CURRENT AUTOMOTIVE INTEREST GROUP TOPIC
NEXT-GENERATION AUTOMOTIVE HIGH-PERFORMANCE COMPUTING
SoC DESIGN: CHIPLETS AND BEYOND
In this Automotive Interest Group collaboration, GSA and McKinsey will develop a perspective on the most appropriate building blocks for next-generation automotive high-performance computing system-on-chip (SoC) design: Chiplets and beyond.
- Holistic assessment of players, including technical deep-dives on architecture design and processing performance across US, Europe, and China.
- Determination of value pools in SoCs, associated market sizes (e.g., between DSP chips vs AI accelerators), and trends.
- Analysis of the emerging tech divide between China and RoW, including implications on supply chain and impact on different players across the value chain (e.g., ASML for lithography machines).
The project will include 1:1 interviews, workshops (virtual and in-person) and a report of the results that will be shared with Automotive Interest Group participants and presented in a dedicated event.
We welcome all relevant players in the automotive industry to join this interest group at no cost: OEMs, tier-1 suppliers, semiconductor ecosystem players, as well as companies providing software solutions (OS, middleware, user functions).
If you are any of the above, please contact firstname.lastname@example.org.