AN INNOVATION AND COLLABORATION PLATFORM

WELCOME TO GSA AUTOMOTIVE

GSA Automotive is a neutral, global collaboration platform where automotive ecosystem executives and experts meet with peers, partners, suppliers, and customers to address common industry challenges together

  • Collaboration takes place both during dedicated events and through intelligently moderated working groups on carefully chosen topics.

  • Working groups take place in all geographies: Europe, North America and Asia Pacific.

  • We produce and collect high-quality articles, reports and other resources that we share with GSA Automotive active members.

  • Invited members are selected semiconductor ecosystem companies, automotive OEMs, Tier 1 and Tier 2 automotive suppliers, software companies and selected organizations with a vested interest in the growth and success of the automotive industry.

CURRENT AUTOMOTIVE INTEREST GROUP TOPIC

FUTURE OF AUTOMOTIVE COMPUTING: CLOUD VS. EDGE

As part of this GSA Automotive Interest Group and again in collaboration with McKinsey & Company, we are currently working on analyzing the Future of Automotive Computing: Cloud vs. Edge.

With the rise of connected cars and increasing demand for compute and processing power in vehicles, OEMs start to experiment with hybrid applications running in the vehicle and on a cloud backend. The question if cloud backends can bear part of the processing power of vehicles in the mid-to-long-term will have significant impact on the electronics content of vehicles. We will look into assessing which type of operations could be run hybrid vs. fully on edge vs. on cloud, including intermediary concepts, e.g. local processing in 4G/5G towers to optimize latency. We will also look at the critical security aspects involved in any of these architectures.

To be updated and get involved with this new exciting project, please click here to sign up for free.

EVENTS

GSA Automotive Summit

May 10 4:00 pm - 7:30 pm UTC+1

The Female Future of Tech

March 10 5:00 pm - 6:30 pm UTC+1

Automotive Interest Group Workshop

February 11 4:00 pm - 7:00 pm CET

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DEFINING THE FUTURE OF AUTOMOTIVE

GSA AUTOMOTIVE PARTICIPANTS

  • Accenture

  • Advanced Micro Devices, Inc. (AMD)

  • Advantest

  • Agile Analog

  • Almotive

  • Alliance Innovation Lab Tel Aviv

  • ams AG

  • Analog Devices, Inc. (ADI)

  • ANSYS

  • Ardentec Corporation

  • ARM, Inc.

  • Ateris, Inc.

  • ASE Group (Advanced Semiconductor Engineering, Inc.)

  • ATLANT Holding IVS

  • Audi AG

  • Beijing Starblaze Technology Co., Ltd

  • BitifEye Digital Test Solutions

  • Black Sesame Technologies

  • Blueshift Memory

  • BMW (Bayerische Motoren Werke AG)

  • Bosch Sensortec GmbH

  • Bose Corporation

  • Brightsight

  • Broadcom Limited

  • Cadence Design Systems

  • Canova Tech Srl

  • Canyon Bridge Capital Partners Inc.

  • Capital-E

  • Car.SW Org

  • Carnyx Consulting

  • Chinese American Semiconductor Professional Association (CASPA)

  • Chipus Microelectronics

  • Cisco Systems

  • Cognizant

  • Cohu

  • Commercial Du Canada a Taipei

  • Continental

  • CoreNetiX

  • Credit Suisse

  • CriticalBlue

  • Cymotive Technologies

  • Cypta Labs

  • D3 Semiconductor

  • Dassault Systemes

  • Data I/O

  • DecaWave

  • DeepMap

  • Dekra Digital

  • Dell Technologies

  • Deloitte LLP

  • DENSO

  • Deutsche Telekom

  • Dialog Semiconductor

  • Dibotics

  • DigiLens

  • DinoPlusAI

  • Disentra

  • Dosilicon

  • Dräxlmaier Group

  • dSpace

  • Egon Zehender International

  • ELMOS Semiconductor

  • eMemory Technology

  • Encore Semi

  • Enigmatos

  • Ensillica

  • Epistar

  • EYs3D Microelectronics

  • Faraday Technology

  • Finnegan

  • Five AI

  • Flex

  • Floadia

  • Ford

  • Fraunhofer Institute for Integrated Circuits IIS

  • Fraunhofer  Institute for Reliability & Microintegration IZM

  • Futurewei Technologies

  • Garmin

  • GEO Semiconductor

  • GigaDevice Semiconductor

  • Global Unichip Corporation

  • GLOBALFOUNDRIES

  • Google

  • Granite River Labs

  • Green Hills Software

  • Greenhill & CO.

  • Groupe Renault

  • GuardKnox

  • Hailo

  • HDL Design House

  • Hejian Technology (Suzhou)

  • Huawei

  • Hyperstone

  • Hyundai

  • IAR Systems

  • IBM

  • IC Manage

  • IC Resources

  • iCatch Technology

  • ICsense

  • IEEE

  • IHS Markit

  • IIT Madras

  • Imagination Technologies

  • Imec

  • Imperas Software

  • Indie Semiconductor

  • Industrial Technology Research Institute

  • Infineon Technologies

  • Innoviz Technologies

  • Inova Semiconductors

  • Intedis

  • Integrated Silicon Solutions

  • Intel

  • International Data Corporation

  • Intevac

  • Intrinsic ID

  • Invensas Corporation

  • InvenSense, a TDK Group Company

  • IPro

  • Ircona

  • JCET Group

  • JMC Worldwide

  • JP Morgan Chase

  • Kalray

  • Karamba Security

  • Kendrion

  • Kneron

  • KPIT Technologies

  • Lam Research Corporation

  • Lanza Tech Ventures

  • Leoni

  • LG Electronics

  • Luxoft Holding

  • M31 Technology

  • Marvell

  • Microchip Technology Inc.

  • Micron Technology, Inc.

  • Microsoft Corporation

  • MIRISE Technologies Corporation
  • MixComm, Inc.

  • Mixel, Inc.

  • Molecular Electronic Research Institute (MERI)

  • Moortec Semiconductor Ltd (Acquired by Synopsys)
  • Morgan Stanley

  • Nanjing SemiDrive Technology

  • National Instruments Corporation (NI)
  • Navitas Semiconductor, Inc.
  • NIO

  • Nissan Motor Corporation Ltd.
  • NVIDIA Corporation

  • NXP Semiconductors N.V.

  • OmniVision Technologies, Inc.

  • ON Semiconductor

  • Optimal Plus (Optimal+)

  • Orbitil

  • Owl Autonomous Imaging

  • Parade Technologies, Ltd.

  • PDF Solutions, Inc.

  • PLDA

  • Presto Engineering

  • Privafy, Inc.

  • proteanTecs

  • PSA Peugeot Citroen

  • QUALCOMM Incorporated

  • Rambus Inc.
  • Redtree Solutions

  • Renesas Electronics Corporation
  • Richtek Technology Corporation
  • Riscure B.V
  • Robert Bosch GmbH
  • Rockley Photonics
  • Roth Capital Partners, LLC
  • Samsung Foundry
  • Samsung Semiconductor, Inc.
  • Secure-IC SAS
  • Semiconductor Manufacturing International Corporation (SMIC)
  • SemiFive
  • Sequans Communications S.A.
  • Shanghai Huali Microelectronics Corporation  (HLMC)
  • Shelton Group
  • Shenzhen Goodix Technology Co., Ltd.
  • Si-Ware Systems (SWS)
  • Siemens AG
  • Siemens EDA
  • SiFive Inc.
  • Silex Insight
  • Silicon Catalyst

  • Silicon Labs

  • Silicon Mitus, Inc.

  • Silicon Motion Technology Corporation (Silicon Motion, Inc.)
  • SilTerra Malaysia Sdn. Bhd.
  • SIPEARL

  • SiTime Corporation
  • SK hynix Inc.
  • Smoltek AB

  • Soitec SA

  • Sondrel Ltd.

  • Spero Devices

  • Spirox Corporation

  • STMicroelectronics Intl NV
  • Strategic Executive Search Group (SES Group)
  • Synopsys, Inc.

  • Syntacore

  • Taiwan Semiconductor Manufacturing Corporation (TSMC)
  • TD Shepherd
  • Teradyne, Inc.

  • Tesla, Inc.

  • Tessolve Semiconductor Engineering
  • The Daimler Group

  • Thermo Fisher Scientific, Inc.

  • Tokyo Electron Limited (TEL)

  • TomTom

  • Tortuga Logic, Inc.

  • Tuxera Inc.
  • UltraSoC Technologies Ltd.

  • Union Semiconductor Inc.

  • UNISOC (SHANGHAI) TECHNOLOGIES CO., LTD.
  • United Microelectronics Corporation (UMC)
  • United Test & Assembly Center Ltd. (UTAC)
  • Vanguard International Semiconductor Corp. (VIS)
  • Veridify Security

  • VeriSilicon Holdings Co., Ltd.

  • Vicor

  • VisIC Technologies Ltd (VisIC)
  • Vistex
  • Vodafone Group Plc.

  • Volkswagen (VW)

  • Waymo

  • Western Digital Corporation

  • Winbond Electronoics

  • X-FAB Global Services GmbH

  • Xilinx, Inc.

  • yieldHUB

  • ZF Group

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