Silicon Summit
Formative technology that is changing our lives
Formative technology that is changing our lives
Opportunities for semiconductor companies have never been as great as they are today.
Just as the IoT is driving the expectancy for ubiquitous connectivity and universal access to data, immersive technology is changing our expectations on how we interact with the physical and virtual worlds.
Please join GSA on April 15, 2015 as we discuss the formative technologies that are enabling these new experiences by enabling our devices to connect, sense, interpret, and influence our decisions and behaviors in a previously unimaginable way.
Interested in attending? Click here to register.
April 15, 2015
Admission to this event is free for GSA members and $50 for non-members.
If you are registering for another person, please log in as the attendee.
For assistance with login, please email loginhelp@gsaglobal.org or call Susan Jackson at 214-306-7074.
GSA is exceptionally grateful for the generous support of our sponsors. Without them, events such as these would not be possible.
Contact Hayley Warmack for sponsorship details.
The Global Semiconductor Alliance (GSA) is the voice of the global semiconductor industry with nearly 400 member companies throughout 32 countries and representing over 75% of the industry revenues. GSA provides a neutral environment for semiconductor executives to meet and collaborate on ways to improve efficiencies and address industry wide topics and concerns. In addition to hosting leading events that are tailored specifically to the semiconductor ecosystem, GSA also offers its members:
To learn more about the benefits of GSA membership, please contact Kate Olsen.
Susan Jackson
s.jackson @gsaglobal.org
972.866.7579 x111
Wade Giles
wgiles @gsaglobal.org
972.866.7579 x116
Hayley Warmack
hwarmack @gsaglobal.org
972.866.7579 x112
Kate Olsen
kolsen @gsaglobal.org
972.866.7579 x113
Rahul Patel is Senior Vice President and General Manager for Broadcom's Wireless Connectivity team. With more than 20 years of technical marketing experience, he is responsible for expanding Broadcom's wireless connectivity leadership in the consumer and enterprise markets. He oversees product management and marketing strategy, business development and applications engineering in key product areas including Wi-Fi, Bluetooth and NFC platforms for smartphones, tablets, PCs, Access Points, Home Gateways, Digital TVs, Automobiles as well as emerging Internet of Things (IoT) sub-segments such as Wearables and Home Appliances. He is also credited with directing Broadcom’s 5G WiFi product strategy and launch. Under his leadership, Broadcom was the first chip vendor to sample 5G WiFi chips across all product segments and emerged as a driving force behind the rapid adoption of 5G WiFi across the consumer electronics ecosystem.
Keith Witek is currently Corporate Vice President for Strategy and Corporate Development at Advanced Micro Devices, Inc. Keith’s current organization manages corporate strategy, new business ventures, corporate strategic alliances, business development, M&A and asset deals, corporate R&D and portfolio management, IP strategy, and AMD Ventures strategic investments. Prior to Keith’s current role, Keith was the Chief of Staff for the President and COO of Advanced Micro Devices (AMD). Keith was formerly an Assistant General Counsel and Director of AMD’s Legal Department serving the CTO’s Office, Innovative Systems Group, Embedded Computing Systems Division, Commercial Group, Consumer Group, Corporate Business Development, and Strategic Software Alliances over time.
Behrooz Abdi, a member of InvenSense's board of directors since June 2011, was appointed President and CEO in October 2012. Most recently, he served as Executive Vice President and General Manager of NetLogic Microsystems, Inc., a leader in intelligent semiconductor solutions for the Internet. Before this, he served as the President and Chief Executive Officer of RMI Corporation (also known as Raza Microelectronics Inc.), a fabless semiconductor company, from November 2007 to October 2009. He served as Senior Vice President and General Manager of CDMA Technologies (QCT) at Qualcomm, Inc., a provider of wireless technology and services, from March 2004 to November 2007. Prior to joining Qualcomm, he held leadership and engineering positions at Motorola, Inc. where he served as Vice President and General Manager for Motorola's radio products division, in charge of RF and mixed-signal ICs for the wireless mobile market. He currently is a director at Tabula, Inc. and Exar Corporation.
Steve was appointed Vice President of Software and Applications for the Microcontroller/Microprocessor business unit at Atmel in May 2013 where he is responsible for the development of embedded software, hardware/software tools and worldwide applications support.
Mr. Tewes came to Avegant from Logitech, where he spent several years as the Vice President and General Manager of the Digital Home Business Group, taking ownership of P&L on $100M of annual revenue and reporting directly to the CEO. Prior to that role he was Vice President and General Manager of Webcams, where he oversaw product marketing and development across domestic and international teams. Before joining Logitech he worked at Pinnacle Systems as VP of Engineering and at Poet Holdings as VP Product Development, where he helped shepherd a team from startup operations through IPO. An engineer by training, Mr. Tewes received his graduate degree in Computer Science from the Technical University of Berlin and is an avid cyclist and runner.
Mats W. Johansson is the Co-Founder, President, and CEO of EON Reality Inc., the world leader in Virtual and Augmented Reality based Knowledge Transfer for industry, education, and edutainment. EON Reality publishes immersive and engaging virtual reality and augmented reality experiences to devices ranging from mobile phones to holographic displays to multi-wall 3D rooms to large interactive immersive domed theaters.James Stansberry is the Senior Vice President and General Manager of Silicon Labs’ Internet of Things (IoT) products, which includes the company’s energy-friendly microcontroller, wireless connectivity, and automotive and consumer receiver portfolios. Previously, he served as Vice President and General Manager of Silicon Labs’ Broadcast products, responsible for the company’s worldwide broadcast audio and video businesses. Under Mr. Stansberry’s leadership in Broadcast, Silicon Labs has become the No. 1 supplier of silicon tuners to the global TV market. Mr. Stansberry joined Silicon Labs in 2009 from Sony Corporation where he served in a variety of management roles in corporate strategy, R&D and semiconductor products. Previously he held business management and engineering positions with Motorola’s semiconductor product sector in several product groups focusing on the computing, consumer and game console markets. Mr. Stansberry holds a bachelor’s of science degree in electrical engineering from the University of Minnesota and a master’s of science degree in electrical engineering from National Technological University in mixed-signal communication ICs.
Dr. Peter Huang is Vice President, TSMC North America. He is responsible for Advanced Technology Support & Marketing. He's served in executive and engineering roles with leading companies such as Broadcom, HP and LSI. He received his doctorate from the University of California, Berkeley.David is a China-based executive skilled in electronics design, supply chain, and factory management. Prior to joining Virtuix, he headed China operations for Energy Recovery Products Inc., a maker of high-efficiency power supplies and technology partner to ON Semiconductor. Other previous positions include head of supply chain at Flextronics in Taiwan and China. David holds a bachelor's degree in systems design engineering from the University of Waterloo.Todd Miller received his M.S. degree from North Carolina State University in Electrical Engineering and has 19 years of industry experience in MEMS, microsystem, semiconductor technology and product development. Mr. Miller was a Senior Member of the Technical Staff and Manager for the MEMS and Microsystem Design and Verification Group for Freescale Semiconductor. He was the technical and program lead for automotive, consumer and technology development programs in MEMS and microsystems. He joined GE Global Research in 2010 and is currently the Microsystems Lab Manager for the Micro and Nano Structures Technology Organization. The Microsystems team works with the Industrial GE Businesses to develop sensors for harsh environment, remote sensing and safety critical applications. The team works with many technologists across GE Global Research to address unique application requirements such as multi-sensor connectivity, low-power consumption, cybersecurity and material science for high reliability. In addition, the Microsystem Lab is a low volume high value MEMS supplier to several GE businesses and is developing solutions for external customers.
Dr. Martin Scott is the general manager of Cryptography Research Division. Martin joined Rambus in 2007 leading the new business efforts and now leads the company's platform development efforts. He is responsible for Rambus’ long-range research and development. Martin joined Rambus from PMC-Sierra where he was most recently vice president and general manager of their Microprocessor Division. Before PMC, Martin was vice president and general manager for I/O Solutions at Agilent Technologies. He started his professional career at HP Labs, holding a variety of management positions at HP including ASIC Business Unit manager.
Gregg Bartlett is senior vice president of the Product Management Group at GLOBALFOUNDRIES. In this role, Bartlett leads the organization responsible for enabling foundry offerings that promote customers' success and profitable growth for GLOBALFOUNDRIES with product technology leadership, a robust ecosystem, services and manufacturing excellence.
Flexibility, quality and competitiveness – DELTA offers solutions at any part of the ASIC development and production process to allow the customer to get the most cost effective combination of services. DELTA’s experienced ASIC design team is specialised in payment systems, RFID, sensor interfaces and optical chips. See more at asic.madebydelta.com.EquipIC supply chain provides turnkey ASIC services including: Design, Wafer Foundry, Test and Assembly, and Production from low to high volume.Flex Logix Technologies provides FPGA cores for SoCs. Our first product is available now in TSMC 28HPM. 
Consensia offers a comprehensive software solution for managing innovation and product development across a chip’s entire lifecycle. The platform is a single source of truth for all aspects of a product’s definition - from requirements to finished goods while promoting collaboration between product engineering, design engineering, operations, and outsourced partners.
Silicon Labs is a leading provider of microcontroller, wireless connectivity, analog and sensor solutions for the Internet of Things (IoT). We solve the electronics industry’s toughest problems, providing customers with significant advantages in performance, energy savings, system cost, time to market and design simplicity. TSMC is the world’s largest dedicated semiconductor foundry, with the foundry segment’s largest portfolio of process-proven libraries, IPs, design tools and reference flows. TSMC’s capacity in 2014 was 8.2 million 12-inch equivalent wafers. TSMC is the first foundry to provide 20nm and 16nm production capabilities. 
Microsemi a leading provider of semiconductor IC and System solutions for communications, defense & security, aerospace and industrial applications. Where performance matters, reliability is vital and security is non-negotiable, customers choose Microsemi. The company is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at www.microsemi.com.Rambus brings invention to market. Our customizable IP cores, architecture licenses, tools, services, and training improve the competitive advantage of our customer's products while accelerating their time-to-market. Rambus products and innovations capture, secure and move data. For more information, visit rambus.com.Optimal+ is a global provider of Manufacturing Intelligence software solutions, enabling any semiconductor company to seamlessly aggregate, organize and act upon the global manufacturing and test data generated across their internal and external supply chains to measurably improve yield, quality and productivity. Deployed in virtually every major foundry and OSAT currently serving the semiconductor ecosystem, Optimal+ processes over 20 billion chips every year on behalf of our customers and is ushering in an era of unprecedented supply chain visibility that translates into strong and measurable ROI. Silvaco provides design automation software for the electronics and semiconductor industries. We develop TCAD and EDA tools for a wide variety of professionals from process engineers to integrated circuit designers. Our tools provide unique features for technologies from advanced CMOS and power devices to TFTs and optoelectronic devices. Silvaco also provides PDK and full custom design flows for major foundry processes.
GLOBALFOUNDRIES is the world’s first full-service semiconductor foundry with a truly global footprint. With operations in Singapore, Germany and the United States, GLOBALFOUNDRIES is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. GLOBALFOUNDRIES is owned by Mubadala Development Company.
UMC is a world leading semiconductor foundry. We enhance customer competitiveness through manufacturing excellence and one of the industry’s most comprehensive technology portfolios, including 28nm High-K/metal gate and a complete IoT-specific process platform. UMC employs over 17,000 people worldwide, with 10 manufacturing facilities and offices in Taiwan, Japan, Korea, China, Singapore, Europe, and the United States.
Alongside a broad portfolio of established technologies, ASE is also delivering innovative advanced packaging and System-in-Package solutions to meet growth momentum across a broad range of end markets. For more about our advances in SiP, WLP, MEMS, Flip Chip, and, 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: www.aseglobal.com
Kilopass is the leader in embedded non-volatile memory (NVM) IP with boundless capacity to scale to advanced CMOS process geometries and portable to every major foundry and IDM. Trusted by today’s best-known brands, Kilopass' technology has been integrated by over 150 customers, with 7 billion units shipped. Visit www.kilopass.com or email info@kilopass.com.MagnaChip is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products. We have one of the broadest and deepest analog and mixed-signal semiconductor technology platforms in the industry with our 30-year operating history. MagnaChip has over 3000 patents in our portfolio and extensive engineering and manufacturing process expertise.
Model N, the leader in Revenue Management solutions, offers integrated application suites for managing global pricing, quoting and contracts, and the channel revenue life cycle. Model N's uniquely integrated approach enables companies to execute pricing strategies effectively, drive sales effectiveness and optimize funnel development. Customers include: Atmel, Microchip, ON Semiconductor, and STMicroelectronics.
SARCINA provides leading U.S. companies with package design and power/signal integrity simulation. In addition, Sarcina offers final test hardware design, program development, and one-stop turnkey service.
We work with the world’s foremost foundries to ensure high quality products. We’ve handled the simplest to the most complex of packages. Our results are self-evident: since its formation, Sarcina’s tapeouts have all been first-time successes.
Silicon Turnkey Solutions (STS) is an industry recognized collaborative partner that integrates design, engineering, manufacturing, test, and qualification. We provide operational expertise to provide leading edge technology and services that enable our semiconductor customers to meet demanding time-to-market pressure, cost, and technical challenges in today's consumer, military and aerospace markets.
Silicon Release Solutions is a focused business group within Teradyne's world-class Global Services Organization. It enables fabless companies of any size to get-to-market and get-to-profit quickly with less risk. With expert support for Integrated Circuit (IC) technology, we provide our customers turnkey solutions for all IC market segments and technologies.
Test Spectrum is a recognized leader in semiconductor test solutions. We deliver the best possible test development solutions, whether you need to outsource an entire project or simply augment your team. Value, Lower Cost-of-Test, Faster Time to Market, Reduced Risk. Commitment to Excellence in Semiconductor Test Solutions through Experience, Execution and Integrity.
Shaping the world with sensor solutions. ams sensor solutions take sensing to the next level by providing a seamless interface between humans and technology. ams develops and manufactures high performance analog semiconductors that solve its customers' most challenging problems with innovative solutions. ams' products are aimed at applications which require extreme precision, accuracy, dynamic range, sensitivity, and ultra-low power consumption. More information about ams can be found at www.ams.com.
MOSIS provides access to fabrication of prototype and volume production quantities of integrated circuits.The company lowers the cost of fabrication by combining designs from many customers onto regularly scheduled multi-project wafer runs (MPWs), significantly decreasing the cost of each design. MOSIS also offers ASIC back-end design and production solutions and single-customer SOC dedicated runs, which can be started at any time.
Alongside a broad portfolio of established technologies, ASE is also delivering innovative advanced packaging and System-in-Package solutions to meet growth momentum across a broad range of end markets. For more about our advances in SiP, WLP, MEMS, Flip Chip, and, 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit www.aseglobal.com.
Integra Technologies, now in its 32nd year, is a full service test and assembly supplier. We supply every post wafer fabrication service need to deliver a finished IC to your end customer including: Test Development, Characterization, Wafer Probe, Packaging, Final Test, FIB, FA and Qualification/Reliability services.
EON Reality, Inc. is the world leader in Virtual Reality based knowledge transfer for industry, education, and edutainment. EON Reality provides state-of-the-art 3D display technology for immersive and stereoscopic viewing on mobile devices, personal VR displays, large format screens, immersive rooms, and large domed theaters. EON's solutions enable organizations to more effectively communicate, collaborate, and accelerate knowledge transfer. Visit EON at www.eonreality.com.
Silicon Catalyst is the industry's first incubator for semiconductor start-ups. Silicon Catalyst addresses the challenges faced by start-ups when going from idea to prototype, along with the industry-wide concern about the lack of fund-worthy start-ups to drive novel innovation and growth. Silicon Catalyst's partners are Synopsys, Keysight, TSMC and imec.
