ASE Group (Advanced Semiconductor Engineering) is a global leader in semiconductor manufacturing services, specializing in IC packaging, testing, and system integration. Headquartered in Kaohsiung, Taiwan, ASE provides advanced technologies such as SiP, fan-out, and 3D IC, supporting the world’s leading electronics and semiconductor companies in innovation and production.
The GSA Asia Pacific Executive Forum (APEF) is the Global Semiconductor Alliance’s flagship event in Asia, bringing together over 200 senior executives and thought leaders from across the global semiconductor ecosystem. The 2025 edition, scheduled for November 5 in Taipei, will explore the convergence of AI-driven transformation, supply chain realignment, geopolitical shifts, and emerging technology disruptions.
Under the theme “Strategic Intelligence – Empowering the Semiconductor Era through Design Leadership, AI Innovation, and Global Synergy,” this year’s forum will emphasize the pivotal role of IC design as the brain of technological advancement and the engine behind the intelligent era. The agenda will feature keynote speeches, panel discussions, and executive networking focused on strategy, innovation, and global collaboration.
Seating for this event is limited. If you are interested in participating, please feel free to contact us at any time via email or phone:
E-mail: APevent@gsaglobal.org
Phone: +886 2 2775 3368 #15/#17
Program
All times are in Asia Standard Time (Taiwan Time)
9:00
Registration and Networking Breakfast
10:00
Welcome
Welcome Remarks
- Jodi Shelton / CEO & Co-founder / GSA
- Nicky Lu / Chairman & APAC Leadership Council/ GSA; Chairman, Founder and CEO / Etron Technology
10:15
Presentation
Semiconductor Market Outlook
AI-Driven Growth Despite Uncertainty in Semiconductor Company Leadership, Public Policy, and Sustainable Innovation
The semiconductor industry is in the middle of a strong, concentrated growth cycle, fueled by unprecedented AI infrastructure investments, industry leadership supporting resiliency and long-term vision, and government policies leaning toward relaxing restrictions and collaborating with critical trading partners after the misguided communication on tariffs back in April. The rise of generative AI and large language models (LLMs) is accelerating demand for computing and is pervasive across the cloud and edge, where AI inference is expected to become increasingly disruptive. The semiconductor market is poised for a long, sustainable cycle as the industry is expected to reach $1T in revenues earlier than consensus views. Who are the vendors and technology suppliers that will make the right bets and capitalize on the growth?
- Mario Morales / Vice President / Head of Corporate Strategy and Partnerships
10:35
Keynote
Keynote
- Alexander Gorski / COO and Member of the Management Board / Infineon
10:55
Presentation
Next Generation Intelligent Connectivity
- Maryam Rofugaran / Co-Founder and CEO / Movandi
11:15
Topic
Frontier Technologies in Silicon Photonics
Lighting the Path to the Future of AI Infrastructure
Nearly 60% of data center power today is consumed just moving data rather than processing it, a growing inefficiency that limits scalability, performance, and sustainability. As AI workloads expand, scale-up networks that connect GPUs within a domain are hitting a “power wall,” consuming more power and limiting scale-up domains to a single rack, thus causing rack power densities to increase unsustainably. Roughly 85% of all AI data traffic is scale-up, while only about 15% is scale-out. Solving the scale-up bottleneck is therefore where the greatest gains in efficiency can be achieved.
This talk explores how silicon photonics enables a path beyond these limits. By replacing copper with optical interconnects, data centers can achieve orders of magnitude improvements in reach, bandwidth, energy efficiency, and reliability, turning the bottleneck of data movement into a platform for growth. Presented by Celestial AI Co-Founder and COO Preet Virk, this session will examine industry trends, technology inflection points, and the collaborative innovation required to build the next generation of AI infrastructure.
- Preet Virk / Co-founder and CEO / Celestial AI
How AI, Semiconductors and Photonics Are Coming Together to Create the New Spatial Computing Era
This talk will describe the potential for Spatial Computing and how AI, Semiconductors and Photonics are coming together to make it a reality. As an example, it will highlight how nano-pixels made with phase change material are the beginning of Tunable Photonics with CMOS semiconductor compatibility and economics.
- Mike Noonen / CEO / Swave
Next Generation Data Center Infrastructure
- Hamid Arabzadeh / Chairman and CEO / Ranovus
12:00
Networking Lunch
13:00
Presentation
Keynote
- Bill Brennan / President and CEO / Credo
13:15
Sessions
AI in Action: Redefining Semiconductor Intelligence Across Cloud, Edge, and Design
From Chips to Intelligence: Fueling the AI Landscape
For over 25 years, Amazon’s AI development has evolved beyond internal applications to pioneering innovations across diverse industries. Our work encompasses market-leading technologies—including autonomous robotic warehouses, drone delivery systems, Alexa voice assistants, and Just Walk Out stores—with AWS’s AI capabilities underpinned by advanced semiconductor technology.
With our long time customer serving experiences at AWS, we are capable of designing purpose-built chips for computing and specific AI training and inference needs with a comprehensive partner ecosystem, AWS also accelerates AI advancement while strengthening semiconductor design and verification capabilities, enabling a more efficient AI value chain for businesses of all sizes.
Building on these capabilities, AWS has launched innovative programs in Taiwan to further advance technological integration for the global leading semiconductor and ICT ecosystem. The “Zero-Intervention Program” focuses on leveraging cloud and AI technologies to enhance different connected hardware platforms like drones, robots, and vehicles for its swarm fleet autonomous execution and management capabilities.
- Robert Wang / Managing Director, Taiwan / AWS
The Growing Need for Collaboration Across the Semiconductor Industry - How to Leverage AI and Data Platforms
The semiconductor industry has always thrived on innovation, with multiple companies collaborating to launch the latest breakthrough innovations. Today the semiconductor industry is undergoing a fundamental transformation in how companies collaborate across the global supply chain. Traditionally reliant on isolated development, simple linear handoffs, and limited data sharing through spreadsheets, the industry now faces unprecedented complexity driven by 3D multi-vendor chiplet packaging.
This presentation introduces a new paradigm of AI-driven collaboration built on three foundational pillars. First, a secure data infrastructure leveraging an established network connecting over 300 manufacturing locations and 100+ OEMs, handling exabytes of exchanged data. Second, automated orchestration systems that align and abstract manufacturing data to accelerate business decisions, enabling real-time product costing, order status tracking, quality management, and WIP optimization both within enterprises and across external partners. Third, AI agents that operate autonomously within human-defined governance boundaries to analyze 100% of manufacturing data, addressing the current reality where only 5-10% of data is analyzed and 80% of data scientists’ time is spent on data preparation.
The convergence of these elements enables predictive test solutions, automated quality assurance, and seamless multi-party coordination across the complex semiconductor value chain. By combining human governance with AI execution at scale, the industry can move from reactive, stage-gate collaboration to continuous, data-driven operational excellence that meets the demands of modern semiconductor manufacturing.
- Kimon Michaels / Co-founder, Director, Executive Vice President, Product & Solutions / PDF Solutions
AI Software
- Mandali Khalesi / Vice President, AI Platform & Technology / Renesas
Panel - AI in Action
14:30
Networking Break
15:00
Sessions
Navigating Global Headwinds
Beyond Mega Deals - Rethinking Growth and Capital Allocation Strategies
The global semiconductor industry is on track to surpass $1 trillion in annual demand by 2030, driven by AI advancements and surging market needs. Yet, this growth is shadowed by geopolitical tensions, regulatory scrutiny, and a marked decline in mega M&A deals—prompting a strategic pivot toward supply chain resiliency, talent development, and agile capital allocation. In this new era, companies that anticipate market shifts and build collaborative, regionally anchored ecosystems will capture sustainable growth and shape the future of the semiconductor landscape.
- Josie Ananto / Partner/Principal / EY - Ernst & Young Solutions
Keynote Presentation
- Donghui Lu / Corporate Vice President, Front-end Operations and Head of Micron Taiwan / Micron
Engineering Global Mobility: Building the Talent Bridge for the Semiconductor Era
As the semiconductor industry advances through design innovation and AI integration, global mobility has become central to sustaining growth. Magdalene will examine how immigration policy and talent strategy shape the sector’s competitiveness, with a spotlight on Taiwan’s expanding R&D landscape. She will discuss trends in cross-border hiring, challenges in attracting international talent, and the movement of skilled professionals between key markets — offering insights on how companies can build agile, globally connected teams.
- Magdalene Tennant / Managing Director / Fragomen
Panel - Bridging the Global Talent Gap
16:20
Panel
Executive Panel - Charting the Semiconductor Industry's Path Forward
This high-level discussion brings together senior executives to reflect on the global forces reshaping the semiconductor industry. With the rapid rise of AI, sustainability imperatives, and shifting market dynamics, panelists will share how collaboration across regions and ecosystems can unlock new opportunities for innovation and growth. The conversation will look ahead to how collective leadership, shared investment, and cross-border partnerships can strengthen the industry’s foundation and drive its next era of progress.
Moderator:
Panelists:
Josie Ananto /
Partner/Principal
/
EY
- Alexander Gorski / COO and Member of the Management Board / Infineon
- Bill Brennan / President and CEO / Credo
- Robert Wang / Managing Director, Taiwan / AWS
17:00
Closing Remarks
17:00
VIP Reception
Speakers
Alexander Gorski
Infineon
Alexander Gorski
COO and Member of the Management Board
Infineon
Bill Brennan
Credo
Bill Brennan
President and CEO
Credo
Donghui Lu
Micron
Donghui Lu
Corporate Vice President, Front-End Operations and Head of Micron Taiwan
Micron
Hamid Arabzadeh
Ranovus
Hamid Arabzadeh
Co-founder and CEO
Ranovus
Josie Ananto
EY
Josie Ananto
Partner/Principal
EY
Kimon Michaels
PDF Solutions
Kimon Michaels
Co-founder, EVP of Products & Solutions and Director
PDF Solutions
Magdalene Tennant
Fragomen
Magdalene Tennant
Managing Director
Fragomen
Mandali Khalesi
Renesas
Mandali Khalesi
Vice President, AI Platform & Technology
Renesas
Mario Morales
IDC
Mario Morales
Group Vice President, Enabling Technologies and Semiconductors
IDC
Maryam Rofougaran
Movandi
Maryam Rofougaran
Co-founder and CEO
Movandi
Mike Noonen
Swave Photonics
Mike Noonen
CEO
Swave Photonics
Preet Virk
Celestial AI
Preet Virk
Co-founder and COO
Celestial AI
Robert Wang
AWS
Robert Wang
Managing Director, Taiwan
AWS
Sponsors
VIP Reception Sponsor
Platinum Sponsor
Platinum
Platinum Sponsor
Gold Sponsor
Bronze Sponsor
Co-Organizer
Pricing
Standard Rate
Member
$0
Guests
$590
Travel
W Hotel, Taipei
10 Zhongxiao East Road, Sec. 5, Xinyi District, Taipei, Taiwan
Taipei, Taiwan,
W Taipei is a five-star luxury hotel in Xinyi District, Taipei, occupying floors 8–31 of the Taipei City Hall Bus Station building.
It has 405 rooms with views of Taipei 101, a rooftop pool, spa, and several upscale dining and bar venues.