AN INNOVATION AND COLLABORATION PLATFORM

WELCOME TO GSA AUTOMOTIVE

GSA Automotive is a neutral, global collaboration platform where automotive ecosystem executives and experts meet with peers, partners, suppliers, and customers to address common industry challenges together

  • Collaboration takes place both during dedicated events and through intelligently moderated working groups on carefully chosen topics.

  • Working groups take place in all geographies: Europe, North America and Asia Pacific.

  • We produce and collect high-quality articles, reports and other resources that we share with GSA Automotive active members.

  • Invited members are selected semiconductor ecosystem companies, automotive OEMs, Tier 1 and Tier 2 automotive suppliers, software companies and selected organizations with a vested interest in the growth and success of the automotive industry.

Chips in the Autonomous Age

As part of this GSA Automotive Interest Group and again in collaboration with McKinsey & Company, we are starting a new study on “Chips in the Autonomous Age”: an analysis of emerging chip technologies and market for ADAS and autonomous driving, a comparison of GPU vs. ASIC usage, related trend analysis and changes in the value chain.

To be updated and get involved with this new exciting project, please click here to sign up for free.

EVENTS

Automotive Cybersecurity Conference

March 26 4:00 pm - 5:30 pm CDT

Automotive Interest Group Workshop

December 16, 2019 10:30 am - 4:00 pm CST

Automotive Interest Group Workshop in Association with APEF

November 13, 2019 12:00 pm - 1:30 pm CST

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DEFINING THE FUTURE OF AUTOMOTIVE

GSA AUTOMOTIVE PARTICIPANTS

  • 3M

  • Abileapty

  • Accenture

  • AMD

  • ASE Group

  • Advantest

  • AGCO

  • Agile Analog

  • Almotive

  • Airbus

  • Alliance Innovation Lab Tel Aviv

  • Ambarella

  • ams AG

  • Analog Devices

  • Angoka

  • ANSYS

  • Aptiv

  • Arbe Robotics

  • Ardentec

  • Argus Cyber Security

  • Arm

  • Armstrong Material Solutions

  • Ateris

  • AT&S

  • ATS Engineering

  • Attopsemi Technology

  • Audi

  • AutoTalks

  • Berkeley Analog

  • BitifEye Digital Test Solutions

  • BizLink International

  • Black Sesame Technologies

  • Blue Danube Systems

  • BMW

  • BNB Markets

  • Bosch Sensortec

  • Bose Corporation

  • Brier & Thorn

  • Brightsight

  • Broadcom Limited

  • Brodmann17

  • Cadence Design Systems

  • Calibra

  • Calsonic Kansei

  • Canadian Trade Office in Taipei Bureau

  • Commercial Du Canada a Taipei

  • Canova Tech Srl

  • Capital-E

  • Carl Zeiss

  • Carnyx Consulting

  • CEA-Leti

  • Chinese American Semiconductor

  • CASPA

  • Chipus Microelectronics

  • Cisco Systems

  • Cognizant

  • Cohu

  • Continental

  • CoreNetiX

  • Credit Suisse

  • CriticalBlue

  • Cypta Labs

  • Cymotive Technologies

  • D3 Semiconductor

  • Dassault Systemes

  • Data I/O

  • DecaWave

  • DeepMap

  • Dekra Digital

  • Dell Technologies

  • Deloitte LLP

  • DENSO

  • Deutsche Telekom

  • Dialog Semiconductor

  • Dibotics

  • DigiLens

  • DinoPlusAI

  • Disentra

  • Dosilicon

  • Dräxlmaier Group

  • dSpace

  • Egon Zehender International

  • ELMOS Semiconductor

  • eMemory Technology

  • Encore Semi

  • Enigmatos

  • Ensillica

  • Epistar

  • EYs3D Microelectronics

  • Faraday Technology

  • Finnegan

  • Five AI

  • Flex

  • Floadia

  • Ford

  • Fraunhofer Institute for Integrated Circuits IIS

  • Fraunhofer  Institute for Reliability & Microintegration IZM

  • Futurewei Technologies

  • Garmin

  • GEO Semiconductor

  • GigaDevice Semiconductor

  • GLOBALFOUNDRIES

  • Global Unichip Corporation

  • Google

  • Granite River Labs

  • Greenhill & CO.

  • Green Hills Software

  • Groupe Renault

  • GuardKnox

  • Hailo

  • HDL Design House

  • Hejian Technology (Suzhou)

  • Huawei

  • Hyperstone

  • Hyundai

  • Hyperstone

  • IAR Systems

  • IBM

  • iCatch Technology

  • IC Manage

  • IC Resources

  • ICsense

  • IEEE

  • IHS Markit

  • Imagination Technologies

  • Imec

  • Imperas Software

  • IIT Madras

  • Indie Semiconductor

  • Industrial Technology Research Institute

  • Infineon Technologies

  • Innoviz Technologies

  • Inova Semiconductors

  • Intedis

  • Integrated Silicon Solutions

  • Intel

  • International Data Corporation

  • Intevac

  • Intrinsic ID

  • Invensas Corporation

  • InvenSense, a TDK Group Company

  • IPro

  • Ircona

  • JCET Group

  • JMC Worldwide

  • JP Morgan Chase

  • Kalray

  • Karamba Security

  • Kendrion

  • Kneron

  • KPIT Technologies

  • Lam Research Corporation

  • Lanza Tech Ventures

  • Leoni

  • LG Electronics

  • Luxoft Holding

  • M31 Technology

  • Marvell

  • MASER Engineering

  • Maxim Integrated

  • McKinsey & Company

  • Menta

  • Mentor, a Siemens Business

  • Mercedes-Benz Research & Development

  • Microchip Technology

  • MicroFuzzy Management

  • Micron

  • Microsoft Corporation

  • Microtech Ventures

  • Minima Processor

  • MixComm

  • Mixel

  • Molecular Electronic Research Institute (MERI)

  • Moortec Semiconductor

  • MorethanIP

  • Morgan Stanley

  • MT Technologies

  • MuticoreWare

  • Nanjing SemiDrive Technology

  • Neuhelium

  • NeuroStores

  • Nexperia

  • NI

  • NIO

  • Nissan

  • NVIDIA

  • NXP Semiconductors

  • ON Semiconductor

  • Optima Design Automation

  • Optimal+

  • Orbitil

  • Otorio

  • Outsight

  • Owl Autonomous Imaging

  • Palomar Technologies

  • Partners4U

  • PDF Solutions

  • PLDA

  • PLsense

  • Power Electronics

  • Presto Engineering

  • Pricewaterhouse Coopers (PwC)

  • Prophesee

  • Protean Tecs

  • Qnovo

  • Quadric.io

  • Quanergy

  • Rambus

  • RBC Capital Markets

  • Redtree Solutions

  • Renesas

  • Riscure

  • Robert Bosch

  • Rockley Photonics

  • RunEL

  • S3 Group

  • S4 Partners

  • Saint-Gobain

  • Samsung Electronics

  • Samsung Foundry

  • Satris Group

  • Schweizer Electronics

  • Schweizer World

  • Secure-IC

  • Security Research Labs

  • SEMI

  • Semiconductor Engineering

  • Semiconductor Manufacturing International Corporation (SMIC)

  • Senseair

  • Senseg

  • Sequans Communications

  • Serendibite Partners

  • Serveno

  • Shanghai Huali Microelectronics Corporation (HLMC)

  • Shenzhen Goodix Technology

  • Siemens

  • Silexica

  • Silex Insight

  • Silicon Catalyst

  • Silicon Labs

  • Silicon Mitus

  • Silicon South West

  • SilTerra Malaysia

  • Silvaco

  • SIPEARL

  • Si-Vision

  • Si-Ware Systems (SWS)

  • SK Hynix

  • Smart Eye

  • Smoltek

  • Soitec

  • Sondrel

  • SPEC Sensors

  • Spero Devices

  • Spirox

  • SPTS Technologies

  • STMicroelectronics

  • SES Group

  • SureCore

  • Synopsys

  • Syntacore

  • Sythra Technologies

  • Taiwan Electrical & Electric Manufacturers Association

  • Taiwan Micropaq (TMC)

  • TechInsights

  • TechLink Global

  • TE Connectivity

  • Telechips

  • Teradyne

  • Tesla

  • Tessolve

  • Thalia Design Automation

  • The Daimler Group

  • Thermo Fisher Scientific

  • Thundersoft

  • Tokyo Electron Limited

  • TomTom

  • Toppan Group

  • Tortuga Logic

  • Tower Semiconductor

  • TriEye

  • Trusted Labs

  • TSMC

  • TÜV Nord

  • UBOTIC

  • UltraSoC Technologies

  • Union Semiconductor

  • UMC

  • UTAC

  • University of Notre Dame

  • University of Waterloo

  • Upstream

  • Vanguard Semiconductor

  • Veridify Security

  • VeriSilicon Holdings

  • Visteon

  • Vitestco Technologies

  • VLSI Research

  • Visteon

  • Visteon

  • Vodafone Group

  • Volkswagen

  • Vulcan Semiconductor

  • Waymo

  • Wells Fargo

  • Weltrend

  • Western Digital

  • Winbond Electronoics

  • X-FAB Global Services

  • Xilinx

  • XPT Global

  • Yamar Electronics

  • yieldHUB

  • ZF Group

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