Bill Brennan

President and CEO

Credo

For more than 25 years, Bill Brennan has been leading and scaling organizations to deliver steady revenue growth and profit. Bill joined Credo in 2013, leading the company to its IPO in January 2022. He has overseen Credo’s growth from a small startup to an organization of more than 500 employees worldwide. Under his stewardship, the company has pioneered revolutionary networking technologies based on Credo’s high-performance, low-power SerDes technology, including Active Electrical Cables (AECs) and Linear Receive Optics (LRO). Bill also supports numerous national and regional nonprofit organizations focused on health, education, and children’s causes.

Before joining Credo, Bill served as Vice President of the Storage Business Unit with Marvell Semiconductor for 11 years. Prior to Marvell, he held sales management positions with NEC and Texas Instruments. Bill received his BSEE degree from the University of Colorado.

Handel Jones

Founder and CEO

International Business Strategies (IBS)

Dr. Jones has over 50 years of experience in the electronics industry. He held senior management positions at ITT and other companies. At Rockwell, he was VP of Strategic Planning, Acquisitions, International Marketing, and Engineering of the Commercial Electronics Group. As VP of Engineering at Rockwell, Dr. Jones had over 1,500 engineers reporting to him, covering communications, avionics, and semiconductors. Dr. Jones was also the President and COO of a publicly traded semiconductor company. He steered the company through a successful public offering and a key acquisition.

Dr. Jones has written various books on China, including When AI Rules the World, Artificial Intelligence: How AI and IA Reshape the Future, China’s Globalization (How China Becomes No. 1), and Chinamerica (McGraw-Hill).

Hongyu Wang

Regional President Asia-Pacific , Regional President

Bosch Sensortec GmbH, Bosch Semiconductors China

Mr. Hongyu Wang is Bosch Sensortec Regional President Asia-Pacific and Bosch Semiconductor Regional President China. With nearly 18 years of experience in the sensor and semiconductor industry, he joined Bosch in

2006 and has since held various roles across multiple divisions and regions.

Mr. Wang began his career at Bosch Corporate Research in Stuttgart, focusing on hardware and algorithm development

for sensor-related digital signal processing. In 2009, he moved to Bosch Automotive Electronics (Suzhou) as the Manager

of Electronic System Development, and in 2010, joined Bosch Sensortec (Shanghai) as an ASIC Project Manager and

Department Head. He later transitioned to BSH Home Appliances (Nanjing) in 2018, overseeing electronic systems and

software development, and was appointed Head of the Global Electronics and Motor Division (Greater China) in late 2019.

He holds a Bachelor’s degree in Electrical Engineering from Zhejiang University and a Master’s degree in Electrical

Information Technology from the University of Stuttgart.

Luca Verre

CEO

Prophesee

Luca Verre is the co-founder and CEO of Prophesee, with extensive international management experience and a background in the automotive and electronics industries. Luca was responsible for project and product management, marketing, and business development at Schneider Electric. Before joining Schneider Electric, he also worked as an engineer at Toyota Motor Corporation and Altis Semiconductor Company, and as a photonics research assistant at Imperial College London.

In addition to his rich work experience, Luca also has a highly professional academic background and a wealth of knowledge. He holds dual master’s degrees in physics, electronics, and industrial engineering from Politecnico di Milano and Ecole Centrale de Paris, as well as a master’s degree in business administration from the European Business School. Due to his visionary leadership and long-term positive influence on the world economic market, Luca is a technology pioneer at the World Economic Forum.

Remi El-Ouazzane

President, Microcontrollers, Digital ICs and RF products Group

STMicroelectronics

Remi El-Ouazzane is STMicroelectronics’ President, Microcontrollers, Digital ICs and RF products Group and has held this position since February 2024. He is also functionally responsible for the corporate System Research and Applications organization and is a member of ST’s Executive Committee.

El-Ouazzane started his career at Texas Instruments in 1997. He rose through the ranks across the broadband, mobile, and embedded processing divisions to become Vice President and General Manager of the Open Multimedia Applications Platform (OMAP) in 2009. El-Ouazzane was appointed CEO of Movidius in 2013, responsible for driving its vision-processing technologies to advance the adoption of AI in the Internet of Things. With the acquisition of Movidius by Intel in 2016, he joined Intel’s New Technology Group as Vice President and General Manager, and became Chief Operating Officer of Intel’s Artificial Intelligence Products Group in 2018. In 2020, El-Ouazzane became Intel’s Datacenter Platform Group Chief Strategy Officer, driving strategic initiatives in the data center and cloud markets.

In 2009, El-Ouazzane was honored with the French-American Foundation’s Young Leaders Award.

Remi El-Ouazzane was born in Neuilly-sur-Seine, France in 1973 and graduated from the Grenoble Institute of Technology (INPG) in 1996 and the Grenoble Institute of Political Studies in 1997. He graduated from the General Management Program at Harvard Business School in 2004.

Wayne Dai

Chairman, President and CEO

VeriSilicon

Dr. Wayne Dai founded VeriSilicon in August 2001 and has served as the chairman of the board of directors, President and Chief Executive Officer since then. Prior to founding VeriSilicon, Dr. Dai was the Co-Chairman and Chief Technology Officer of Celestry Technologies, Inc., an EDA company, which was acquired by Cadence Design Systems in 2002. Prior to that, he was the founder, chairman of the board of directors, and Chief Executive Officer of Ultima Interconnect Technology, Inc., one of the predecessor companies to Celestry.

Dr. Dai was the founding Chairman of the IEEE Multi-Chip Module Conference and IEEE Symposium on IC/Package Design Integration, Co-Chairman of the Program Committee of the 2010 International Green Energy Forum. He was an Associate Editor of IEEE Transactions on Circuits and Systems and an Associate Editor of IEEE Transactions on VLSI Systems. He has published more than 100 papers in technical journals and conferences and received the NSF Presidential Young Investigator Award from the President of United States in 1990. He was recognized as top ten venture-backed entrepreneurs and top ten talents of science and technology in China in 2005. He was honored with The Ernst & Young Entrepreneur of the Year in China in 2007. He won the ACE’s Executive of the Year award in 2013, the Hurun Industry Achievement Award in 2014, the APAC Innovator of the year of WEAA in 2018, and was recognized as a “Leading Pioneer” in 2018 by Shanghai Smart City Construction, 2019 Contributor of the year and 2021 Outstanding Contributor of Industry Progress of WEAA, the 2021 Sci-Tech Innovation Golden Horse Awards Outstanding Leader award, 2023 Annual Outstanding Person of China IC Industry, and High Tech Contributor of the Year of 2023 Compass Tech Award. He is currently the Vice Chairman of Global Innovation Center, the Executive Vice President of the International Union for Science and Technology Innovation, the Vice President of the China Semiconductor Industry Association IC Design Branch, the President of the China RISC-V Industry Consortium, the Vice President and the Expert Committee Member of the Automotive Electronics Industry Alliance, the President of the Shanghai Open Processor Innovation Center, the Vice President of Shanghai Integrated Circuit Industry Association, the Vice Chairman of the Expert Committee of the Shanghai IC Industry Cluster Development Promotion Institution, and the President of Berkeley Club of Shanghai.

Dr. Dai received his B.A. degree in Computer Science and his Ph.D. degree in Electrical Engineering from the University of California at Berkeley. He was a professor in the department of Computer Engineering at the University of California at Santa Cruz.

Wilson Ni

General Manager & Chief Revenue Office, Elektrobit China

Elektrobit

Wilson Ni is CRO & GM for region China at Elektrobit, an award-winning and visionary global vendor of embedded and connected software products and services for the automotive industry.
Prior to that, Wilson served over 14 years at Continental as head of segment APAC for body electronics covering China/Japan/Korea and South East Asia markets.
Wilson studied in Shanghai Jiaotong University from 2000-2004 with a bechlor degree major in automotive engineering.

Yu Yang, PhD

Principal Analyst, Automotive Semiconductors

Yole Group

Yu Yang, PhD is Principal Analyst, responsible for Automotive Semiconductors at Yole Group.

Based in Belgium, he is engaged in the development of technology and market products, especially automotive industry. Yu is deeply engaged in coordinating all studies and activities within the automotive industry.

Yu Yang has authored numerous analyses for Yole Group, including Automotive Powertrain and Electrification 2025, Vol. 1, Automotive 48V Powernet, Power Electronics for xEV, and Semiconductor Trends in Automotive, among others.

He actively participates in international automotive trade shows and conferences, where he regularly presents Yole Group’s insights and vision on the evolving dynamics of the automotive sector.

Prior to Yole Group, Yu worked as a business development partner and R&D project leader at Punch Powertrain N.V. (Belgium), R&D project manager at Bekaert N.V. (Belgium), and doctorate researcher at IMEC (Belgium).

Yu Yang holds a PhD in materials engineering from Leuven University (Katholieke Universiteit Leuven) in Belgium and a master’s in electrical engineering from Tsinghua University (China).