AN INNOVATION AND COLLABORATION PLATFORM

WELCOME TO GSA AUTOMOTIVE

GSA Automotive is a neutral, global collaboration platform where automotive ecosystem executives and experts meet with peers, partners, suppliers, and customers to address common industry challenges together

  • Collaboration takes place both during dedicated events and through intelligently moderated working groups on carefully chosen topics.

  • Working groups take place in all geographies: Europe, North America and Asia Pacific.

  • We produce and collect high-quality articles, reports and other resources that we share with GSA Automotive active members.

  • Invited members are selected semiconductor ecosystem companies, automotive OEMs, Tier 1 and Tier 2 automotive suppliers, software companies and selected organizations with a vested interest in the growth and success of the automotive industry.

CURRENT AUTOMOTIVE INTEREST GROUP TOPIC

FUTURE OF AUTOMOTIVE COMPUTING: CLOUD VS. EDGE

As part of this GSA Automotive Interest Group and again in collaboration with McKinsey & Company, we are currently working on analyzing the Future of Automotive Computing: Cloud vs. Edge.

With the rise of connected cars and increasing demand for compute and processing power in vehicles, OEMs start to experiment with hybrid applications running in the vehicle and on a cloud backend. The question if cloud backends can bear part of the processing power of vehicles in the mid-to-long-term will have significant impact on the electronics content of vehicles. We will look into assessing which type of operations could be run hybrid vs. fully on edge vs. on cloud, including intermediary concepts, e.g. local processing in 4G/5G towers to optimize latency. We will also look at the critical security aspects involved in any of these architectures.

To be updated and get involved with this new exciting project, please click here to sign up for free.

EVENTS

View All Auto Events and Workshops

MOST RECENT RESOURCES

June 2022 Workshop – State of the Automotive Semiconductor Value Chain & Future of Automotive Computing: Cloud vs. Edge – Project Results

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April 2022 Workshop – State of the Automotive Semiconductor Value Chain & Future of Automotive Computing: Cloud vs. Edge

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Semiconductors in the Autonomous Age

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View all Resources

DEFINING THE FUTURE OF AUTOMOTIVE

GSA AUTOMOTIVE PARTICIPANTS

  • 3M

  • Accenture

  • Adapdix

  • Advanced Micro Devices, Inc. (AMD)

  • Advantest

  • Aeva, Inc.
  • AGCO

  • Agile Analog

  • Airbus S.A.S.

  • Aitos.io

  • Almotive

  • Alliance Innovation Lab Tel Aviv

  • Amazon.com Inc.
  • Amazon Web Services

  • Ambarella, Inc.

  • Ambiq

  • ams-OSRAM AG

  • Analog Devices, Inc. (ADI)

  • Angoka Ltd

  • ANSYS

  • Applied Materials, Inc.

  • Arbe Robotics

  • Ardentec Corporation

  • Argus Cyber Security

  • ARM, Inc.

  • Armstrong Material Solutions, LLC

  • ASE Group (Advanced Semiconductor Engineering, Inc.)

  • Ateris, Inc.

  • ATLANT Holding IVS

  • AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

  • ATREG, Inc.

  • ATS Engineering Ltd

  • Attopsemi Technology Co., Ltd.

  • Audi AG

  • AutoTalks Ltd.

  • Baidu, Inc.

  • Bank of America Securities

  • Baraja

  • BedRock Systems Inc.

  • Beijing Starblaze Technology Co., Ltd

  • Berkeley Analog, Inc.

  • BitifEye Digital Test Solutions

  • BizLink International Corporation

  • Black Sesame Technologies

  • Blueshift Memory

  • BMW (Bayerische Motoren Werke AG)

  • BNB Markets

  • Bosch Sensortec GmbH

  • Bose Corporation

  • BrainChip Corp

  • Brier & Thorn

  • Brightsight

  • Broadcom Limited

  • Brodmann17

  • Bruckewell Technology Ltd.

  • Cadence Design Systems

  • Calibra

  • California State University Monterey Bay

  • Calsonic Kansei Corporation

  • Canadian Trade Office In Taipei Bureau Commercial Du Canada A Taipei

  • Canova Tech Srl

  • Canyon Bridge Capital Partners Inc.

  • Capital-E

  • CARIAD SE

  • Car.SW Org

  • CEA-Leti (Leti)

  • Celential.ai

  • CEVA, Inc.

  • Chalmers University of Technology

  • Chipus Microelectronics

  • Chinese American Semiconductor Professional Association (CASPA)

  • Cisco Systems Inc.

  • Classroom Aid, Inc.

  • CMC Microsystems

  • CoAsia SEMI Ltd.

  • Codasip Ltd.

  • Cognizant Technology Solutions Corporation (Cognizant)

  • Cohu, Inc.

  • Continental AG

  • CoreNetiX GmbH

  • Credit Suisse Group AG

  • CriticalBlue

  • Cyber Together

  • Cycuity

  • Cymotive Technologies

  • Crypta Labs Ltd.

  • Crypto Quantique

  • D3 Semiconductor

  • Dassault Systemes SE

  • Data I/O Corporation

  • DecaWave Ltd. (Aquired by Qorvo)

  • DeepMap, Inc.

  • Dekra Digital

  • Dell Technologies

  • Deloitte LLP

  • DENSO CORPORATION

  • Deutsche Telekom AG

  • Dialog Semiconductor

  • DigiLens, Inc.

  • DinoPlusAI

  • Disentra

  • Dosilicon Co,.Ltd

  • Drako Motors

  • Dräxlmaier Group

  • DSP Group, Inc.

  • dSPACE GmbH

  • Dust Photonics, Inc.

  • Efficient Power Conversion Corporation (EPC)

  • Egon Zehnder International

  • EKWB d.o.o.

  • EInfochips

  • ELMOS Semiconductor AG

  • Embedded PR

  • eMemory Technology Inc. (EMTC)

  • Encore Semi Inc.

  • Enigmatos

  • Ensilica plc

  • Entegris, Inc.

  • Epistar Corporation

  • EqualOcean

  • EYs3D Microelectronics, Co.

  • Faraday Technology Corporation

  • Fastree3D SA

  • Ferrari

  • Finnegan

  • Fisker Inc

  • Five AI Inc.

  • Flex Ltd

  • Floadia Corporation

  • Ford Motor Company

  • Fraunhofer Institute for Integrated Circuits IIS

  • Fraunhofer IZM

  • FutureBridge

  • Garmin

  • GEO Semiconductor Inc. (GEO)

  • GigaDevice Semiconductor (Beijing) Inc.

  • Global Unichip Corporation

  • GLOBALFOUNDRIES

  • Google Inc.

  • GrAI Matter Labs

  • Granite River Labs Inc.

  • Green Hills Software

  • Greenhill & Co., LLC

  • Groupe Renault

  • GuardKnox

  • Hailo

  • HDL Design House

  • HeJian Technology (Suzhou) Co., Ltd. (HJTC)

  • Hitachi ABB Power Grids

  • Hoppe Executive Search

  • Horizon Robotics

  • Huawei Technologies Co., Ltd.

  • Hyperstone GmbH

  • Hyundai Mobis

  • Hyundai Motor group

  • IBM

  • ICsense NV

  • IC Manage, Inc.

  • ICTK Holdings Co., Ltd.

  • IC Resources

  • ICatch Technology, Inc.

  • IHS Markit

  • Imagination Technologies

  • IMEC

  • Imperas Software Ltd.

  • Indie Semiconductor

  • Indian Institute of Technology Madras (IIT Madras)

  • Industrial Technology Research Institute (ITRI)

  • Infineon Technologies AG

  • Inova Semiconductors GmbH

  • Instituto de Microelectrónica de Sevilla, CNM (IMSE-CNM)

  • Intedis GmbH & Co. KG

  • Integrated Silicon Solutions, Inc.

  • Intel Corporation

  • Intempora

  • International Data Corporation (IDC)

  • Intevac, Inc.

  • Intraratio Corporation

  • Intrinsic ID B.V.

  • Invecas

  • Invensas Corporation

  • InvenSense

  • Invisionate

  • IPVALUE Management Inc.

  • IP-nest

  • IPro Silicon IP Ltd

  • JCET Group Co., Ltd.

  • Jefferies Group LLC

  • JMC Worldwide Inc.

  • Joshi Partners

  • JPMorgan Chase & Co.

  • KALRAY

  • Kalypso

  • Karamba Security

  • Kendrion N.V.

  • KeraCel

  • Kneron, Inc.

  • KPIT Technologies Ltd.

  • KVH Industries, Inc.

  • Lam Research Corporation

  • Lanza techVentures (LVT)

  • Leoni AG

  • LG Electronics Inc.

  • Linaro

  • Lojixx Technologies

  • Luxoft Holding, Inc.

  • M31 Technology Corporation

  • Mahle GmbH

  • Marvell Semiconductor, Inc.

  • MASER Engineering B.V.

  • Maxim Integrated Products, Inc.

  • McKinsey & Company

  • MediaTek Inc.

  • MEI Micro

  • Menta

  • Mercedes-Benz Research and Development

  • Meta Platforms, Inc.

  • Microchip Technology Inc.

  • Micro-IP

  • MicroFuzzy Management

  • Micron Technology, Inc.

  • Microsoft Corporation

  • MIRISE Technologies Corporation

  • Mixel, Inc.

  • Mobil Flex

  • Molecular Electronic Research Institute (MERI)

  • Moortec Semiconductor Ltd.

  • Morgan Stanley

  • Moroccan Foundation for Advanced Science, Innovation and Research (MASCIR)

  • Motional

  • MT Technologies GmbH

  • MulticoreWare

  • Nanjing SemiDrive Technology

  • Nanotronics

  • National Instruments Corporation (NI)

  • National Tsing Hua University

  • Navitas Semiconductor, Inc.

  • Neuhelium

  • NeuroStores

  • Neusoft Technology Solutions GmBh

  • Nexperia

  • NIO

  • Nissan Global Foundation

  • Nissan Motor Corporation Ltd.

  • Nomura Greentech

  • Nordic Semiconductor ASA

  • NVIDIA Corporation

  • NXP Semiconductors N.V.

  • OneSpin Solutions GmbH now Siemens

  • OmniVision Technologies, Inc.

  • ON Semiconductor

  • Optima Design Automation

  • Optimal Plus (Optimal+)

  • Orbitil

  • Otorio

  • Outsight

  • Owl Autonomous Imaging

  • Palomar Technologies, Inc.

  • Parade Technologies, Ltd.

  • Partners4U

  • PDF Solutions, Inc.

  • Perforce Software

  • PicoAI

  • PLDA

  • PLsense Ltd.

  • PoLight AS

  • Power Electronics

  • Presto Engineering

  • PricewaterhouseCoopers LLP (PwC)

  • Privafy, Inc.

  • Prophesee

  • proteanTecs

  • PSA Peugeot Citroen

  • Qnovo

  • Quadric.io

  • QUALCOMM Incorporated

  • Qualcomm Ventures (QCV)

  • Quanergy

  • Rambus Inc.

  • RBC Capital Markets

  • Redtree Solutions

  • Renesas Electronics Corporation

  • Richtek Technology Corporation

  • Riscure B.V.

  • Robert Bosch GmbH

  • Rockley Photonics

  • ROHM Semiconductor USA

  • Roth Capital Partners, LLC

  • Roviero, Inc

  • RunEL

  • S3 Group

  • S4 Partners

  • Saint-Gobain

  • Samsung Foundry

  • Samsung Semiconductor, Inc.

  • Satris Group

  • Schaeffler AG

  • Schweizer Electronic AG

  • Schweizer World

  • Scintil Photonics

  • Secure Thingz Ltd.

  • Secure-IC SAS

  • Security Research Labs

  • SEMI

  • SemiconductorEngineering

  • Semiconductor Manufacturing International Corporation (SMIC)

  • SemiFive

  • Senseair

  • Senseg

  • Sequans Communications S.A.

  • Serendibite Partners

  • Serveno, Inc.

  • SG Analytics (SGA)

  • Shanghai Huali Microelectronics Corporation (HLMC)

  • Shanghai UniVista Industrial Software Group Co., Ltd.,

  • Shenzhen Goodix Technology Co., Ltd.

  • Siemens AG

  • Siemens EDA

  • SiFive Inc.

  • Silexica now Xilinx

  • Silex Insight

  • Silicon Catalyst

  • Silicon Integration Initiative, Inc. (Si2)

  • Silicon Labs

  • Silicon Mitus, Inc.

  • Silicon Motion Technology Corporation (Silicon Motion, Inc.)

  • Silicon South West

  • Siliconware Precision Industries Co., Ltd. (SPIL)

  • SilTerra Malaysia Sdn. Bhd.

  • Silvaco, Inc.

  • SiMa Technologies, Inc.

  • SIPEARL

  • Sirius X-ray Solutions GmbH

  • SiTime Corporation

  • Sivers Photonics

  • Si-Vision Inc (Silicon Vision)

  • Si-Ware Systems (SWS)

  • SK hynix Inc.

  • Skyworks Solutions, Inc.

  • Smart Eye AB

  • SMART Modular Technologies

  • Soitec SA

  • SOI Industry Consortium

  • Sondrel Ltd.

  • SPEC Sensors, LLC

  • SPTS Technologies

  • Spero Devices

  • Spirox Corporation

  • SQream

  • Stars Microelectronics USA, Inc.

  • STATS ChipPAC Ltd.

  • Stellantis

  • Steradian Semiconductor

  • STMicroelectronics Intl NV

  • Strategic Executive Search Group (SES Group)

  • Synapse Design Automation Inc.

  • Synopsys, Inc.

  • Syntacore

  • Sythra Technologies

  • Taiwan Electrical and Electronic Manufacturers’ Association (TEEMA)

  • Taiwan Semiconductor Manufacturing Corporation (TSMC)

  • TD Shepherd

  • Tech Mahindra Limited

  • TechInsights

  • TechLink Global Ltd.

  • TE Connectivity Ltd.

  • Tektronix, Inc

  • Telechips, Inc.

  • Teradyne, Inc.

  • Tesla, Inc.

  • Tessolve Semiconductor Engineering

  • Thalia Design Automation Ltd. (THALIA-DA)

  • The Daimler Group

  • The Israeli Semiconductor Portal

  • The New York Times Company

  • Thunder Software Technology Co., Ltd.

  • Thermo Fisher Scientific, Inc.

  • Tokyo Electron Limited (TEL)

  • TomTom

  • Toppan Printing Co., Ltd. (Toppan Group)

  • Tortuga Logic, Inc.

  • Tower Semiconductor

  • Triad Semiconductor, Inc.

  • TriEye

  • Trusted Labs

  • Tusk IC

  • TÜV Nord

  • Tuxera Inc.

  • UBOTIC

  • UltraSoC Technologies Ltd.

  • Union Semiconductor Inc.

  • UNIM Innovation (Wuxi) Co., Ltd.

  • UNISOC (SHANGHAI) TECHNOLOGIES CO., LTD.

  • United Business Media Ltd. (UBM)

  • United Microelectronics Corporation (UMC)

  • United Test & Assembly Center Ltd. (UTAC)

  • Universidade Federal Fluminense (UFF)

  • University of Notre Dame

  • University of Texas At Austin (UT)

  • University of Waterloo

  • Untether AI

  • Upstream

  • Valens Semiconductor Ltd.

  • Valeo

  • Vanguard International Semiconductor Corp. (VIS)

  • Veridify Security

  • VeriSilicon Holdings Co., Ltd.

  • Vicor

  • VisIC Technologies Ltd (VisIC)

  • Vistex

  • Vitesco Technologies Germany GmbH

  • Vivid Engineering, Inc. (VivEng)

  • VLSI Research Inc

  • Vodafone Group Plc.

  • Volkswagen (VW)

  • VoxelSensors

  • Vulcan Technologies Co. Ltd.

  • Waymo

  • WEKA FACHMEDIEN GmbH

  • Weltrend Semiconductor, Inc.

  • Western Digital Corporation

  • Winbond Electronoics

  • X-FAB Global Services GmbH

  • Xilinx, Inc.

  • Xiphera

  • XPT Global

  • XSemi Taiwan

  • Yamar Electronics Ltd.

  • yieldHUB

  • Yigal Amon & Co.

  • ZF Group

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