Munich, Germany
June 10-11, 2026
AI, Physical Intelligence, Quantum: The Race for Relevance
Title Sponsor
Program
Day 1 - Wednesday, June 10
IMEC Workshop: "Building the Silicon Foundation for Europe’s AI Future"
As a side event to the GSA European Executive Forum, IC-Link by imec is organizing a workshop and networking session to foster exchange on practical pathways for developing and manufacturing the next-generation of AI hardware.
Registration & Networking
Networking Lunch
Welcome from GSA
The AI Inflection Point and Europe's Wake-Up Call
Keynote: "Low Power Is the New Superpower - Edge Intelligence as a Catalyst for (European) Innovation"
- Lars Reger / EVP & CTO / NXP Semiconductors
Keynote: "Closing Europe's Innovation Gap: Seizing Europe's Opportunity in the Next Wave of AI"
- Patrick Vandenameele / CEO / imec
Keynote: "Speed, Ambition, Execution: How Disruptors Are Shaping a New Industrial Paradigm"
- Johan Bengtsson / Partner / McKinsey & Company
Networking Break
Panel: "Growth or Bubble: Reading the real signals in AI demand"
- Fabrizio Del Maffeo / CEO & Co-Founder / Axelera
- Fiona Treacy / Managing Director Industrial Automation / Analog Devices
- Ola Tørudbakken / Senior Director of AI Systems / Meta
Q&A and Live Poll Session
Moshe Zalcberg / Managing Partner, Israel / Silicon Catalyst
Closing Europe's Competitiveness and Innovation Gap
Panel: "Advancing European Tech Sovereignty Through Cross-Regional Collaboration"
- David Moore / CEO / Pragmatic Semiconductor
- Jens Kahrweg / SVP & Managing Director, EMEA / Samsung Semiconductor
- Lars Reger / EVP & CTO / NXP Semiconductors
- Pierre Garnier / Managing Partner / Jolt Capital
Networking Break
Panel: "Strategic Autonomy in Silicon: The Promise and Challenges of Chips Act 2.0"
- Andreas Urschitz / Management Board member & Chief Marketing Officer / Infineon Technologies
- Cesc Guim / CEO / OpenChip
- Karin Raj / CTO Europe / Nokia
- Maria Marced / Chair Industry Advisory Group Chips Act 2.0 / European Commission
Closing Keynote: “Trust, Trajectories, and Trade Zones: Rethinking Semiconductor Strategy in a Multi‑Sovereign Context”
- Ole Gerkensmeyer / Chief Strategy Officer / Nexperia
Q&A and Live Poll Session
Moshe Zalcberg / Managing Partner, Israel / Silicon Catalyst
Closing Remarks
Reception
Sponsored by:
VIP Dinner
Sponsored by:
VIP Dinner (at BMW World, separate ticket needs to be purchased)
18:45 Buses to VIP Dinner (to BMW World)
19:15 Welcome drink at VIP Dinner (at BMW World)
19:35 Welcome remarks by sponsor Intel Foundry (at BMW World)
Day 2 - Thursday, June 11
Networking Breakfast

Welcome from GSA
AI in the Physical World
Keynote: “From Automation to Autonomy: Powering Smart, Resilient Industrial Systems”
- Fiona Treacy / Managing Director of Industrial Automation / Analog Devices
Keynote: "From Chip to Cloud: Securing AI Where It Meets Physical Reality"
- Christophe Nicolas / SVP Kudelski Labs / Group CIO Kudelski Group / Kudelski Group
Scaling Silicon for Quantum Computing
Panel: "Quantum Semiconductors – Scaling from Lab to Fab"
- Albert Heuberger / Spokesman & Chairman / Fraunhofer Microelectronics Group & FMD
- Julian van Velzen / CTIO & Head of Capgemini Quantum Lab / Capgemini
- Laurent Guiraud / CEO & Co-Founder / ColibriTD
- Maud Vinet / CEO & Co-Founder / Quobly
Networking Break
AI in Automotive
Keynote: "Same Chips, Different Machines: The Physical AI Synergies Europe Can't Afford to Miss"
- Yu Yang / Principal Lead Analyst – Automotives & Robotics / Yole Group
Keynote: “Autonomous Driving in the Age of Generative AI"
- Martin Kellner / Partner / McKinsey & Company
Keynote: "Gen AI for Hardware Software Integration"
- Georg Doll / CTO Automotive & Mobility / Microsoft
Q&A and Live Poll Session
Moshe Zalcberg / Managing Partner, Israel / Silicon Catalyst
Networking Break
Silicon at the Speed of AI
Keynote: "Beyond the Chip: Power, Connectivity and Packaging as the Real Limits of AI Scale"
- Prashanth Aprameyan / GM Silicon Business Line (Advanced Technologies) / Intel Foundry
Keynote: "Silicon at the Speed of AI: Transforming Design and Manufacturing Timelines"
- Amit Gupta / SVP & GM of AI Strategy and Custom IC Division / Siemens EDA
Panel: "Silicon at the Speed of AI: Transforming Design and Manufacturing Timelines"
- Amit Gupta / SVP & GM of AI Strategy and Custom IC Division / Siemens EDA
- Fabio Gualandris / President, Quality, Manufacturing & Technology / STMicroelectronics
- Prashanth Aprameyan / GM Silicon Business Line (Advanced Technologies) / Intel Foundry
Networking Lunch
Sponsored by: 
GSA Workshop: "Trusted Collaboration in the Age of AI" – with Tracces by Capgemini

This workshop will focus on the practical realities of deploying AI at scale in semiconductor manufacturing, including secure data access, collaboration across partners, and safe operations across fabs, tools, and regions.
Introduction
Smart Manufacturing Perspective
- Giovanni Notarnicola / Partner & Global Semiconductor Lead / Porsche Consulting
Tracces – Secure Data Collaboration
- Theo van Roekel / Managing Director / Tracces by Capgemini
Hyperscaler Perspective
- András Kővári / Head of High-Tech & Manufacturing Benelux / Amazon Web Services (AWS)
Panel Discussion & Workshop Q&A
- András Kővári / Head of High-Tech & Manufacturing Benelux / Amazon Web Services (AWS)
- Giovanni Notarnicola / Partner & Global Semiconductor Lead / Porsche Consulting
Event Ends
Speakers

Albert Heuberger
Spokesman & Chairman
Fraunhofer Microelectronics Group & FMD
Albert Heuberger
Spokesman & Chairman
Fraunhofer Microelectronics Group & FMD
Prof. Albert Heuberger is Spokesman of the Fraunhofer Microelectronics Group, the world’s leading research organization for micro- and nanoelectronic applications and systems, and Chairman of the Steering Committee of the Research Fab Microelectronics Germany (FMD). A communications engineer by training with a background in circuit design, he also holds the position of Director of the Fraunhofer Institute for Integrated Circuits IIS in Erlangen, Germany.
His work focuses on fostering Europe’s microelectronics innovation ecosystem, promoting technology transfer, and enabling scalable solutions for industrial applications. His interests include micro- and nanoelectronics, sensor systems, and digital technologies, with a strong emphasis on advancing Europe’s semiconductor capabilities.

Amit Gupta
SVP & GM of AI Strategy and Custom IC Division
Siemens EDA
Amit Gupta
SVP & GM of AI Strategy and Custom IC Division
Siemens EDA

András Kővári
Head of High‑Tech & Manufacturing Benelux
Amazon Web Services (AWS)
András Kővári
Head of High‑Tech & Manufacturing Benelux
Amazon Web Services (AWS)
In his role at AWS, András Kővári serves customers in the high-tech and manufacturing sectors. His team engages with the region’s companies to accelerate innovation with the power and flexibility of AWS. Startups, Scale-ups and Enterprises in the High Tech and Semiconductor hub of Belgium and The Netherlands are a key focus of co-innovation with his team. Before his current role in the Benelux leadership, he held various field roles serving customers in the Energy and Health technology industries. He holds a MSc in Engineering & Policy Analysis from Delft University of Technology.

Andreas Urschitz
Chief Marketing Officer & Management Board Member
Infineon Technologies
Andreas Urschitz
Chief Marketing Officer & Management Board Member
Infineon Technologies

Carlos Moreira
Chairman & CEO
SEALSQ
Carlos Moreira
Chairman & CEO
SEALSQ
Carlos Moreira is Founder and CEO of SEALSQ, and Founder, Chairman, and CEO of WISeKey International Holding AG. A pioneer at the intersection of cybersecurity, cryptotechnology, blockchain, and AI, he has spent decades building trust infrastructures for the digital economy. A recognized UN Expert on Cybersecurity and Trust Models, he has advised the UN, World Bank, ILO, and WTO, and founded institutions including the Geneva Security Forum and OISTE.org. Carlos has been a World Economic Forum New Champion (2007–2016), WEF Trailblazer, and a founding member of the WEF Global Growth Companies. Named among Switzerland’s 300 most influential figures by Bilan and recognized as Man of the Year by AGEFI, he is also co-author of The TransHuman Code (2019).

Cesc Guim
CEO
OpenChip
Cesc Guim
CEO
OpenChip
Cesc Guim is CEO of Openchip, a Barcelona-based company advancing semiconductor and system design for AI, HPC, and European technology sovereignty. He holds a PhD in Architecture and Computer Science and began his career at the Barcelona Supercomputing Center, publishing over 60 peer-reviewed papers. In 2008, he joined Intel, eventually becoming Chief System Architect in the Network & Edge CTO Office, leading global teams and authoring over 500 patents. His work spans CPU and system architecture, sustainable computing, and next-generation edge platforms, bridging hardware and software to tackle real-world system challenges.

Christophe Nicolas
SVP Kudelski Labs / Group CIO
Kudelski Group
Christophe Nicolas
SVP Kudelski Labs / Group CIO
Kudelski Group
Christophe is Senior Vice President of Kudelski Labs and Group Chief Information Officer at Kudelski Group. With the company since 1996, he has held leadership roles across Nagracard and Nagravision and founded Kudelski Security. As a member of the Management Board, he leads the GTM team for Kudelski Labs — the Group’s innovation arm — overseeing security IP products, security labs, and device lifecycle management solutions. As Group CIO, he shapes the company’s information strategy, drives cloud partnerships, leads enterprise digital transformation, and ensures corporate security. He also oversees the Group’s Corporate Real Estate portfolio. Christophe holds a BSc and Master’s in Computer Science from EPFL Lausanne and an MBA with honors from IMD. He is a member of the IEEE Computer Society.
Keynote: “From Chip to Cloud: Securing AI Where It Meets Physical Reality”
In a world where artificial intelligence is rapidly moving out of the data centre and into the physical world, Europe’s ability to compete will increasingly depend on how safely and confidently AI can be deployed at the edge. In this keynote, Christophe Nicolas, Senior Vice President, Kudelski Labs and Group Chief Information Officer at Kudelski Group, explores the critical role of security in unlocking the next phase of physical and edge AI adoption.
Set against the broader event theme of “Closing the Gap: Semiconductors, AI, and Europe’s Competitive Future”, the session examines how AI is already reshaping industries that combine software, hardware, and real‑world systems, from connected devices and critical infrastructure to media and mobility. While the promise of AI in the physical world is clear, its growth is constrained by fundamental challenges: trust, resilience, data integrity, and protection against increasingly sophisticated threats.
Drawing on hands-on experience at the intersection of cybersecurity, embedded security, edge computing, and AI-driven systems, Christophe will highlight why security must be designed in from silicon to system, not added as an afterthought. He will discuss the limits of today’s approaches, the risks of over‑reliance on cloud-centric models, and what Europe must do differently to build sovereign, trustworthy, and scalable AI ecosystems.
The keynote offers a pragmatic and forward-looking perspective on how securing AI at the edge can become a strategic advantage for Europe, and a foundation for sustainable innovation and competitiveness.

David Moore
CEO
Pragmatic Semiconductor
David Moore
CEO
Pragmatic Semiconductor
Dave has over 25 years semiconductor leadership experience. Most recently, he was Chief Strategy Officer at Micron Technology, Inc where he had group-wide accountability for a range of corporate functions. Prior to Micron, he spent 6 years at Intel in a number of executive leadership roles, including General Manager Programmable Solutions Group, leading the multi-billion-dollar FPGA and Structured ASIC business.
Dave has a BS in Electronic Engineering from University College Dublin and a MS in Electronic Engineering from the Georgia Institute of Technology. He has lived and worked in many countries including Malaysia, Vietnam, Ireland, the US and UK.

Fabian Steiner
VP Semiconductor
MGX
Fabian Steiner
VP Semiconductor
MGX
Fabian Steiner is Vice President of Semiconductors at MGX in Abu Dhabi, where he leads investments across semiconductors, quantum computing, and the broader AI infrastructure landscape. Before MGX, he was an Associate Partner at McKinsey & Company in Munich, advising semiconductor clients alongside automotive OEMs and Tier 1 suppliers. His work focused on embedded software development and the shift toward next-generation electrical/electronic (E/E) architectures. He holds a PhD in electrical engineering from the Technical University of Munich.

Fabio Gualandris
President, Quality, Manufacturing & Technology
STMicroelectronics
Fabio Gualandris
President, Quality, Manufacturing & Technology
STMicroelectronics

Fabrizio Del Maffeo
CEO & Co-Founder
Axelera
Fabrizio Del Maffeo
CEO & Co-Founder
Axelera
Fabrizio Del Maffeo is the CEO and co-founder of Axelera AI, the Netherlands-based startup delivering the world’s most powerful and advanced solutions for AI at the Edge. In his role at Axelera AI, Fabrizio leads a world-class executive team, board of directors and advisors from top AI Fortune 500 companies. In 2025 Fabrizio was named in the Top 25 AI CEOs globally.
Before establishing Axelera AI, Fabrizio Del Maffeo served as Head of AI at the Bitfury Group, a globally recognized emerging technologies company. Prior to joining Bitfury, Fabrizio was Vice President and Managing Director of AAEON Technology Europe, the AI and internet of things (IoT) computing company within the ASUS Group.

Fiona Treacy
Managing Director of Industrial Automation
Analog Devices
Fiona Treacy
Managing Director of Industrial Automation
Analog Devices
Fiona Treacy is Managing Director of the Sustainable Automation Business Unit at Analog Devices, where she leads strategy and execution across next generation industrial automation technologies. With more than 20 years of experience spanning engineering, applications, product marketing, and business leadership, Fiona brings a rare system level perspective to complex automation challenges.
Her expertise spans factory automation, process control, and industrial robotics, with a strong focus on translating advanced technology into scalable, high impact customer solutions. Known for combining deep technical insight with commercial rigor, Fiona has built and led multidisciplinary teams that operate at the intersection of silicon, software, and industrial systems. Fiona holds a BSc in Applied Physics and Electronics and an MBA from the University of Limerick.

Georg Doll
CTO of Automotive & Mobility
Microsoft
Georg Doll
CTO of Automotive & Mobility
Microsoft
Giovanni Notarnicola
Partner & Global Semiconductor Lead
Porsche Consulting
Giovanni Notarnicola
Partner & Global Semiconductor Lead
Porsche Consulting
Giovanni Notarnicola is a Partner at Porsche Consulting and leads the firm’s global Semiconductor Practice. With more than 20 years of professional experience, including a background in electronic engineering and early work at CERN, he supports leading semiconductor companies in driving large-scale transformation programs. He is actively engaged in shaping the semiconductor ecosystem, serving as Chairman of an industry initiative on end-to-end smart manufacturing, and regularly advising C-level executives across the industry. His work sits at the intersection of industrial engineering and strategic transformation, with a particular focus on how European semiconductor manufacturers can build competitive advantage in an industry increasingly shaped by AI and physical automation.

Jens Kahrweg
SVP & Managing Director, EMEA
Samsung Semiconductor
Jens Kahrweg
SVP & Managing Director, EMEA
Samsung Semiconductor

Johan Bengtsson
Partner
McKinsey
Johan Bengtsson
Partner
McKinsey
Johan is a leader in McKinsey’s Advanced Industry and Sustainability Practices, co-leading the firm’s sustainability work in Sweden. Serving automotive and industrial clients across Europe and globally, he focuses on operations improvement, product cost and CAPEX optimization, and large-scale decarbonization programs. His recent work includes integrating decarbonization with cost reduction in major transformation programs, leading cost initiatives for automotive OEMs, and advising on R&D and operations restructuring in the commercial vehicle sector. Johan holds an MA in Strategy and International Management from the University of St. Gallen and a BSc in Accounting and Finance from the Stockholm School of Economics. Outside of work, he enjoys time with his family and a passion for sports, hunting, and outdoor activities.

Julian van Velzen
CTIO & Head of Capgemini Quantum Lab
Capgemini
Julian van Velzen
CTIO & Head of Capgemini Quantum Lab
Capgemini

Karin Raj
CTO Europe
Nokia
Karin Raj
CTO Europe
Nokia
Karin Raj currently serves as the Chief Technology Officer Europe for Nokia.
She has held a variety of senior commercial and technical positions in both Ericsson and Huawei, working across diverse markets such as Asia, Europe, and North America. Karin also has extensive experience from smaller deep-tech companies having served as the CTO of a nanotech start-up, and a high-precision micro-mechanics company, respectively. She holds a Master’s degree in Engineering Physics from the Royal Institute of Technology, Stockholm, and an MBA in International Business from Uppsala University. She also serves as a Director on the Boards of Sivers Semiconductors, a leader in wireless and optical technologies, and Zamin Group, a global ferrometals mining conglomerate.

Lars Reger
CTO & EVP
NXP Semiconductors
Lars Reger
CTO & EVP
NXP Semiconductors
Lars Reger is Executive Vice President and Chief Technology Officer at NXP Semiconductors, where he oversees R&D and new business activities across automotive, IoT, connectivity, and infrastructure markets. He joined NXP in 2008 as Head of Automotive Strategy, was appointed CTO of Automotive in 2012, and assumed the company-wide CTO role in December 2018. Earlier in his career, Lars held engineering, product management, and IP leadership roles at Siemens Semiconductors and Infineon, and led connectivity business development at Continental. He holds a degree in Physics from Rheinische Friedrich-Wilhelms-Universität Bonn and an MBA from London Business School. Lars serves on the German Industry Association’s Committee for Digital Economy, Telecommunications and Media, on the Board of the ITS World Congress, and is a member of the Forbes Technology Council.
Keynote: “Low Power Is the New Superpower – Edge Intelligence as a Catalyst for (European) Innovation”
The world that anticipates and automates is not powered by massive cloud AI, but by billions of trusted, low‑power systems operating at the edge. In this keynote, NXP CTO Lars Reger explains why right‑sized intelligence, designed for efficiency and real‑time decision‑making, is essential for autonomy at scale. He also shows how this shift creates a major opportunity for Europe. It offers a grounded, engineering‑led view of how intelligence at the edge can strengthen Europe’s competitiveness by turning innovation into scalable, real‑world systems.

Laurent Guiraud
CEO & Co-Founder
ColibriTD
Laurent Guiraud
CEO & Co-Founder
ColibriTD
Dr. Laurent Guiraud co-founded ColibriTD in 2019 as a Technical Director (CTO) with the objective of preparing companies for the second quantum revolution by building an R&D pole in quantum algorithmic research. He holds a doctorate in atomic physics obtained in 1996 and has more than 25 years of experience with the world’s largest IT players with a focus in cloud computing and big data. He’s also the winner of the Google Innovation Award.

Malcolm Penn
CEO & Founder
Future Horizons
Malcolm Penn
CEO & Founder
Future Horizons
Malcolm Penn is the founder and CEO of Future Horizons, a leading global semiconductor industry analyst firm established in 1989 with over 260 years of collective industry expertise. Penn brings more than 55 years of semiconductor and electronics experience spanning business development, management, manufacturing, marketing, and design. Before founding Future Horizons, he served as Vice President and Director of European Operations at Gartner Dataquest, where he established the company’s European research operations. Earlier in his career, he was Manager of Component Engineering for ITT Europe and held various operations and marketing positions within the ITT Semiconductor Group. Penn earned an honors degree in Electronics Engineering from London’s Southbank University in 1966, notably funding his education by working as a professional rock and R&B musician.

Marc Canel
Founder
FrontierNeuron.ai
Marc Canel
Founder
FrontierNeuron.ai
Marc Canel possesses extensive experience in the micro-processor industry, where he has been instrumental in driving ecosystems and business development for over 35 years. He is the CEO and Founder of FronterNeuron.ai, a startup company specializing in software platforms for the Edge AI marketplace.
Prior to his current role, he oversaw Sales and Business Development at Ventana Micro Systems, which was acquired by Qualcomm in 2025. Before Ventana Micro Systems, he was Vice President of Business Development at Imagination Technologies, where he was responsible for promoting graphics and compute products. Prior to that role, he was a Vice President at Arm, overseeing the definition and rollout of Security Technologies across the Arm ecosystem.
Before joining Arm, he was Vice President of Product Management at Qualcomm, where he was instrumental in the development and deployment of Qualcomm’s software technologies, providing comprehensive solutions to the mobile ecosystem. Prior to his role at Qualcomm, he held various technical and product management positions at IBM, contributing to the development of data networking products.

Marco Addino
Managing Director & High Tech Lead EMEA
Accenture
Marco Addino
Managing Director & High Tech Lead EMEA
Accenture
Marco Addino is a Managing Director in Accenture’s high tech industry practice leading the company’s semiconductor business in EMEA, and is the client account lead for Italy, Central Europe and Greece, responsible for building and growing strategic relationships in the region. He is experienced in high complexity products engineering, supply chain and operations, large scale digital and technology transformations, organizational design, post-merger integration, and the design and implementation of platform business models.

Maria Marced
Chair Industry Advisory Group Chips Act 2.0
European Commission
Maria Marced
Chair Industry Advisory Group Chips Act 2.0
European Commission
María Marced is a Corporate Director serving on several boards: CEVA, IQE and Sequans Communications. She is also the Chairwoman of the European Commission’s Chips Act 2.0 Industry Advisory Group and of the GSA EMEA Leadership Council.
Dr. Marced was President of TSMC Europe from November 2007 until December 2023, responsible for TSMC Europe strategy and management and for leading the decision of TSMC on the EU fab. She joined Philips Semiconductors in 2003 as SVP and GM of the Connected Multimedia Solutions Business Unit and later as GM of Sales & Marketing during the transformation of Philips to NXP. Previously at Intel where she developed her professional career over 19 years, reaching the top position in the EMEA region as VP and GM. Among many awards, Dr. Marced received the “Global Industry Leader Award 2024”, awarded at the international microelectronics fair ChipEx-2024, and she is a member of the Expert Group of the Strategic Project (PERTE) CHIP in Spain.

Martin Kellner
Partner
McKinsey & Company
Martin Kellner
Partner
McKinsey & Company
Martin is a Partner in McKinsey’s Munich office and a core leader of the McKinsey Center for Future Mobility (MCFM) in Europe, where he leads the autonomous driving and vehicle technology subsector. He advises automotive OEMs, suppliers, investors, and disruptors on strategy and growth, with a focus on autonomous driving and automotive software. His client work spans software-defined vehicle strategies, E/E and software development roadmaps, growth opportunity identification, and over 15 due diligences in the AD and automotive software space. He has also supported more than ten start-ups in developing equity stories and achieving growth. Prior to McKinsey, Martin was a research engineer in autonomous driving at Audi AG. He holds a master’s in mechatronics from TU Munich and a bachelor’s in psychology from LMU Munich.

Maud Vinet
CEO & Co-Founder
Quobly
Maud Vinet
CEO & Co-Founder
Quobly
Maud Vinet is co-founder and CEO of Quobly, a French quantum computing startup based in Grenoble. Before launching Quobly in 2022, she spent over two decades as a research physicist and team leader at CEA-Leti, most recently heading its quantum computing program. With Quobly, she is translating years of CEA and CNRS research into a silicon-based quantum computer — combining France’s world-class research capabilities with its competitive microelectronics manufacturing ecosystem. Her approach places semiconductor technology at the heart of the quantum scaling challenge, a rare convergence of deep physics expertise and industrial know-how. Maud has co-authored over 300 papers, filed more than 70 patents, and in 2020 was awarded the honorary title of Knight of the Legion of Honor.

Moshe Zalcberg
Managing Partner, Israel
Silicon Catalyst
Moshe Zalcberg
Managing Partner, Israel
Silicon Catalyst
Moshe Zalcberg is Managing Partner Israel at Silicon Catalyst, the world’s leading semiconductor-focused accelerator, and Chairman of Veriest Solutions, an international chip design services company with over 150 engineers, which he led as CEO for 11 years. A frequent speaker at industry conferences, he brings more than 30 years of experience in the semiconductor and design automation industries. He also authors Advanced Notes, a Substack newsletter on technology, business, and innovation. Previously, Moshe spent over 12 years at Cadence Design Systems in roles including General Manager Israel and European Director of Professional Services, before joining Presto Engineering as GM Israel and VP of Business Development. He holds a BSc in Electrical Engineering from the Technion – Israel Institute of Technology, and an MSc in Electronics and an MBA from Tel Aviv University.

Ola Tørudbakken
Senior Director of AI Systems
Meta
Ola Tørudbakken
Senior Director of AI Systems
Meta
Ola is an engineer and entrepreneur with over 30 years of experience building distributed systems processors and networking chips. Ola currently serves as Senior Director of AI Systems at Meta.. Previously Ola was SVP Systems at Graphcore, driving their 2nd generation AI systems. Ola came to Graphcore through the acquisition of Skala Technologies, an AI startup he co-founded. Prior to Skala, Ola worked as CTO of the Netra group at Oracle and Sun Microsystems. Ola served as Distinguished Engineer, amongst many things responsible for the famous 3456-port Magnum Infiniband Switch now on display in the Computer Museum, Silicon Valley. Prior to Sun Ola was at Dolphin ICS, acquired by Sun Microsystems in 2000. Ola started his career as a research scientist at SINTEF, a Norwegian industrial research organization.
Ola is a recognized industry expert, holds over 48 patents, has published several papers in leading publications, and participated in numerous standardization bodies. Ola holds an MSc degree in Computer Science from University of Oslo in 1994.

Ole Gerkensmeyer
Chief Strategy Officer
Nexperia
Ole Gerkensmeyer
Chief Strategy Officer
Nexperia

Patrick Vandenameele
CEO
imec
Patrick Vandenameele
CEO
imec
Patrick Vandenameele was appointed imec CEO, effective April 1, 2026. Patrick joined imec in 1996 as a researcher in wireless communication after earning his PhD in electrical engineering from KU Leuven. He went on to build a stellar international career as a deeptech entrepreneur, returning in 2017 to further strengthen imec’s venturing activities. As a result of acquisitions, he spent in total ten years in senior leadership teams of semiconductor companies such as Qorvo and Hisilicon/Huawei. Since 2021, Patrick has been instrumental in shaping imec’s R&D strategy, most recently in his role as EVP and Co-COO, preparing him to lead imec into its next chapter.

Pierre Garnier
Managing Partner
Jolt Capital
Pierre Garnier
Managing Partner
Jolt Capital
Pierre Garnier brings over 30 years of operational and C-suite experience across semiconductors, hardware, software, and cybersecurity, spanning large corporates and scale-ups alike. Before joining Jolt Capital, he served as President of e2v-semiconductor, where he drove 15% growth ahead of its 2017 acquisition by Teledyne. Previously, as COO of Inside Secure, he transformed the company from a semiconductor player into an embedded software security leader. His earlier career includes senior roles at Texas Instruments, Everbee Networks, and Alcatel Microelectronics. Pierre holds an Engineering degree from Supélec and a Master’s in Solid State Physics from Pierre and Marie Curie University. He currently sits on the boards of Interel, MicroOled, Dolphin Semiconductor, and P2i, and led the exit of UnitySC to Merck.

Prashanth Aprameyan
GM Silicon Business Line (Advanced Technologies)
Intel Foundry
Prashanth Aprameyan
GM Silicon Business Line (Advanced Technologies)
Intel Foundry

Tanjeff Schadt
Partner
Strategy&
Tanjeff Schadt
Partner
Strategy&

Theo van Roekel
Managing Director
Tracces by Capgemini
Theo van Roekel
Managing Director
Tracces by Capgemini
Theo van Roekel is Managing Director for Tracces, where he is driving market adoption of the secure remote connectivity platform in the semiconductor industry. With deep experience across the semiconductor ecosystem, he focuses on enabling trusted, scalable collaboration between fabs and equipment suppliers by moving the industry beyond traditional access toward controlled, auditable, and compliance‑ready connectivity.

Yu Yang
Principal Lead Analyst – Automotives & Robotics
Yole Group
Yu Yang
Principal Lead Analyst – Automotives & Robotics
Yole Group
Sponsors
Title Sponsor
Title Sponsor
NXP Semiconductors N.V. (NASDAQ: NXPI) is the trusted partner for innovative solutions in the automotive, industrial & IoT, mobile, and communications infrastructure markets. NXP’s “Brighter Together” approach combines leading-edge technology with pioneering people to develop system solutions that make the connected world better, safer, and more secure. The company has operations in more than 30 countries and posted revenue of $12.27 billion in 2025. Find out more at www.nxp.com.
VIP Dinner Sponsor
VIP Dinner Sponsor
Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and advanced packaging technology leadership. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of industry-leading technology, a rich IP portfolio, a world-class design ecosystem, in-house acceleration services and an operationally resilient global manufacturing supply chain.
VIP Reception Sponsor
VIP Reception Sponsor
Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The Company had around 57,000 employees worldwide (end of September 2025) and generated revenue of about €14.7 billion in the 2025 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).
Lanyard Sponsor
Lanyard Sponsor
ASE, Inc. is the leading global provider of semiconductor manufacturing services in packaging and test. With strong leadership in heterogeneous integration, manufacturing efficiencies, and sustainability approaches, packaging innovation is at the heart of what ASE does. Today, ASE’s advanced packaging, system-in-package, and chiplet solutions are accelerating growth momentum across AI, HPC, Data Center, Automotive, IoT, 5G, and more. To learn about our VIPack™ and powerSiP™ platforms, please visit aseglobal.com or follow us on LinkedIn and X: @aseglobal.
Networking Lunch Sponsor
Networking Lunch Sponsor
TSMC created the semiconductor Dedicated IC Foundry business model when it was founded in 1987. In 2024, TSMC served 522 customers and manufactured 11,878 products for various applications covering a variety of end markets including high performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. Annual capacity of the manufacturing facilities managed by TSMC and its subsidiaries is approximately 17 million 12-inch equivalent wafers in 2024.
Event App Sponsor
Event App Sponsor
Siemens EDA is a leader in the Electronic Design Automation industry and is a pioneer and leader in offering customers industry proven AI-powered solutions. Siemens EDA offers the industry’s broadest portfolio of software and hardware that electronics engineers use to design, verify, and manufacture the integrated circuits (ICs), advanced IC packages, and printed-circuit-board systems at the heart of digitalization. For more information on Siemens EDA products and services, visit siemens.com/eda or follow us on Youtube, LinkedIn, X, and Facebook.
Badge Sponsor
Badge Sponsor
At ST, we are creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. As an integrated device manufacturer, we work with our customers and partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things.
Notepads & Pens Sponsor
Notepads & Pens Sponsor
SEALSQ Corp (NASDAQ: LAES) is a semiconductor and cybersecurity company specializing in quantum-resistant secure microcontrollers, post-quantum cryptography (PQC) chips, custom secure ASICs, and PKI-based trust services. It develops hardware roots of trust, secure RISC-V platforms, and end-to-end solutions to protect IoT, automotive, industrial, and connected devices from current and future quantum threats.
SEALSQ has engaged in building a vertical quantum security stack: a fully integrated platform covering hardware, cryptography, digital identity, and communications to deliver complete, chip-to-cloud protection.
Booklet Sponsor
Booklet Sponsor
Global semiconductor leader ADI bridges physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers.
Charging Station Sponsor
Charging Station Sponsor
Synopsys delivers the most trusted and comprehensive engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We partner closely with our customers to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. Companies trust Synopsys to pioneer new technologies that help them get to market faster without compromise.
Networking Breakfast Sponsor
Networking Breakfast Sponsor
Baya Systems accelerates intelligent compute with software-driven, scalable, chiplet-ready Fabric IP, Network-on-Chip (NoC), and system architecture solutions optimized for efficient data movement. Supporting coherent, non-coherent, and custom protocols, its data-driven software platform enables rapid architecture exploration, workload-driven optimization, and physically aware fabric tiling to reduce risk and accelerate time-to-market. Baya’s NeuraScale™ technology is the industry’s first composable crossbar enhancement solution for high-radix scale-up switching, enabling efficient AI infrastructure scaling. Backed by leading investors including Synopsys and Intel Capital.
Platinum Sponsor
Platinum Sponsor
Accenture is a leading global professional services company that helps the world’s businesses, governments and organizations build their digital core, optimize their operations, accelerate revenue growth, and enhance citizen services—creating tangible value at speed and scale. We are a talent and innovation led company with 742,000 people serving clients in 120 countries. We measure our success by the 360° value we create for our clients, our shareholders, partners, and communities. Visit us at www.accenture.com.
Platinum Sponsor
Platinum Sponsor
Kudelski Labs leverages the Kudelski Group’s decades of experience in intelligent security to solve the world’s most complex cyberthreat challenges at the intersection of connectivity and safety. Its mission is to secure the frontier of innovation across land, air, space and industry, through advanced research, real-world engineering, and global partnerships. Kudelski Labs helps semiconductors and device manufacturers design new devices to ensure they are secure by design and quantum-resilient, accelerating time-to-market with pre-validated security components.
Workshop Sponsor
Workshop Sponsor
Tracces by Capgemini provides secure, high‑performance remote connectivity for the semiconductor industry. Built for OEMs and fabs, it enables trusted access to equipment data to improve uptime, accelerate innovation, and reduce time to yield—supporting resilient, scalable global operations.
Workshop Sponsor
Workshop Sponsor
IC-Link by imec provides customized solutions for innovative chip manufacturing, leveraging the expertise and ecosystem of imec, a world-leading center for nanoelectronics and digital technologies. IC-Link enables the scalable and reliable manufacturing of semiconductors to go from idea to product. Technologies range from ASICs in CMOS, including the most advanced commercially available nodes, to imec-developed integrated photonics, advanced 2.5/3D packaging, and custom wafer processing. The offering will continue to expand as new technologies are validated.
Gold Sponsor
Gold Sponsor
Samsung Semiconductor Europe is a part of the global network of Samsung Electronics Co., Ltd. for providing component solutions, featuring industry-leading technologies in the areas of memory, system LSI, foundry, LED and display in Europe, the Middle East and Africa.
Gold Sponsor
Gold Sponsor
Pragmatic Semiconductor is a global semiconductor company pioneering flexible integrated circuit technology, manufactured sustainably at speed and scale. With advanced manufacturing facilities in the United Kingdom, Pragmatic serves the consumer, industrial and healthcare sectors, empowering innovators with design miniaturisation and delivering intelligence at edge and item-level.
Gold Sponsor
Gold Sponsor
Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in engineering design. Our solutions, based on Cadence’s Intelligent System Design strategy, are essential for the world’s leading semiconductor and systems companies to build their next-generation products: www.cadence.com.
Gold Sponsor
Gold Sponsor
Advantest is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, high-performance computing (HPC) including artificial intelligence (AI) and machine learning, and more.
Gold Sponsor
Gold Sponsor
As a leading global semiconductor foundry company, UMC provides high-quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. The comprehensive IC processing technologies and manufacturing solutions offered include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile Memory, RFSOI, and BCD, among others. With a total of 12 fabs in production, UMC has a combined capacity of more than 400,000 wafers per month (12-inch equivalent), all certified with the IATF-16949 automotive quality standard.
Bronze Sponsor
Bronze Sponsor
BitifEye Digital Test Solutions GmbH, headquartered in Germany, is a market leader in physical-layer receiver testing for high-speed digital interfaces. The company offers test automation software, hardware, and services for standards including PCIe, USB, HDMI, DisplayPort, MIPI, and Automotive Ethernet, serving semiconductor, consumer electronics, and independent test laboratories worldwide.
Exhibitors
Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and advanced packaging technology leadership. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of industry-leading technology, a rich IP portfolio, a world-class design ecosystem, in-house acceleration services and an operationally resilient global manufacturing supply chain.
We are Germany’s largest independent engineering turn-key service provider with a cutting-edge focus on the development and design of ASICs, SoCs, FPGAs, embedded software and complex systems. We have thorough internal knowledge around all aspects of custom SoC design from the idea through the architecture phase towards tape-out and post-silicon bring-up.
GS Microelectronics U.S., Inc. (GSME) is a global leader in end-to-end semiconductor solutions, specializing in high-performance RF, analog, digital design, and manufacturing services. Headquartered in San Jose, GSME enables customer products to market faster. The capabilities span from initial design, technology incubation to advanced packaging (2.5D/3D & CoWoS) and full turnkey manufacturing.
Kudelski Labs leverages the Kudelski Group’s decades of experience in intelligent security to solve the world’s most complex cyberthreat challenges at the intersection of connectivity and safety. Its mission is to secure the frontier of innovation across land, air, space and industry, through advanced research, real-world engineering, and global partnerships. Kudelski Labs helps semiconductors and device manufacturers design new devices to ensure they are secure by design and quantum-resilient, accelerating time-to-market with pre-validated security components.
Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The Company had around 57,000 employees worldwide (end of September 2025) and generated revenue of about €14.7 billion in the 2025 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).
Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and advanced packaging technology leadership. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of industry-leading technology, a rich IP portfolio, a world-class design ecosystem, in-house acceleration services and an operationally resilient global manufacturing supply chain.
SEALSQ Corp (NASDAQ: LAES) is a semiconductor and cybersecurity company specializing in quantum-resistant secure microcontrollers, post-quantum cryptography (PQC) chips, custom secure ASICs, and PKI-based trust services. It develops hardware roots of trust, secure RISC-V platforms, and end-to-end solutions to protect IoT, automotive, industrial, and connected devices from current and future quantum threats.
SEALSQ has engaged in building a vertical quantum security stack: a fully integrated platform covering hardware, cryptography, digital identity, and communications to deliver complete, chip-to-cloud protection.
SiFive is transforming the future of compute by bringing the limitless potential of RISC-V to the highest performance and most data-intensive applications in the world. SiFive’s unrivaled compute platforms enable leading technology companies to innovate, optimize and deliver the most advanced solutions of tomorrow for artificial intelligence, automotive, data center, mobile, and consumer.
Siemens EDA is a leader in the Electronic Design Automation industry and is a pioneer and leader in offering customers industry proven AI-powered solutions. Siemens EDA offers the industry’s broadest portfolio of software and hardware that electronics engineers use to design, verify, and manufacture the integrated circuits (ICs), advanced IC packages, and printed-circuit-board systems at the heart of digitalization. For more information on Siemens EDA products and services, visit siemens.com/eda or follow us on Youtube, LinkedIn, X, and Facebook.
Tracces by Capgemini provides secure, high‑performance remote connectivity for the semiconductor industry. Built for OEMs and fabs, it enables trusted access to equipment data to improve uptime, accelerate innovation, and reduce time to yield—supporting resilient, scalable global operations.
TSMC created the semiconductor Dedicated IC Foundry business model when it was founded in 1987. In 2024, TSMC served 522 customers and manufactured 11,878 products for various applications covering a variety of end markets including high performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. Annual capacity of the manufacturing facilities managed by TSMC and its subsidiaries is approximately 17 million 12-inch equivalent wafers in 2024.
Weebit Nano, incorporated in 2015, develops and licenses advanced semiconductor memory technology. The company’s ground-breaking Weebit ReRAM delivers significant advantages for SoC designs. This non-volatile memory provides higher performance, scalability, lower power, and lower cost for applications such as AI inference, automotive, industrial, analog and power ICs, and secure devices.
Pricing
Dinner tickets are available exclusively with conference tickets. If you’ve already registered for the conference and would like to add a dinner ticket, please contact us at events@gsaglobal.org.
Conference-only ticket
Member
€550 + VAT
Guests
€1100 + VAT
VIP Dinner ticket not included.
Conference + VIP Dinner Ticket
Member
€690 + VAT
Guests
€1290 + VAT
VIP Dinner will take place on the evening of June 10 at BMW World.
Exhibitor Ticket
Member
€4490 + VAT
Guests
€7490 + VAT
2 conference tickets included
VIP Dinner ticket not included.
To learn more about sponsoring or exhibiting, click the button below for availability.
Venue

Sofitel Munich Bayerpost
Bayerstraße 12
Munich, Germany
Other hotels within walking distance:
- ArtHotel Munich (300m from Sofitel)
- Le Méridien Munich (170m from Sofitel)
- Aloft Munich (140m from Sofitel)
- marc München (350m from Sofitel)
- 25hours Hotel The Royal Bavarian (300m from Sofitel)