ASE, Inc. is the leading global provider of semiconductor manufacturing services in packaging and test. With strong leadership in heterogeneous integration, manufacturing efficiencies, and sustainability approaches, packaging innovation is at the heart of what ASE does. Today, ASE’s advanced packaging, system-in-package, and chiplet solutions are accelerating growth momentum across AI, HPC, Data Center, Automotive, IoT, 5G, and more. To learn about our VIPack™ and powerSiP™ platforms, please visit aseglobal.com or follow us on LinkedIn and X: @aseglobal.
Event Recap
The GSA Asia Pacific Executive Forum (APEF), Global Semiconductor Alliance’s flagship event in Asia, gathered over 200 senior executives and thought leaders from across the global semiconductor ecosystem. The 2025 edition, hosted on November 5 in Taipei, covered a wide range of topics, including the current industry landscape and outlook, frontier technologies in silicon photonics, AI use cases, and global talent challenges.
Program
All times are in Asia Standard Time (Taiwan Time)
9:30
Registration
10:00
Welcome
Welcome Remarks
- Jodi Shelton / CEO & Co-Founder / GSA
10:05
Opening Remarks
Nicky Lu / Chairman & APAC Leadership Council / GSA; Chairman, Founder and CEO / Etron Technology
10:15
Presentation
Semiconductor Market Outlook
AI-Driven Growth Despite Uncertainty in Semiconductor Company Leadership, Public Policy, and Sustainable Innovation
The semiconductor industry is in the middle of a strong, concentrated growth cycle, fueled by unprecedented AI infrastructure investments, industry leadership supporting resiliency and long-term vision, and government policies leaning toward relaxing restrictions and collaborating with critical trading partners after the misguided communication on tariffs back in April. The rise of generative AI and large language models (LLMs) is accelerating demand for computing and is pervasive across the cloud and edge, where AI inference is expected to become increasingly disruptive. The semiconductor market is poised for a long, sustainable cycle as the industry is expected to reach $1T in revenues earlier than consensus views. Who are the vendors and technology suppliers that will make the right bets and capitalize on the growth?
- Mario Morales / Vice President, Head of Corporate Strategy and Partnerships / AMD
10:35
Keynote
Driving Decarbonization and Digitalization in Asia
Infineon Technologies is a global semiconductor leader in power systems and IoT. In this keynote, Alexander Gorski, Chief Operations Officer of Infineon, explains how Infineon is preparing for further growth to serve the strong decarbonization and digitalization needs. Infineon not only differentiates by technology, but also in terms of quality and sustainability.
To drive growth in Asia, Infineon sets a clear focus on partnerships and local talent.
- Alexander Gorski / COO and Member of the Management Board / Infineon
10:55
Presentation
Next-Gen Silicon: How Advanced ICs and Chips Power the AI Revolution
Artificial Intelligence (AI) is redefining the boundaries of computation, connectivity, and innovation—and at the heart of this transformation lies the integrated circuit (IC). From advanced logic chips that power massive AI training clusters to high-speed interconnects linking thousands of GPUs, modern ICs form the physical foundation of intelligent systems. The exponential growth of AI workloads demands unprecedented processing density, energy efficiency, and data movement—challenges being met through breakthroughs in chip design, packaging, and fabrication.
As transistor scaling pushes new frontiers, heterogeneous integration, chiplet architectures, and specialized AI accelerators are emerging as key enablers of scalable AI infrastructure. Equally vital are next-generation RFICs and high-speed interconnect chips operating in the millimeter-wave (mmWave) and sub-terahertz (THz) ranges, enabling ultra-low-latency communication between compute nodes and across data centers. Together, these technologies are shaping a seamless silicon ecosystem that connects, computes, and learns at scale.
This presentation explores how innovations in ICs—spanning digital, analog, and RF domains—are propelling the AI era and transforming data centers, edge devices, and global connectivity.
- Maryam Rofougaran / Co-Founder and CEO / Movandi
11:15
Topic
Frontier Technologies in Silicon Photonics
Lighting the Path to the Future of AI Infrastructure
Nearly 60% of data center power today is consumed just moving data rather than processing it, a growing inefficiency that limits scalability, performance, and sustainability. As AI workloads expand, scale-up networks that connect GPUs within a domain are hitting a “power wall,” consuming more power and limiting scale-up domains to a single rack, thus causing rack power densities to increase unsustainably. Roughly 85% of all AI data traffic is scale-up, while only about 15% is scale-out. Solving the scale-up bottleneck is therefore where the greatest gains in efficiency can be achieved.
This talk explores how silicon photonics enables a path beyond these limits. By replacing copper with optical interconnects, data centers can achieve orders of magnitude improvements in reach, bandwidth, energy efficiency, and reliability, turning the bottleneck of data movement into a platform for growth. Presented by Celestial AI Co-Founder and COO Preet Virk, this session will examine industry trends, technology inflection points, and the collaborative innovation required to build the next generation of AI infrastructure.
- Cindy Palar / General Manager, Celestial AI Singapore / Celestial AI
How AI, Semiconductors and Photonics Are Coming Together to Create the New Spatial Computing Era
This talk will describe the potential for Spatial Computing and how AI, Semiconductors and Photonics are coming together to make it a reality. As an example, it will highlight how nano-pixels made with phase change material are the beginning of Tunable Photonics with CMOS semiconductor compatibility and economics.
- Mike Noonen / CEO / Swave
Lighting up the future of AI
Photonics has been a transformative force across the data communication stack. Its modern journey began in 1988 with TAT-8, the first transatlantic optical-fibre cable, a nearly 6,000 km network transmitting 280 Mbit/s (about 40,000 simultaneous calls, versus 4,000 on copper) at a cost of US $335 million. This milestone marked the dawn of a new era where photons replaced electrons, simultaneously advancing bandwidth, latency, reliability, power, and cost, the hallmarks of disruption.
This session traces the rapid evolution of photonics technologies leading to their central role in scaling AI compute for training and inference. It also explores the next decade of innovation in Silicon Photonics, illustrating how continued investment and adoption will extend the cultural and economic transformation that began with TAT-8, lighting up the future of human and machine intelligence.
- Hamid Arabzadeh / Co-Founder and CEO / Ranovus
12:00
Networking Lunch
13:00
Presentation
13:15
Sessions
AI in Action: Redefining Semiconductor Intelligence Across Cloud, Edge, and Design
From Chips to Intelligence: Fueling the AI Landscape
For over 25 years, Amazon’s AI development has evolved beyond internal applications to pioneering innovations across diverse industries. Our work encompasses market-leading technologies—including autonomous robotic warehouses, drone delivery systems, Alexa voice assistants, and Just Walk Out stores—with AWS’s AI capabilities underpinned by advanced semiconductor technology.
With our long time customer serving experiences at AWS, we are capable of designing purpose-built chips for computing and specific AI training and inference needs with a comprehensive partner ecosystem, AWS also accelerates AI advancement while strengthening semiconductor design and verification capabilities, enabling a more efficient AI value chain for businesses of all sizes.
Building on these capabilities, AWS has launched innovative programs in Taiwan to further advance technological integration for the global leading semiconductor and ICT ecosystem. The “Zero-Intervention Program” focuses on leveraging cloud and AI technologies to enhance different connected hardware platforms like drones, robots, and vehicles for its swarm fleet autonomous execution and management capabilities.
- Robert Wang / Managing Director, Taiwan / AWS
The Growing Need for Collaboration Across the Semiconductor Industry - How to Leverage AI and Data Platforms
The semiconductor industry has always thrived on innovation, with multiple companies collaborating to launch the latest breakthrough innovations. Today the semiconductor industry is undergoing a fundamental transformation in how companies collaborate across the global supply chain. Traditionally reliant on isolated development, simple linear handoffs, and limited data sharing through spreadsheets, the industry now faces unprecedented complexity driven by 3D multi-vendor chiplet packaging.
This presentation introduces a new paradigm of AI-driven collaboration built on three foundational pillars. First, a secure data infrastructure leveraging an established network connecting over 300 manufacturing locations and 100+ OEMs, handling exabytes of exchanged data. Second, automated orchestration systems that align and abstract manufacturing data to accelerate business decisions, enabling real-time product costing, order status tracking, quality management, and WIP optimization both within enterprises and across external partners. Third, AI agents that operate autonomously within human-defined governance boundaries to analyze 100% of manufacturing data, addressing the current reality where only 5-10% of data is analyzed and 80% of data scientists’ time is spent on data preparation.
The convergence of these elements enables predictive test solutions, automated quality assurance, and seamless multi-party coordination across the complex semiconductor value chain. By combining human governance with AI execution at scale, the industry can move from reactive, stage-gate collaboration to continuous, data-driven operational excellence that meets the demands of modern semiconductor manufacturing.
- Kimon Michaels / Co-Founder, Director, Executive Vice President, Products & Solutions / PDF Solutions
Challenges and Trends in Modern Edge AI Software Development
Edge AI shipments are accelerating quickly as AI gains adoption into real world applications from automotive to industrial and IOT. The rapid pace of adoption is leading to challenges in the development of AI software for these soon-to-be ubiquitous devices. This talk will share key challenges, tech trends emerging to resolve them, and a proposal to accelerate industry collaboration.
- Mandali Khalesi / Vice President, AI Platform & Technology / Renesas
Panel - AI in Action
From photonics-driven architectures to edge intelligence and data analytics, AI is transforming every phase of semiconductor innovation. This panel brings together industry experts to explore how AI is being harnessed to accelerate design, optimize manufacturing, and enhance system performance. Discover how breakthroughs in optical interconnects, edge AI, and data-driven yield improvement are converging to create smarter, faster, and more efficient chips.
Moderator:
Mario Morales /
Vice President, Head of Corporate Strategy and Partnerships
/
AMD
Panelists:
- Kimon Michaels / Co-Founder, Director, Executive Vice President, Products & Solutions / PDF Solutions
- Mandali Khalesi / Vice President, AI Platform & Technology / Renesas
- Cindy Palar / General Manager, Celestial AI Singapore / Celestial AI
14:30
Networking Break
15:00
Sessions
Navigating Global Challenges
Beyond Mega Deals - Rethinking Growth and Capital Allocation Strategies
The global semiconductor industry is on track to surpass $1 trillion in annual demand by 2030, driven by AI advancements and surging market needs. Yet, this growth is shadowed by geopolitical tensions, regulatory scrutiny, and a marked decline in mega M&A deals—prompting a strategic pivot toward supply chain resiliency, talent development, and agile capital allocation. In this new era, companies that anticipate market shifts and build collaborative, regionally anchored ecosystems will capture sustainable growth and shape the future of the semiconductor landscape.
- Josie Ananto / Partner/Principal / EY - Ernst & Young Solutions
Keynote Presentation
- Donghui Lu / Corporate Vice President, Front-end Operations and Head of Micron Taiwan / Micron
Engineering Global Mobility: Building the Talent Bridge for the Semiconductor Era
As the semiconductor industry advances through design innovation and AI integration, global mobility has become central to sustaining growth. Magdalene will examine how immigration policy and talent strategy shape the sector’s competitiveness, with a spotlight on Taiwan’s expanding R&D landscape. She will discuss trends in cross-border hiring, challenges in attracting international talent, and the movement of skilled professionals between key markets — offering insights on how companies can build agile, globally connected teams.
- Magdalene Tennant / Managing Director / Fragomen
Panel - Engineering Global Mobility: Building the Talent Bridge for the Semiconductor Era
As the semiconductor industry expands across new regions and technologies, talent has become its most critical and constrained resource. This session explores how companies and governments are engineering global mobility strategies to build, attract, and retain the skilled workforce needed for the next era of innovation. From cross-border collaboration and talent exchange programs to rethinking education pipelines and visa frameworks, we’ll examine how the industry can create a truly global talent bridge—one that connects expertise, accelerates innovation, and sustains growth across the semiconductor value chain.
Moderator:
Magdalene Tennant /
Managing Director
/
Fragomen
Panelists:
- Alice TY Chou / Global Head of Culture & Inclusive Workplace and Director of HRBP-CBRD / TSMC
- Donghui Lu / Corporate Vice President, Front-end Operations and Head of Micron Taiwan / Micron
- Jiun-Haw Lee / Associate Vice President for international Affairs; Professor / National Taiwan University
16:20
Panel
Executive Panel - Charting the Semiconductor Industry's Path Forward
This high-level discussion brings together senior executives to reflect on the global forces reshaping the semiconductor industry. With the rapid rise of AI, sustainability imperatives, and shifting market dynamics, panelists will share how collaboration across regions and ecosystems can unlock new opportunities for innovation and growth. The conversation will look ahead to how collective leadership, shared investment, and cross-border partnerships can strengthen the industry’s foundation and drive its next era of progress.
Moderator:
Panelists:
Josie Ananto /
Partner & Principal
/
EY
- Alexander Gorski / COO and Member of the Management Board / Infineon
- Bill Brennan / President and CEO / Credo
- Robert Wang / Managing Director, Taiwan / AWS
17:00
Closing Remarks
Speakers

Alexander Gorski
COO and Member of the Management Board
Infineon
Alexander Gorski
COO and Member of the Management Board
Infineon
Alexander Gorski has served as Chief Operations Officer and a member of the Management Board at Infineon Technologies AG since October 2025. In his current role, he oversees manufacturing, supply chain, procurement, customs, quality management, real estate, and facilities.
Gorski began his career at Infineon (formerly Siemens AG) in 1998, holding various management roles in Supply Chain and Operations until 2006. He later served as Vice President of Sales at Qimonda AG and as a member of the Management Board at Conergy, where he was COO and ultimately Chief Development Officer. Returning to Infineon in 2016, he became Division COO of Power & Sensor Systems, later advancing to EVP of Backend Operations (2021) and EVP of Frontend Operations (2024).
Born in Regensburg, Germany, he earned a master’s degree in finance and business administration from the University of Regensburg.

Alice TY Chou
Global Head of Culture & Inclusive Workplace and Director of HRBP-CBRD
TSMC
Alice TY Chou
Global Head of Culture & Inclusive Workplace and Director of HRBP-CBRD
TSMC
Alice Chou is an experienced HR executive with approximately 30 years in retail, banking, healthcare and high-tech across Asia, Europe, and North America. She has held various HR leadership roles, including Global Head of Talent, VP HR – Asia Pac and currently serves as Global Head of Culture & Inclusive Workplace and Director/HR Business Partner at TSMC.
Chou is certified in Hogan, MBTI, PDI, and Strength Finder, and is a certified trainer for multiple business programs. She has also served on several non-profit boards or associations previously, including the People Management Association, Taiwan. Colleagues describe her as a strategic, results-driven HR executive known for transforming businesses and building strong talent pipelines.

Cindy Palar
General Manager, Celestial AI Singapore
Celestial AI
Cindy Palar
General Manager, Celestial AI Singapore
Celestial AI
Cindy is the General Manager of Celestial AI Private Limited and joined the company in October 2023 to establish Celestial AI’s Singapore Innovation and Operations Centre. Cindy is a seasoned semiconductor professional with more than 25 years industry experience and extensive network in Assembly & Test operation ecosystems.
Before joining Celestial AI, he was Corporate Vice President, Assembly and Test Operations for Analog Devices Inc. In this role he was responsible of managing both the internal operation with more than 11,000 employees in factories across Malaysia, Philippine and Thailand as well as network of external suppliers with 25 factories across Asia.
Prior to Analog Devices, Cindy spent 16 years with STATS ChipPAC – a global player in Outsourced Assembly and Test (OSAT). During his tenure at the company he held various management position in planning, quality, product line management, test development and process engineering in US and Singapore. The last 5 year he was President & GM, STATS ChipPAC, Singapore.
Cindy has a Bachelor’s Degree in Mechanical Engineering and Master’s Degree in Finance from University of Wisconsin, Madison.

Bill Brennan
President and CEO
Credo
Bill Brennan
President and CEO
Credo
For more than 25 years, Bill Brennan has been leading and scaling organizations to deliver steady revenue growth and profit. Bill joined Credo in 2013, leading the company to its IPO in January 2022. He has overseen Credo’s growth from a small startup to an organization of more than 500 employees worldwide. Under his stewardship, the company has pioneered revolutionary networking technologies based on Credo’s high-performance, low-power SerDes technology, including Active Electrical Cables (AECs) and Linear Receive Optics (LRO). Bill also supports numerous national and regional nonprofit organizations focused on health, education, and children’s causes.
Before joining Credo, Bill served as Vice President of the Storage Business Unit with Marvell Semiconductor for 11 years. Prior to Marvell, he held sales management positions with NEC and Texas Instruments. Bill received his BSEE degree from the University of Colorado.

Donghui Lu
Corporate Vice President, Front-End Operations and Head of Micron Taiwan
Micron
Donghui Lu
Corporate Vice President, Front-End Operations and Head of Micron Taiwan
Micron
As corporate vice president of Front End Operations at Micron Technology and Head of Micron Taiwan, Donghui is responsible for managing the company’s wafer fabrication facilities in Taiwan, as well as aligning Micron Taiwan’s goals and strategic direction with the company’s overall objectives and mission.
Donghui has more than 20 years of semiconductor industry experience spanning technology development and transfer, manufacturing ramp, and fab construction.
Prior to joining Micron in February 2022, Donghui worked at Intel Corporation for 22 years. He was vice president of Manufacturing, Supply Chain and Operations, and co-general manager of the High-Volume Manufacturing Program Office, responsible for leading programs for new manufacturing space enablement and driving global strategic expansion initiatives. Donghui also played a critical leadership role in growing Intel’s memory business, deploying 3D NAND and Optane technologies jointly developed with Micron to Intel, and leading Intel’s 3D NAND process development teams independently developing two new generations of floating gate 3D NAND process technologies.
Donghui holds a B.S. degree from Tsinghua University in Beijing, China, and Ph.D. from Ohio State University in Columbus, Ohio, U.S., both in materials science and engineering. He also received joint EMBA degrees in the United States, from the University of California, Berkeley, and Columbia University, New York.

Hamid Arabzadeh
Co-Founder and CEO
Ranovus
Hamid Arabzadeh
Co-Founder and CEO
Ranovus
Hamid Arabzadeh is Co-Founder and CEO of RANOVUS, a leader in photonic interconnect solutions enabling AI compute scaling in hyperscale data centers. Under his leadership, RANOVUS pioneered a full-stack co-design approach—spanning lasers, silicon photonics, ICs, and packaging—to deliver the industry’s most power-efficient, cost-effective photonic engines, replacing copper interconnects in large-scale AI infrastructure.
Previously, he was Chairman and CEO of COREOPTICS, a photonic subsystems innovator acquired by Cisco in 2010. Earlier, he held senior leadership roles at Nortel Networks across multiple regions, ultimately serving as VP & GM of the Metro DWDM Optical business unit. Beyond RANOVUS, he co-founded and invests in Canadian scaleups in AI sovereign cloud, cybersecurity, and healthcare.
Arabzadeh holds a B.Sc. in Electrical and Computer Engineering from the University of Waterloo and an MBA from McGill University.

Jiun-Haw Lee
Associate Vice President for international Affairs; Professor
National Taiwan University
Jiun-Haw Lee
Associate Vice President for international Affairs; Professor
National Taiwan University
Jiun-Haw Lee (李君浩) was born in Taipei, Taiwan, Republic of China, on August 20, 1972. He received the B.S.E.E., M.S.E.E., and Ph.D. degrees in electrical engineering in 1994, 1995, and 2000, respectively, all from National Taiwan University, Taipei, Taiwan.
From 2000 to 2003, he was with the RiTdisplay Corporation as the director. Since 2003, he joined the faculty of National Taiwan University in the Graduate Institute of Photonics and Optoelectronics and the Department of Electrical Engineering, where he is currently a professor. His research interests include organic optoelectronic devices, display technologies, and solid-state lighting.

Josie Ananto
Partner & Principal
EY
Josie Ananto
Partner & Principal
EY
Josie Ananto is a Partner in EY Parthenon Transaction Strategy and Execution practice, currently based in Singapore, with extensive experience across the Asia Pacific region. With over 20 years of professional experience in the US and Asia, Josie is a recognized leader in M&A consulting, specializing in operational due diligence, complex integrations, carveouts, divestitures, operating model design, and organizational transformation.
Her expertise spans the technology, manufacturing, and consumer sectors, where she has led major cross-border initiatives, driving cost synergies, business scaling, and operational excellence for Fortune 500 clients.
Josie holds an MBA from Kellogg School of Management, an MS in Management Information Systems from the University of Arizona, and a BBA in Accounting and Finance from the University of Wisconsin.

Kimon Michaels
Co-Founder, EVP of Products & Solutions and Director
PDF Solutions
Kimon Michaels
Co-Founder, EVP of Products & Solutions and Director
PDF Solutions
Kimon Michaels, Ph.D., one of the founders of PDF Solutions, has served as Vice President of Products and Solutions since July 2010 and has been a Director since November 1995. Mr. Michaels served as Vice President of Design for Manufacturability from June 2007 through June 2010. Prior to that, Dr. Michaels served as Vice President of Field Operations for Manufacturing Process Solutions from January 2006 through May 2007. From March 1993 through December 2005, he served in various executive capacities. He also served as Chief Financial Officer from November 1995 to July 1998. Dr. Michaels received a B.S. in Electrical Engineering, an M.S. E.C.E. and a Ph.D. E.C.E. from Carnegie Mellon University.

Magdalene Tennant
Managing Director
Fragomen
Magdalene Tennant
Managing Director
Fragomen
Magdalene is the Managing Director of Fragomen in Hong Kong, with over 30 years of experience helping companies and individuals navigate complex immigration landscapes across the Asia Pacific region. She began her career with the Australian Government, informed by her own journey as a foreign student, which gave her unique insight into the challenges faced by non-native English speakers navigating visa processes.
At Fragomen for more than two decades, Magdalene has advised multinational corporations and individuals on complex immigration matters, including mergers and acquisitions, de-registrations, workforce mobility and contingency planning. She has been instrumental in shaping innovative immigration strategies, collaborating with Hong Kong authorities to design tailored visa solutions that address evolving business needs.
With deep expertise across the Asia Pacific region, Magdalene is recognized for her ability to align immigration strategies with organizational goals, ensuring compliance while enabling workforce agility. She holds a degree from the Australian National University.

Mandali Khalesi
Vice President, AI Platform & Technology
Renesas
Mandali Khalesi
Vice President, AI Platform & Technology
Renesas
Mandali Khalesi is Vice President for AI Platform & Technology at Renesas Electronics. He is focused on developing a consistent and unified platform of AI services and products for both external users and internal developers. He was previously VP of AI and Cloud Engineering.
Prior to Renesas, he was the General Manager of Automated Driving Mobility at Toyota Motor Corporation HQ, helping ship their first self-driving Lexus LS flagship vehicle in 2021. He was concurrently Vice President of Automated Driving at Woven by Toyota, Toyota’s self-driving software subsidiary, managing engineering organization growth to 1,700 software and AI engineers.
He is a software executive with over 20 years of experience in the automotive, consumer electronics, and semiconductor industries. Mandali has a Master’s degree in Astrophysics from University College London.

Mario Morales
Vice President, Head of Corporate Strategy and Partnerships
AMD
Mario Morales
Vice President, Head of Corporate Strategy and Partnerships
AMD
Mario Morales is the vice president and Head of Corporate Strategy at AMD. He has conducted for in-depth analysis, evaluation of emerging markets and trends, forecasting, and research of major semiconductor industry segments such as embedded and intelligent systems, wireless, personal computing, networking and cloud infrastructure, automotive electronics, and AI semiconductors.
Mr. Morales is a trusted advisor to leading high tech company executives, financial investors, and bankers on market landscape and direction, product and technology positioning, competitive benchmarking, M&A, hardware, and software technology, and brand health and sustainability. He was also the leading advisor and expert analyst for IDC’s largest Wall Street clients including investment banking, VC’s, and mutual and hedge funds across every major financial region.
Over his career, Mr. Morales has authored and co-authored over 240 reports and studies in the area of semiconductors, mobile, PC, wireless, embedded, IoT, and IT marketplace. His career includes past positions with NEC Electronics and Dataquest.

Maryam Rofougaran
Co-Founder and CEO
Movandi
Maryam Rofougaran
Co-Founder and CEO
Movandi
Maryam Rofougaran is Cofounder and CEO of Movandi, a leader in 5G mmWave technology, advanced RF chipsets, and complete RF systems enabling the high-performance connectivity essential for AI-driven applications and massive data demands. With over 25 years in the semiconductor and wireless industries, Maryam previously served as Senior VP of Wireless Radios at Broadcom, helping grow its wireless business to over $3 billion annually. She began her career as cofounder of Innovent Systems, the first to deliver market-defining SoC integration for short-range wireless—technology later deployed in billions of devices worldwide after Broadcom’s acquisition.
A prolific inventor with 300+ patents and 58 publications, Maryam earned her B.S. and M.S. in Electrical Engineering from UCLA. Recognized by Inc.’s Most Influential Women and Light Reading’s MVPs, she is a member of the CNBC CEO Council and the Global Semiconductor Alliance CEO Council.

Mike Noonen
CEO
Swave Photonics
Mike Noonen
CEO
Swave Photonics
Mike Noonen is CEO of Swave Photonics, B.V., and has 30 years of experience leading technology businesses, resulting in two IPOs and multiple acquisitions. Most recently, he was the CEO of MixComm, Inc. from 2019 until it was acquired by Sivers Semiconductor in early 2022. From 2013 until 2015, Noonen was the Chairman and co-founder of Silicon Catalyst, Inc., the World’s 1st semiconductor incubator and EE Times 2015 Start-up of the Year. Previously, Noonen was:
• EVP, Global Products, Design, Sales, & Marketing at GlobalFoundries
• EVP, Worldwide Sales & Marketing, at NXP Semiconductors, B.V.
• SVP, Global Sales & Marketing at National Semiconductor
In 2013, he was elected to the Global Semiconductor Alliance Board of Directors. He holds a BSEE from Colorado State University and, in 2012, was named the College of Engineering Distinguished Alumni of the Year. Noonen holds multiple patents in the areas of Internet telephony and video communications

Robert Wang
Managing Director, Taiwan
AWS
Robert Wang
Managing Director, Taiwan
AWS
Robert Wang is Managing Director of Amazon Web Services for Hong Kong and Taiwan, responsible for overall business strategy, development and operations. Since taking this role in 2018, Robert has led the team to continuously increase investment in the region, including launching AWS Asia Pacific (Hong Kong) Region and the first Greater China AWS IoT Lab in Taiwan, establishing multiple AWS Joint Innovation Centers and cloud academies, and more. Under Robert’s leadership, AWS has set up a strong presence in Hong Kong and Taiwan to help both global and local customers succeed through its industry-leading technology, services, and global infrastructure.
Robert has more than 20 years of experience in the Information and Communication Technologies industry. Prior to AWS, he worked at various leading multinational corporations including Acer and Intel, holding leadership positions across Asia, Europe, and Americas. He has also worked with a wide range of businesses ranging in size from start-up to enterprises.
Outside of his role with AWS, Robert holds a number of voluntary industry positions, serving as an executive committee member of the Asia Pacific ICT Alliance (APICTA), an advisory committee member of Digital Nation & Innovative Economic Development Program (DIGI+), and President of the Digital Intelligence Service Alliance.
Sponsors
VIP Reception Sponsor
VIP Reception Sponsor
Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.
Platinum Sponsor
Platinum Sponsor
Platinum Sponsor
Platinum Sponsor
Siemens EDA, Software-defined, AI-powered, silicon-enabled electronics are reshaping the semiconductor industry. Design, verify, and manufacture integrated circuits (ICs) and electronic systems to innovate faster with a comprehensive Digital Twin powered by Siemens electronic design automation (EDA) solutions.
Platinum Sponsor
Platinum Sponsor
TSMC created the semiconductor Dedicated IC Foundry business model when it was founded in 1987. In 2024, TSMC served 522 customers and manufactured 11,878 products for various applications covering a variety of end markets including high performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. Annual capacity of the manufacturing facilities managed by TSMC and its subsidiaries is approximately 17 million 12-inch equivalent wafers in 2024.
Gold Sponsor
Gold Sponsor
Advantest is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, high-performance computing (HPC) including artificial intelligence (AI) and machine learning, and more.
Bronze Sponsor
Bronze Sponsor
IPValue fuels innovation by working with leading technology enterprises to unlock value from their patent portfolios. Since 2001, IPValue has generated billions of dollars for its partners, while promoting freedom to operate and other strategic objectives. IPValue currently owns and manages the commercialization of over 10,000 patents. See www.ipvalue.com.
Co-Organizer
Co-Organizer
The semiconductor industry in Taiwan has demonstrated astonishing growth during the past thirty years and become one of the major IC producers in the world. The Taiwan Semiconductor Industry Association (TSIA) was founded in November 1996 to promote the cooperation and further development of Taiwan semiconductor industry.
TSIA has over 190 corporate and associate members, including companies engaged in semiconductor R & D, design, wafer manufacturing, packaging, testing, equipment and materials. TSIA aims to help the semiconductor industry in Taiwan remain on a competitive edge through various domestic and international activities, seminars, symposia, trainings, networking, etc. to strengthen business connection and broaden business scope for its member companies. TSIA also endeavors to build up constructive relationship between the local industry and corresponding international organizations, such as the World Semiconductor Council (WSC), World Semiconductor Trade Statistics (WSTS), JEDEC Solid State Technology Association (JEDEC) to help enhance the competitiveness of Taiwan semiconductor industry as a whole.
Travel

W Hotel, Taipei
10 Zhongxiao East Road, Sec. 5, Xinyi District, Taipei, Taiwan
Taipei, Taiwan,
W Taipei is a five-star luxury hotel in Xinyi District, Taipei, occupying floors 8–31 of the Taipei City Hall Bus Station building.
It has 405 rooms with views of Taipei 101, a rooftop pool, spa, and several upscale dining and bar venues.