
Authors: Ken Lawler, General Partner, Silicon Ventures; Warren Savage, President and CEO, IPextreme; and Michael Fancher, Associate Professor of Nanoeconomics, College of Nanoscale Science and Engineering

Capital Lite Business Model Strategies & Tools: A Startup’s Guide to Surviving an Investment Drought
This white paper focuses on invigorating semiconductor start-ups to enable high quality innovation, increased investment and subsequent returns, and stimulate sustainable M&A, as well as new IPOs.

Capital-Lite Semiconductor Model: Revitalizing Semiconductor Startup Investment (PDF, 98 KB)
Authors: Amer Haider, Vice President of Corporate and Business Development, Cavium and Awais Nemat, former Vice President of Enterprise Business Unit, Marvell Semiconductors

Startup Outlook 2012 Report (PDF, 886 KB)
Author: Silicon Valley Bank

A Lean Fabless Semiconductor Business Model (PDF, 285 KB)
Author: Andreas Olofsson, Adapteva, Inc.


2012 Meeting Minutes
2011 Meeting Minutes

Group Members

Contact Kole Giles for membership information.

Battery Ventures Battery Ventures


Renesas to Acquire Integrated Device Technology, to Enhance Global Leadership in Embedded Solutions
Monday, September 10, 2018
Business Wire
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc., a leading supplier of analog mixed-signal products including sensors, connectivity and wireless power, today announced they have signed a definitive agreement under which Renesas will acquire IDT in an all-cash transaction representing an equity value of approximately US$6.7 billion.

Silicon Line Raises $9.5M in Series B Funding Round Led by Capital-E
Monday, September 10, 2018
PR Newswire
Silicon Line GmbH, the global leader in developing and providing innovative ultra-low-power optical link technology for consumer electronics as well as commercial and industrial markets, has raised $9.5M in a Series B financing round led by Capital-E.

Secretive Semiconductor Startup Groq Raises $52M from Social Capital
Wednesday, September 5, 2018
Groq has raised $52.3 million of a $60 million round, per an SEC filing.

ThinCI Receives $65M in Oversubscribed Series C Funding Round
Wednesday, September 5, 2018
Design & Reuse
ThinCI Inc., an AI hardware startup developing computing platforms for the expanding AI/Machine Learning market has announced the successful close of its $65 Million Series C round.

NXP Acquires OmniPhy To Help Ramp In-Car Networking To Gigabit Speeds
Tuesday, September 4, 2018
OmniPhy's technology will enable NXP to offer automotive-grade ethernet with speeds greater than 1 Gbps to help support the increasingly sensor laden vehicles that are coming to market in coming years.

Intel Acquires AI Startup
Thursday, August 16, 2018
Intel announced it is buying, a startup developing a platform-agnostic AI model suite, for an undisclosed amount.

KYEC to Merge with Fellow Backend Company
Wednesday, August 8, 2018
King Yuan Electronics (KYEC) has agreed to merge with Dawning Leading Technology (DL-Tek), in which KYEC already holds a 33.5% stake, according to the companies. The merger is set to be completed on November 1, with KYEC being the surviving company.

Skyworks to Acquire Smart Interface Innovator Avnera Corporation
Monday, August 6, 2018
Business Wire
Skyworks Solutions Inc., an innovator of high performance analog semiconductors connecting people, places and things, announced it signed a definitive agreement to purchase Avnera Corporation, a leading developer of Analog System on Chips (ASoCs).

Summit Semiconductor, Inc. Announces Pricing of Initial Public Offering of Common Stock
Friday, July 27, 2018
Summit Semiconductor, a technology company that delivers the wireless immersive sound experience with patented technology supporting the WiSA (Wireless Speaker and Audio) interoperability standard, announced the pricing of its initial public offering of 2.4 million shares of its common stock at an initial offering price of $5.00 per share, for total gross proceeds of $12.0 million.

Qualcomm Terminates NXP Deal, Will Buy Back $30 Billion of Stock
Thursday, July 26, 2018
Qualcomm has formally terminated its proposed acquisition of chip rival NXP, ending a two-year courtship and paving the way for a $30 billion stock buyback, the company stated.

Kandou Bus Closes $15M Series B Funding Round
Wednesday, July 25, 2018
Kandou Bus, S.A., a Lausanne, Switzerland-based provider of SerDes IP and chip solutions, completed a a $15M Series B funding.

Moschip Semiconductor Technology Announces Acquisitions to Strengthen Semiconductor Business Unit
Monday, July 23, 2018
Business Standard
Moschip Semiconductor Technology has approved definitive agreements/arrangements for the acquisition of four companies.

Nanya to Buy 19% Stake in Backend Firm
Monday, July 23, 2018
DRAM chipmaker Nanya Technology has disclosed plans to acquire an about 19% stake in Formosa Advanced Technologies (FATC), a backend house specializing in memory chips.

Xilinx Acquires China AI Chip Startup
Wednesday, July 18, 2018
Xilinx has acquired DeePhi Technology, a Beijing-based AI chip startup specializing in deep compression, pruning and system-level optimization for neural networks, according to the US-based FPGA specialist.

eASIC to Become Part of Intel
Friday, July 13, 2018
EE Times Asia
Intel Corp. bid to buy eASIC for an undisclosed sum, aiming to fold to pioneer of a low-cost alternative to ASICs into its FPGA group.

IDG Capital Co-Leads $100M Series B Round In Chinese Chip Maker ASR Microelectronic
Friday, July 13, 2018
China Money Network
Shanghai-based chip maker ASR Microelectronic has completed a US$100 million series B financing led by IDG Capital and Wanrong Hongtu Fund.

Arbe Robotics Raises $10M in Additional Funding
Wednesday, July 11, 2018
Arbe Robotics, a Tel Aviv, Israel-based company advancing 4D high-resolution imaging radar, raised $10M in additional funding.

Broadcom Reaches Nearly $19 Billion Deal to Buy CA Technologies
Wednesday, July 11, 2018
NY Times
Broadcom has agreed to buy the software maker CA Technologies for nearly $19 billion, according to the two companies. Raises $102M in Follow-on Series A Funding, Brings Round Total to $214M
Wednesday, July 11, 2018
Six months after its Series A announcement of $112M,, a China- and Fremont, Calif.-based autonomous vehicle company, raised a follow-on funding round of $102M in Series A.

Oclaro Stockholders Approve Merger Agreement with Lumentum
Tuesday, July 10, 2018
PR Newswire
Oclaro, Inc. announced that its stockholders approved the merger agreement under which Lumentum Holdings Inc. will acquire Oclaro.

Ferroelectric Memory Company Raises €4.6M Growth Financing
Monday, July 9, 2018
Ferroelectric Memory Company, a Dresden, Germany-based enterprise that commercializes technology for non-volatile memory solutions for microcontrollers, closed a €4.6m growth financing.

Marvell Technology Completes Acquisition of Cavium
Friday, July 6, 2018
Company Release
Marvell Technology Group Ltd. announced the completion of its acquisition of Cavium, Inc.

Adesto Announces Agreement to Acquire Echelon
Friday, June 29, 2018
Company Release
Adesto Technologies, a leading provider of innovative application-specific semiconductors for the IoT era, and Echelon Corporation announced a definitive agreement under which Adesto will acquire Echelon for $8.50 per share.

UMC Acquires 100% Ownership of Mie Fujitsu Semiconductor
Friday, June 29, 2018
Business Wire
Fujitsu Semiconductor Limited and United Microelectronics Corporation, a leading global semiconductor foundry, announced that UMC will acquire all of the shares of Mie Fujitsu Semiconductor Limited (MIFS), a 300mm wafer foundry joint venture between both companies.

China's Voice Recognition Firm AISpeech Raised $76M
Tuesday, June 26, 2018
AISpeech, a Suzhou city-based artificial intelligence startup, announced a $76 million Series D, boosting its total funding to over $121 million.


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