DECEMBER 7
                      SANTA CLARA CONVENTION CENTER
                      5001 GREAT AMERICA PKWY.
                      SANTA CLARA, CA 95054
                    
                  GSA recognizes semiconductor companies that have demonstrated excellence through their success, vision, strategy and future opportunities in the industry at its annual Awards Dinner Celebration. It is an honor to be selected as a nominee and an even more distinguished achievement to win a GSA Award.
AWARDS
Individual Awards
Dr. Morris Chang Exemplary Leadership Award
The Dr. Morris Chang Exemplary Leadership Award recognizes individuals, such as its namesake, Dr. Morris Chang, for their exceptional contributions to drive the development, innovation, growth, and long-term opportunities for the semiconductor industry.
2023 DR. MORRIS CHANG EXEMPLARY LEADERSHIP AWARD RECIPIENT
                                                Rick Tsai
CEO & Vice Chairman ,
                                                  MediaTek
                                              
                                                
												                        Dr. Rick (Lih Shyng) Tsai is
                                                the CEO and Vice Chairman of
                                                MediaTek, where he oversees
                                                worldwide businesses, product
                                                strategies, technology,
                                                engineering, research and
                                                development, manufacturing
                                                operations, and information
                                                technology. Dr. Tsai has
                                                cemented MediaTek as a leader
                                                across a wide variety of market
                                                segments and has driven the
                                                company to record revenue. Under
                                                his leadership MediaTek has
                                                increased its mobile market
                                                share to become the No. 1
                                                provider for smartphone SoCs.
                                                Not only has MediaTek grown its
                                                global mobile market share, but
                                                the company has significantly
                                                expanded its presence in the
                                                U.S., Europe, and Japan.
                                                MediaTek is also the leader for
                                                smart TVs, voice assistants,
                                                Arm-based Chromebooks, and
                                                Android tablets, in addition to
                                                being the No. 1 Wi-Fi supplier
                                                across broadband, retail
                                                routers, consumer electronics
                                                devices, and gaming. In total,
                                                MediaTek powers more than two
                                                billion devices a year and its
                                                technology is in more than
                                                one-in-five homes around the
                                                world.
                                              
Before joining MediaTek in 2017, Dr. Tsai served as chairman of Chunghwa Telecom, Taiwan’s largest telecommunications service provider. Prior to that, Dr. Tsai worked at Taiwan Semiconductor Manufacturing Company (TSMC) as President and CEO from 2005 to 2009. Before being appointed CEO, he served in other roles at TSMC including COO, Vice President of Worldwide Marketing and Sales, and two terms as Executive Vice President of Operations. Between these two terms, Dr. Tsai was President of Vanguard International Semiconductor, a specialty IC foundry service provider. Dr. Tsai received his bachelor’s degree of science in physics from National Taiwan University in Taipei and holds a Ph.D. in materials science and engineering from Cornell University.
Rising Women of Influence Award
The Rising Women of Influence Award recognizes and profiles the next generation of women leaders in the semiconductor industry. Companies were encouraged to identify women with a technical background and education within their organization that they believe will be one of their key corporate executives over the next three or four years. Nominations were reviewed by an all-female executive committee that selected the top four candidates for recognition at the GSA Annual Awards Celebration.
2023 RISING WOMEN OF INFLUENCE WINNER
NOMINEES
                                                Thy Tran - WINNER
Vice President of Global Frontend Procurement
Micron Technology, Inc.
Thy Tran, Vice President of Global Frontend Procurement at Micron Technology, Inc., recently transitioned from her prior role as VP of DRAM Process Integration where she led a global team in the US and Asia to drive DRAM technology development…
Thy Tran
Vice President of Global Frontend Procurement
Thy Tran, Vice President of Global Frontend Procurement at Micron Technology, Inc., recently transitioned from her prior role as VP of DRAM Process Integration where she led a global team in the US and Asia to drive DRAM technology development and transfer into high-volume manufacturing fabs. She has nearly 30 years of semiconductor experience working in the US, Europe, and Asia, including two semiconductor fab startups.
Ms. Tran joined Micron in 2008 and led several DRAM module development programs including Advanced Capacitor, Metallization, and Through-Silicon-Via (TSV) integration before taking on the DRAM Process Integration node leadership role for several generations. Her technical contribution has been integral to Micron’s DRAM Technology Development Roadmap and played a significant role in helping Micron achieve DRAM technology leadership. Prior to Micron, Ms. Tran worked on Logic and SRAM technologies at Motorola, Inc. and SRAM at WaferTech, LLC. At Siemens, AG., which later spun off to Infineon and Qimonda, AG. she held several leadership roles in DRAM technology development transfer, and manufacturing.
Ms. Tran graduated from the University of Washington with a Bachelor of Science in Electrical Engineering. She is a recent alumnus of the Stanford Graduate School of Business’s Executive Program and the McKinsey Executive Leadership Program. She is a senior member of IEEE, member of the Society of Women Engineers, and serves as a Strategic Advisory board member for the University of Washington’s Electrical and Computer Engineering department, International Semiconductor Executive Summit, and Mercado Global.
                                                Hui Peng Koh
VP & GM Fab Management
GlobalFoundries
Hui Peng Koh is Vice President and General Manager of GF’s New York advanced semiconductor facility, a position she was appointed to in May 2023. Ms. Koh brings more than 23 years of…
Hui Peng Koh
Vice President and General Manager, GlobalFoundries New York
Hui Peng Koh is Vice President and General Manager of GF’s New York advanced semiconductor facility, a position she was appointed to in May 2023. Ms. Koh brings more than 23 years of extensive experience in semiconductor research, development, and high-volume manufacturing and global leadership with multi-national organizational management. She specializes in equipment and process engineering innovation and large-scale operational performance and cost management and has a proven track record of delivering transformative business results and developing strong workforce talent pools.
Ms. Koh started her career in 2000 as a lithography process development engineer at GF’s Singapore facility. After delivering multiple successful new technology nodes in Singapore, Ms. Koh relocated to the United States in 2011 to lead a research program for GF in EUV lithography in Albany, N.Y.
During her tenure at the Malta, New York site, Ms. Koh expanded her fab leadership portfolio as a module engineering executive since 2015 and more recently as vice president of engineering. She has successfully ramped up the site, executing GF’s pivot to the diversification of product and customer landscape, with year-over-year capacity/revenue growth as well as record operational/cost performance achievement.
Ms. Koh holds a master’s degree in materials engineering from Nanyang Technical University Singapore.
                                                Rozi Roufoogaran
Sr. Director of RFIC Engineering
NXP Semiconductors
Rozi Roufoogaran is the Senior Director of RFIC Engineering at NXP, leading the Ultra-Wideband technology radio development. The products she has lead are shipping today in many of the tier 1 m…
Rozi Roufoogaran
Sr. Director of RFIC Engineering, NXP Semiconductors
Rozi Roufoogaran is the Senior Director of RFIC Engineering at NXP, leading the Ultra-Wideband technology radio development. The products she has lead are shipping today in many of the tier 1 mobile handset companies and numerous IOT devices. Prior to NXP, she was the VP of Semiconductor Engineering at Ethertronics Inc, a startup acquired by AVX corporation in Jan 2018, where she lead the team responsible for their innovative line of active antenna products. Before Ethertronics, she held a number of senior management positions during her 17 years at Broadcom Ltd, responsible for the design and development of CMOS RF and analog circuits for varieties of wireless communication standards, including Bluetooth, Zigbee, WLAN, FM radio, and GPS. Rozi joined Broadcom in 2000 after Innovent Systems, the first company to develop single chip CMOS RF devices, was acquired by Broadcom. The innovations she has pioneered are still part of numerous chips shipping in the billions of units at Broadcom.
Rozi received her M.S. degree in Electrical Engineering from UCLA. She is the co-author of 15 journal and conference papers and is an inventor or co-inventor of over 22 patents.
Rozi volunteers as a leader of the programs and projects committee at GSA’s women’s initiatives. She is also involved with ECE alumnae advisory committee at UCLA.
                                                Johanna Swan
Intel Fellow, Director of Package Research and Systems Solutions in Components Research within Technology Development
Intel Corporation
Johanna M. Swan is an Intel Fellow and the Director of Package Research and Systems Solutions in Components Research within Technology Development at Intel Corporation. She leads a multidisciplinary team of researchers charged with…
Johanna M. Swan
Intel Fellow, Director of Package Research and Systems Solutions in Components Research within Technology Development
                                                            Johanna M. Swan is
                                                            an Intel Fellow and
                                                            the Director of
                                                            Package Research and
                                                            Systems Solutions in
                                                            Components Research
                                                            within Technology
                                                            Development at Intel
                                                            Corporation. She
                                                            leads a
                                                            multidisciplinary
                                                            team of researchers
                                                            charged with
                                                            developing novel
                                                            technologies and
                                                            package
                                                            architectures to
                                                            enable continued
                                                            semiconductor
                                                            scaling, mm-wave
                                                            communications at
                                                            various length
                                                            scales and
                                                            differentiating
                                                            capabilities within
                                                            packaging.
An
                                                            expert in advanced
                                                            electronic packaging
                                                            technologies, Swan
                                                            began her Intel
                                                            career in 2000,
                                                            focusing initially
                                                            on packaging
                                                            solutions for
                                                            wireless, cellular
                                                            and memory products.
                                                            She initiated
                                                            Intel’s first
                                                            through silicon via
                                                            (TSV) die stacking
                                                            program and led
                                                            research in early
                                                            TSV architectures.
                                                            She and her team
                                                            also developed a
                                                            stacked-package
                                                            chip-scale package
                                                            (CSP) and a
                                                            mixed-technology
                                                            CSP. Since assuming
                                                            her current role in
                                                            2006, Swan and her
                                                            team have pioneered
                                                            numerous innovative
                                                            packaging
                                                            technologies,
                                                            including a
                                                            multi-die
                                                            interconnect silicon
                                                            bridge and an
                                                            associated enabling
                                                            printing solution
                                                            (EMIB) as well as
                                                            more recent
                                                            technologies such as
                                                            Foveros Omni (ODI).
                                                             She holds over 300
                                                            patents worldwide
                                                            primarily in the
                                                            field of electronic
                                                            packaging.  Before
                                                            joining Intel, Swan
                                                            spent 16 years at
                                                            Lawrence Livermore
                                                            National Lab (LLNL)
                                                            and specific to the
                                                            semiconductor
                                                            industry she
                                                            designed and
                                                            developed a visible
                                                            light alignment
                                                            system for the
                                                            Extreme Ultraviolet
                                                            Lithography (EUVL)
                                                            projection optics as
                                                            part of the joint
                                                            Virtual National
                                                            Labs EUVL program.
                                                            She holds a Bachelor
                                                            of Science in
                                                            Mechanical
                                                            Engineering.
                                                          
Private Company Awards
Start-Up to Watch Award
GSA’s Private Awards Committee, comprised of venture capitalists and select serial entrepreneurs in the industry, selects up to two winners for the Start-Up to Watch award by identifying the semiconductor company (or companies) that demonstrates the potential to positively change its market or the semiconductor industry, in general, through the innovative use of semiconductor technology or a new application for semiconductor technology.
Criteria:
- Company must be a semiconductor company.
 - Company must be privately held.
 - Company must NOT have achieved greater than or equal to $20 million of cumulative product revenue (i.e., cumulative product revenue since market introduction).
 
Nominees:
- AmberSemi
 - Celestial AI
 - Lightelligence
 - SiMa.ai – WINNER
 
Most Respected Private Semiconductor Company Award
The industry’s Most Respected Private Semiconductor Company award is designed to identify the private company garnering the most respect from the industry in terms of its products, vision and future opportunity. GSA’s Private Awards Committee reviews all private semiconductor companies, conducts analysis of each company’s performance and likelihood of long-term success, and provides a list of respectable private companies to be voted on by GSA membership. On-line voting takes place to allow GSA members, including semiconductor companies and partners, to cast a ballot for the private semiconductor company they most respect. The selected companies are based on the Committee’s Criteria.
Criteria:
- Company must be a semiconductor company.
 - Company must be privately held.
 - Company must have achieved a minimum of $20 million of cumulative product revenue (i.e., cumulative product revenue since market introduction).
 
Nominees:
- Astera Labs – WINNER
 - Cerebras Systems
 - SiFive
 
Public Company Awards
All public company awards are determined by GSA using public financial data; therefore, nomination forms are unnecessary.
Most Respected Public Semiconductor Company Awards
The industry’s Most Respected Public Semiconductor Company Awards are designed to identify the public companies garnering the most respect from the industry in terms of its products, vision and future opportunities. GSA reviews the criteria below for all publicly traded semiconductor companies for two 12-month periods using preceding quarters Q3, Q4, Q1, and Q2. All companies that meet these criteria are segmented into four separate revenue groups and each GSA member company votes for a single winner of the Most Respected Public Semiconductor Company for each group.
- All publicly traded semiconductor companies
 - Company must report $100M or more in total Revenue for each of the two 12-month periods
 - Stock price must be greater than $1 USD on JUN 30 for each of the two 12-month periods (applies to U.S.-listed companies only)
 - Company must have a Market Capitalization of $250M or more on JUN 30 for each of the two 12-month periods
 - YoY company revenue growth must be greater than YoY industry revenue growth for the last two 12-month periods
 
Most Respected Public Semiconductor Company Revenue Groups:
- 
                                                  Achieving >$5 Billion in
                                                  Annual Sales
 - 
                                                    Nominees:
 - AMD
 - NVIDIA – WINNER
 - STMicroelectronics
 
- 
                                                  
 - 
                                                      
 - 
                                                  Achieving $1 Billion to $5
                                                  Billion in Annual Sales
 - 
                                                    Nominees:
 - Allegro MicroSystems
 - Monolithic Power Systems
 - Silicon Labs – WINNER
 
- 
                                                  Achieving $500 Million to $1
                                                  Billion in Annual Sales
 - 
                                                    Nominees:
 - Lattice Semiconductor – WINNER
 - MACOM Technology Solutions, Inc.
 - Nordic Semiconductor
 - Wolfspeed
 
- 
                                                  Achieving $100 Million to $500
                                                  Million in Annual Sales
 - 
                                                    Nominees:
 - Ambarella
 - Credo Technology Group
 - Rambus – WINNER
 
Best Financially Managed Semiconductor Company Award
The Best Financially Managed Semiconductor Company Award is derived based on a broad evaluation of the financial health and performance of public semiconductor companies. Numerous financial metrics as well as their respective rates of change or year-over-year improvement are analyzed. These financial metrics transverse various categories including but not limited to growth rates, margins, cash flow, profitability ratios, efficiency ratios and return on capital. All companies are ranked on each metric as well as its rate of change, and then the overall performance is compared to the peer universe to determine the winner.
This award has two categories:
- 
                                                  Achieving Greater than $1
                                                  Billion in Annual Sales
 - 
                                                    Nominees:
 - Broadcom
 - NVIDIA – WINNER
 - STMicroelectronics
 
- 
                                                  
 - 
                                                      
 - 
                                                  Achieving Up to $1 Billion in
                                                  Annual Sales
 - 
                                                    Nominees:
 - Lattice Semiconductor – WINNER
 - MACOM Technology Solutions, Inc.
 - Melexis
 
Analyst Favorite Semiconductor Company Award
Semiconductor financial analysts from top-tier firms select their favorite semiconductor company for this award. The analysts base their decision on historical, as well as projected data, such as stock price, earnings per share, revenue forecasts and product performance.
                                                Nominees:
(Chosen by managing
                                                director Quinn Bolton of Needham
                                                & Company, LLC)
                                              
- Credo Technology Group – WINNER
 - Lattice Semiconductor
 - Navitas Semiconductor
 
                                                Nominees:
(Chosen by managing
                                                director Mark Lipacis of
                                                Jefferies, LLC)
                                              
- MACOM Technology Solutions, Inc. – WINNER
 - onsemi
 - Rambus
 
Regional Awards
As a global alliance, GSA introduced an award specifically for the Europe/Middle East/Africa (EMEA) and Asia-Pacific (APAC) regions. The awards will recognize a semiconductor company headquartered in each respective region that clearly demonstrates the most strength when measuring products, vision, leadership and success in the marketplace. GSA’s APAC and EMEA Leadership Councils will determine the nominees and the winners of their respective regions.
- 
                                                  Outstanding Asia-Pacific
                                                    Semiconductor Company
                                                    Award
- 
                                                      Nominees:
- MediaTek – WINNER
 - Renesas Electronics Corporation
 - Samsung Semiconductor
 
 
 - 
                                                      Nominees:
 
- 
                                                  Outstanding EMEA
                                                    Semiconductor Company
                                                    Award
- 
                                                      Nominees:
- Infineon Technologies
 - NXP Semiconductors
 - Robert Bosch GmbH – WINNER
 - STMicroelectronics
 
 
 - 
                                                      Nominees:
 
2023 HIGHLIGHTS
REGISTRATION
STANDARD RATE September 15 - November 16
- 
                          Seat (Member) $300
 - 
                          Seat (Non-Member) $499
 - 
                          Table (Member) $2900
 - 
                          Table (Non-Member) $4000
 
LATE/ONSITE RATE November 17 - December 6
- 
                          Seat (Member) $400
 - 
                          Seat (Non-Member) $599
 - 
                          Table* (Member) $3600
 - 
                          Table* (Non-Member) $4700
 
*Tables include 10 seats
TRAVEL
To help make your experience as convenient as possible, GSA has arranged a special room rate at the Avatar Hotel for attendees of the 2022 GSA Awards Dinner Celebration. Please contact the Awards Registration Team at any time if you have questions about travel arrangements.
ADDITIONAL HOTEL OPTIONS
GSA’s preferred hotel for the 2023 Awards Dinner Celebration is the Hyatt Regency Santa Clara.
5001 Great America Pkwy
Santa Clara, CA 95054
                        The GSA rate block is currently full.
Click here to book with the Hyatt at their normal
                          rate.
                      
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Start Up To Watch AWARD SPONSOR
Most Respected Private Company
Most respected Public Company award (Greater than $5b in sales)
Most respected Public Company award (between $1- 5b in sales)
Most respected Public Company award (between $500m - $1b in sales)
Most respected Public Company award (between $100m - $500M in sales)
Most Respected Private Company Award Sponsor
APAC Outstanding Awards Sponsor
Most Respected Public Company (Over $5B)
Most Respected Public Company ($1B-$5B)
Most Respected Public Company ($500M-$1B)
Most Respected Public Company ($100M-$500M)
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