Member News

eSilicon Brings Virtualization to Online Portal

San Jose, Calif. (2015-05-19) eSilicon Corporation announced its second-generation online ASIC design and manufacturing platform. Named eSilicon STAR (self-service, transparent, accurate, real-time), the platform supports eSilicon's existing IP browsing, instant quoting and work-in-process tracking capabilities along with a new chip optimization offering that leverages design virtualization technology.

Sidense Announces New Chief Financial Officer

Ottawa, Canada (2015-05-15) Sidense Corp. announces Bob Daly as the company's Chief Financial Officer.

Blue Danube Systems Raises $16 Million in Series B Funding, Includes a Strategic Investment from AT&T

Mountain View, CA (2015-05-12) Blue Danube Systems, a provider of mobile wireless access solutions that significantly and cost-effectively increase network capacity and enhance quality of service, today announced that it closed $16 million in Series B funding. Previous investor Sequoia Capital and new investor Northgate participated in the round, which also includes a strategic investment by AT&T that will help accelerate early product testing and deployment. To date, Blue Danube has raised a total of $23.7 million in equity ...

Sondrel Release Helium 8: A Design Flow Delivering Low Power in Advanced Nodes

Reading, UK (2015-05-05) Sondrel today announced the release of Helium 8, a new design flow & technique developed to deliver low power on large area advanced node chip designs. A recent large area (>500mmsq) chip project completed using the tools and techniques incorporated into Helium 8 produced a dynamic power saving of 20% over the design-ready flow provided by the EDA vendor, as well as achieving a significant reduction of the leakage power through the design of multi-voltage and supply island groups. The ...

Renesas' Kofu Technology Campus Available for Sale - Initial Bid Due Date is July 8th, 2015

Seattle, WA (2015-05-04) ATREG, Inc., which specializes in helping global companies dispose of infrastructure-rich advanced technology manufacturing assets, announced today in conjunction with Cushman & Wakefield, K.K. that the initial bid due date for the sale of Renesas Electronics Corporation's 23.4-acre Kofu technology campus located in the Yamanashi Prefecture, Japan is July 8th, 2015. All qualified parties interested in purchasing part or all of this campus are invited to express their intent with Renesas' ...

ams launches world's smallest ambient light sensor for next generation thinner wearable products

Unterpremstaetten (2015-04-29) Integrated on-chip interference filters reject IR producing a near-photopic response Unterpremstaetten, Austria (29 April, 2015), ams AG (SIX: AMS), a leading provider of high perfor-mance sensors and analog ICs, today introduced the TSL2584TSV, an ambient light sensor (ALS) in a through-silicon via (TSV) package which has a footprint of just 1.145 x 1.66 mm and a height of 0.32 mm. In display management applications, automatically controlling the backlight intensity with an ALS ensures ...

eSilicon's Javier DeLaCruz to Present: Cost Structure Advantages of 2.5D Integration

San Jose, California (2015-04-29) Javier DeLaCruz, senior director of product strategy, will be presenting at the 2015 IMAPS symposium. Javier will be discussing the cost structure advantages of 2.5D integration

Sidense Webinar on Memory Considerations for the Smart Connected Universe

Ottawa and San Jose (2015-04-28) Attend the Sidense Webinar on May 6 and learn how your Smart Connected design can benefit from Sidense's 1T-OTP memory IP.

SWS Enables First Sensor's Accelerometers and Inclinometers

Cairo, Egypt (2015-04-23) High Performance Inertial Sensing ASIC Continues to Deliver Best in Class Performance CAIRO, Egypt - April 23, 2015 - Si-Ware Systems (SWS), a premier provider of IC- and MEMS-based solutions for industrial and consumer applications, is supplying its SWS1110, high performance inertial sensing conditioning ASIC, for First Sensor's new line of accelerometers and inclinometers.

Longer run-times in view for single-cell li-ion battery applications as ams launches 96%-efficient 1A buck converter

Unterpremstaetten (2015-04-22) New AS1382's tiny footprint and 4MHz switching frequency enable implementation of very small power circuits in mobile phones and wearables Unterpremstaetten, Austria (22 April, 2015), ams AG (SIX: AMS), a leading provider of high perfor-mance sensors and analog ICs, today introduced a 1A synchronous buck converter with the wide input voltage range, high efficiency and low stand-by current required in designs powered by a single-cell lithium-ion battery. The new AS1382 step-down ...

NCAP China and Brite Semiconductor R&D Partnership for Complex System Packaging Solutions

Shanghai, China (2015-04-21) Collaborative innovation in China for next generation SoC and SiP solutions April 21st, 2015. Shanghai, China. The National Center for Advanced Packaging Co., Ltd. ("NCAP China"), a company dedicated to developing and commercializing advanced packaging and system integration technologies, has joined with Brite Semiconductor, an emerging ASIC design services firm headquartered in Shanghai, China, to announce a research and development (R&D) collaboration targeting single and multi-die ...

Frost and Sullivan "Movers & Shakers" Interview with Semitrex

San Antonio, TX (2015-04-17) Michael serves as Semitrex's CEO/CTO and is the founding inventor of its new technology, which changes the power conversion dynamic by bringing over 90% efficiencies to the market in a single module. Michael's inventions and business acumen have been the foundation for numerous successful start-up companies over the last twenty-five years. He holds multiple issued patents in the mobile video, RFID, smart grid, power supply industries, and nanotechnology Sectors. He co-invented a two-time Emmy ...

Unisem Announces Participation in Upcoming April and May Conferences

Sunnyvale, California (2015-04-16) Unisem, a global provider of semiconductor assembly and test services, today announced that it will be exhibiting at the following upcoming conferences: MEMS Industry Group's MEMS Technical Congress 2015 on May 6-7 in Boston, MA. MEMS Journal's Automotive Sensors and Electronics Expo 2015 on May 20 in Detroit, MI. MEPTEC MEMS Tech Symposium on May 20 in San Jose, CA. MEPTEC Internet of Things Symposium on May 21 in San Jose, CA. The company will also be participating but not ...

AMS' Unveils Specialty Sensor Technology Portfolio Optimized For IoT Applications

Unterpremstaetten (2015-04-15) Complete turnkey offering for complex sensor solutions boosts time to market and provides proven route to silicon for foundry customers Unterpremstaetten, Austria (April 15, 2015), The Full Service Foundry division of ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, today presented at the GSA Silicon Summit 2015 its comprehensive sensor technology and solutions portfolio which provides foundry customers a complete tool set to develop advanced sensor ...

The Internet of Things (IoT): Exploring revenue generating use cases

Silicon Valley, CA (2015-04-10) Discover the key takeaways from a recent convening of IoT thought leaders designed to explore how organizations can make the leap to revenue generation through IoT technologies.

TSMC March Sales Rise 15%

(2015-04-10) Pure-play IC foundry Taiwan Semiconductor Manufacturing Company (TSMC) has reported consolidated revenues of NT$72.27 billion (US$2.32 billion) for March 2015, up 15.4% on month and 44.7% on year.

MStar to Acquire Alpha for NT$37 Per Share

(2015-04-09) Eyeing IoT and image sensor chip business opportunities, MStar Semiconductor plans to acquire Alpha Imaging Technology for a total of NT$2.07 billion (US$66.37 million).

MediaTek March Sales Rebound

(2015-04-09) MediaTek saw its March revenues soar almost 111% sequentially to more than NT$20 billion (US$642 million). Revenues for the first quarter of 2015 came in line with the company's guidance.

Withings room monitor helps keep air quality high indoors thanks to MEMS VOC gas sensor from ams

Unterpremstaetten (2015-04-08) Unterpremstaetten, Austria (8 April 2015), ams AG (SIX: AMS), a leading provider of high perfor-mance sensors and analog ICs, today announced that it is supplying its AS-MLV-P2 MEMS gas sensor component for VOC (volatile organic compound) detection to Withings for use in its innova-tive new Home monitoring system. Accurate, small and power-efficient, the AS-MLV-P2 sensor produces a precisely varying re-sistance in response to changes in ambient levels of pollutants commonly found in indoor ...

Intel Targets Smartglasses with Swiss Start-Ups Buyout

(2015-04-07) Intel Corp. is on a buying spree. The x86 giant has acquired two start-ups: Lemoptix SA, a provider of scanning micromirror technology, and Composyt Light Labs SA, known for developing a see-through display.

Cavendish Kinetics Adopts STATS ChipPAC's Wafer Level Technology for its SmarTune RF MEMS Tuners

Singapore and San Jose, California (2015-04-07) Cavendish Kinetics, a leading provider of high performance RF MEMS tuning solutions for LTE smartphones and wearable devices, has adopted STATS ChipPAC's advanced wafer level packaging technology to deliver Cavendish's SmarTune™ RF MEMS tuners in the smallest possible form factor, as a 2 mm2 chip scale package. LTE smartphone OEMs are rapidly adopting antenna tuning solutions to be able to provide the required signal strength across the large number of LTE spectrum bands used globally. ...

Apply Today for Deloitte's 2015 Technology Fast 500

Silicon Valley (2015-04-03) Apply Today for Deloitte's 2015 Technology Fast 500, an annual ranking of the 500 fastest growing technology companies in the North America based on percentage revenue growth over 3 years. Being recognized as a Fast 500 winner has its benefits! It provides increased visibility to investors, customers and employees; brand recognition through local, national, global and social media exposure; and valued networking opportunities with industry peers. The application period is open through June 26, ...

M31 Offers Low-Voltage and Low-Power Physical IP Solutions for TSMC 55ULP Technology Targeting IoT Applications

Hsinchu, Taiwan (2015-03-31) Hsinchu, Taiwan, March 31, 2015 -- M31 Technology, a global silicon intellectual property (SIP) provider, today announced the availability of its low-voltage and low-power physical IP solutions on TSMC 55nm ultra-low power process technology. The platform provides system-on-a-chip (SoC) designers with significantly competitive low-power advantages for Internet of Things (IoT) applications. IoT products include wearables, robotic equipment and even machine-to-machine automatic control systems. ...

Sidense Exhibiting at TSMC 2015 North American Technology Symposiums

Ottawa, Canada (2015-03-27) Sidense will be exhibiting at the North American TMSC Technology Symposiums (San Jose, CA, Austin, TX and Boston, MA), discussing its low-cost, secure and reliable 1T-OTP non-volatile memory (NVM) IP, available from 180nm to 20nm including HV and BCD process nodes.

Sidense Increases its Coverage of the Popular 28nm Node

Ottawa Canada (2015-03-26) Sidense Corp. announced that the Company's SHF 1T-OTP macros for GLOBALFOUNDRIES 28nm HPP and SLP processes have met all of GLOBALFOUNDRIES qualification requirements.

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