The GSA Asia Pacific Executive Forum (APEF) is the Global Semiconductor Alliance’s flagship event in Asia, bringing together over 200 senior executives and thought leaders from across the global semiconductor ecosystem. The 2025 edition, scheduled for November 5 in Taipei, will explore the convergence of AI-driven transformation, supply chain realignment, geopolitical shifts, and emerging technology disruptions.
Under the theme “Strategic Intelligence – Empowering the Semiconductor Era through Design Leadership, AI Innovation, and Global Synergy,” this year’s forum will emphasize the pivotal role of IC design as the brain of technological advancement and the engine behind the intelligent era. The agenda will feature keynote speeches, panel discussions, and executive networking focused on strategy, innovation, and global collaboration.
Infineon
Alexander Gorski
COO and Member of the Management Board
Infineon
Alexander Gorski has served as Chief Operations Officer and a member of the Management Board at Infineon Technologies AG since October 2025. In his current role, he oversees manufacturing, supply chain, procurement, customs, quality management, real estate, and facilities.
Gorski began his career at Infineon (formerly Siemens AG) in 1998, holding various management roles in Supply Chain and Operations until 2006. He later served as Vice President of Sales at Qimonda AG and as a member of the Management Board at Conergy, where he was COO and ultimately Chief Development Officer. Returning to Infineon in 2016, he became Division COO of Power & Sensor Systems, later advancing to EVP of Backend Operations (2021) and EVP of Frontend Operations (2024).
Born in Regensburg, Germany, he earned a master’s degree in finance and business administration from the University of Regensburg.
Alexander Gorski
COO and Member of the Management Board
Infineon
Credo
Bill Brennan
President and CEO
Credo
For more than 25 years, Bill Brennan has been leading and scaling organizations to deliver steady revenue growth and profit. Bill joined Credo in 2013, leading the company to its IPO in January 2022. He has overseen Credo’s growth from a small startup to an organization of more than 500 employees worldwide. Under his stewardship, the company has pioneered revolutionary networking technologies based on Credo’s high-performance, low-power SerDes technology, including Active Electrical Cables (AECs) and Linear Receive Optics (LRO). Bill also supports numerous national and regional nonprofit organizations focused on health, education, and children’s causes.
Before joining Credo, Bill served as Vice President of the Storage Business Unit with Marvell Semiconductor for 11 years. Prior to Marvell, he held sales management positions with NEC and Texas Instruments. Bill received his BSEE degree from the University of Colorado.
Bill Brennan
President and CEO
Credo
Ranovus
Hamid Arabzadeh
Co-founder and CEO
Ranovus
Hamid Arabzadeh is Co-Founder and CEO of RANOVUS, a leader in photonic interconnect solutions enabling AI compute scaling in hyperscale data centers. Under his leadership, RANOVUS pioneered a full-stack co-design approach—spanning lasers, silicon photonics, ICs, and packaging—to deliver the industry’s most power-efficient, cost-effective photonic engines, replacing copper interconnects in large-scale AI infrastructure.
Previously, he was Chairman and CEO of COREOPTICS, a photonic subsystems innovator acquired by Cisco in 2010. Earlier, he held senior leadership roles at Nortel Networks across multiple regions, ultimately serving as VP & GM of the Metro DWDM Optical business unit. Beyond RANOVUS, he co-founded and invests in Canadian scaleups in AI sovereign cloud, cybersecurity, and healthcare.
Arabzadeh holds a B.Sc. in Electrical and Computer Engineering from the University of Waterloo and an MBA from McGill University.
Hamid Arabzadeh
Co-founder and CEO
Ranovus
EY
Josie Ananto
Partner/Principal
EY
Josie Ananto is a Partner in EY Parthenon Transaction Strategy and Execution practice, currently based in Singapore, with extensive experience across the Asia Pacific region. With over 20 years of professional experience in the US and Asia, Josie is a recognized leader in M&A consulting, specializing in operational due diligence, complex integrations, carveouts, divestitures, operating model design, and organizational transformation.
Her expertise spans the technology, manufacturing, and consumer sectors, where she has led major cross-border initiatives, driving cost synergies, business scaling, and operational excellence for Fortune 500 clients.
Josie holds an MBA from Kellogg School of Management, an MS in Management Information Systems from the University of Arizona, and a BBA in Accounting and Finance from the University of Wisconsin.
Josie Ananto
Partner/Principal
EY
Fragomen
Magdalene Tennant
Managing Director
Fragomen
Magdalene is the Managing Director of Fragomen in Hong Kong, with over 30 years of experience helping companies and individuals navigate complex immigration landscapes across the Asia Pacific region. She began her career with the Australian Government, informed by her own journey as a foreign student, which gave her unique insight into the challenges faced by non-native English speakers navigating visa processes.
At Fragomen for more than two decades, Magdalene has advised multinational corporations and individuals on complex immigration matters, including mergers and acquisitions, de-registrations, workforce mobility and contingency planning. She has been instrumental in shaping innovative immigration strategies, collaborating with Hong Kong authorities to design tailored visa solutions that address evolving business needs.
With deep expertise across the Asia Pacific region, Magdalene is recognized for her ability to align immigration strategies with organizational goals, ensuring compliance while enabling workforce agility. She holds a degree from the Australian National University.
Magdalene Tennant
Managing Director
Fragomen
Renesas
Mandali Khalesi
Vice President, AI Platform & Technology
Renesas
Mandali Khalesi is Vice President for AI and Cloud Engineering at Renesas Electronics. He is focused on developing embedded and cloud-based artificial intelligence products for computer vision-heavy SOCs. Our team’s mission is to provide customers with the best tools and software for automotive self-driving, computer vision-centric datacenter and industrial automation applications. Prior to Renesas he was the General Manager and Head of Automated Driving Mobility at Toyota Motor Corporation HQ, helping ship their first self-driving Lexus LS flagship in 2021. He was also Vice President of Automated Driving at Woven by Toyota, Toyota’s self-driving software subsidiary, managing engineering organization growth to 1,700 software and AI engineers.
He is a software executive with over 20 years of experience in the automotive, consumer electronics and smartphone industries. Mandali has a Masters degree in Astrophysics from University College London.
Mandali Khalesi
Vice President, AI Platform & Technology
Renesas
IDC
Mario Morales
Group Vice President, Enabling Technologies and Semiconductors
IDC
Mario Morales is the group vice president of IDC’s enabling technologies, semiconductor, and storage research. He is responsible for in-depth analysis, evaluation of emerging markets and trends, forecasting, and research of major semiconductor industry segments such as embedded and intelligent systems, wireless, personal computing, networking and cloud infrastructure, automotive electronics, and AI semiconductors.
Mr. Morales is a trusted advisor to leading high tech company executives, financial investors, and bankers on market landscape and direction, product and technology positioning, competitive benchmarking, M&A, hardware, and software technology, and brand health and sustainability. He is also the leading advisor and expert analyst for IDC’s largest Wall Street clients including investment banking, VC’s, and mutual and hedge funds across every major financial region.
Over his career, Mr. Morales has authored and co-authored over 240 reports and studies in the area of semiconductors, mobile, PC, wireless, embedded, IoT, and IT marketplace. His career includes past positions with NEC Electronics and Dataquest.
Mario Morales
Group Vice President, Enabling Technologies and Semiconductors
IDC
Movandi
Maryam Rofougaran
Co-founder and CEO
Movandi
Maryam Rofougaran is Cofounder and CEO of Movandi, a leader in 5G mmWave technology, advanced RF chipsets, and complete RF systems enabling the high-performance connectivity essential for AI-driven applications and massive data demands. With over 25 years in the semiconductor and wireless industries, Maryam previously served as Senior VP of Wireless Radios at Broadcom, helping grow its wireless business to over $3 billion annually. She began her career as cofounder of Innovent Systems, the first to deliver market-defining SoC integration for short-range wireless—technology later deployed in billions of devices worldwide after Broadcom’s acquisition.
A prolific inventor with 300+ patents and 58 publications, Maryam earned her B.S. and M.S. in Electrical Engineering from UCLA. Recognized by Inc.’s Most Influential Women and Light Reading’s MVPs, she is a member of the CNBC CEO Council and the Global Semiconductor Alliance CEO Council.
Maryam Rofougaran
Co-founder and CEO
Movandi
Swave Photonics
Mike Noonen
CEO
Swave Photonics
Mike Noonen is CEO of Swave Photonics, B.V., and has 30 years of experience leading technology businesses, resulting in two IPOs and multiple acquisitions. Most recently, he was the CEO of MixComm, Inc. from 2019 until it was acquired by Sivers Semiconductor in early 2022. From 2013 until 2015, Noonen was the Chairman and co-founder of Silicon Catalyst, Inc., the World’s 1st semiconductor incubator and EE Times 2015 Start-up of the Year. Previously, Noonen was:
• EVP, Global Products, Design, Sales, & Marketing at GlobalFoundries
• EVP, Worldwide Sales & Marketing, at NXP Semiconductors, B.V.
• SVP, Global Sales & Marketing at National Semiconductor
In 2013, he was elected to the Global Semiconductor Alliance Board of Directors. He holds a BSEE from Colorado State University and, in 2012, was named the College of Engineering Distinguished Alumni of the Year. Noonen holds multiple patents in the areas of Internet telephony and video communications
Mike Noonen
CEO
Swave Photonics
Celestial AI
Preet Virk
Co-founder and COO
Celestial AI
Preet Virk is a seasoned technology leader with over 35 years of experience building, transforming, and expanding businesses. Preet is the Co-Founder and COO of Celestial AI, The Photonic Fabric company. Prior to Celestial AI, Preet held leadership roles at Macom, Freescale, and Mindspeed Technologies, where he successfully led various networking semiconductor businesses. His career highlights include two successful IPO exits at ViewLogic Systems and Maker Communications.
Known for his ability to build high-performance teams and create successful, profitable businesses, Preet has a proven track record of driving innovation and delivering results. He holds an MSEE and an MBA from Worcester Polytechnic Institute and a BSEE from Thapar Institute of Technology
Preet Virk
Co-founder and COO
Celestial AI
VIP Reception Sponsor
Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.
Platinum Sponsor
TSMC created the semiconductor Dedicated IC Foundry business model when it was founded in 1987. In 2023, TSMC served 528 customers and manufactured 11,895 products for various applications covering a variety of end markets including high performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. Annual capacity of the manufacturing facilities managed by TSMC and its subsidiaries exceeded 16 million 12-inch equivalent wafers in 2023.
Gold Sponsor
Advantest is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, high-performance computing (HPC) including artificial intelligence (AI) and machine learning, and more.
Bronze Sponsor
IPValue fuels innovation by working with leading technology enterprises to unlock value from their patent portfolios. Since 2001, IPValue has generated billions of dollars for its partners, while promoting freedom to operate and other strategic objectives. IPValue currently owns and manages the commercialization of over 10,000 patents. See www.ipvalue.com.