Member News

SK hynix, Inc., Amkor Technology, Inc., eSilicon, Northwest Logic and Avery Design Systems Announce "Start your HBM/2.5D Design Today" Seminar

San Jose, California (2016-02-04) SK hynix, Amkor Technology, eSilicon, Northwest Logic and Avery Design Systems have joined forces to offer a complete High Bandwidth Memory (HBM) supply chain solution.

Innovative Logic Inc. and M31 Technology Introduce a USB-IF Certified Complete SuperSpeed USB 3.0/2.0 Dual Role IP Solution

Innovative Logic, San Jose, CA / M31 Technology, Hsinchu, Taiwan (2016-01-28) Innovative Logic Inc. (Inno-Logic,, a leading provider of reusable standard based Intellectual Property (IP) and ASIC, FPGA, and Embedded Systems services, together with M31 Technology, a global Intellectual Property (IP) boutique, jointly announce certification completion of its USB 3.0 dual role device and host controller IP. Inno-Logic's USB3.0 host controller along with PHY from M31 Technology again successfully passed all compliance tests and received certification ...

Baikal Electronics Reveals Product Roadmap

Moscow, Russia (2016-01-27) Baikal Electronics, a Russian semiconductor company, has announced it will create high-performance ARM-based CPUs designed for future products ranging from embedded systems to personal computers and servers. The company's roadmap covers the period until 2017 and includes three product lines in addition to the existing products. The CPUs, to be delivered before the end of 2017, will be manufactured using a 28nm process technology. Products delivered after 2017 will be based on 16nm ...

Baikal Electronics and BaseALT collaborate on Linux operating system distribution for ARMv8 architecture

Moscow, Russia (2016-01-26) Baikal Electronics, a Russian semiconductor company, and BaseALT software company have jointly announced their cooperation in system and application software development to create fully functional software for ARMv8 (AArch64) based computer systems. Linux operation system releases for both server and client hosts will be published until the end of 2016. Today this cooperation has resulted in build system and package repository for ARMv8 (AArch64) based Baikal-M CPU. Engineering samples of ...

Palma Ceia SemiDesign Selected by LG Electronics to Provide Analog IP for Advanced WiFi

Los Altos, California (2016-01-24) Palma Ceia SemiDesign ("PCS"), a provider of analog and RF IP for next-generation WiFi and mobile communications, today announced LG Electronics has selected Palma Ceia as its IP partner in the development of next-generation WiFi chipsets. "Partnering with LG Electronics is a significant opportunity to work on the most advanced WiFi technologies under development with an international leader in consumer electronics, appliances and mobile devices," said Roy E. Jewell, president & CEO ...

Sidense Hires Industry Veteran Ken Wagner as Senior VP Engineering

Ottawa (2016-01-21) Sidense Corp., a leading developer of Non-Volatile Memory (NVM) One Time Programmable (OTP) IP cores, today announced that Ken Wagner has joined Sidense as the Company's Senior Vice President of Engineering. Ken will be reporting to Sidense President and CEO Xerxes Wania and will assume responsibility for all of Sidense's engineering activities.

3D opportunity for technology, media, and telecommunications: Additive manufacturing explores new terrain

San Jose, CA (2016-01-19) To date, Additive Manufacturing (AM) is predominantly applied in rapid prototyping and tooling, rather than the production of end-use products. However, backed by recent advances, AM solution providers within the technology, media and telecommunications (TMT) sectors--companies which supply the materials, devices, software, content, and services used by manufacturers implementing AM--can meaningfully alter the adoption curve of AM. These companies can provide an array of options to help ...

Cognitive technologies in the technology sector: From science fiction vision to real-world value

San Jose, CA (2016-01-15) The technology sector’s interest in cognitive technologies is reaching fever pitch. Here’s how some tech companies are using cognitive technologies to create innovative new products and services, pursue new markets, and even reimagine their businesses.

Brite Semiconductor Brings Audio/Voice DSP Reference Design Platform to Low-Power 'Smart and Connected' Devices

Shanghai, China (2016-01-15) The Audio/Voice DSP Reference Design Platform, developed based on a CEVA-TeakLite-4 DSP core, combines multiple sensing, processing and connectivity technologies, enabling rapid system prototyping for mobile, wearable and smart home to reduce risks and time-to-market of SoC designs. Shanghai, China--January 15, 2016--Brite Semiconductor, a leading ASIC design and turnkey service provider headquartered in Shanghai, China, today introduced Audio/Voice DSP Reference Design Platform to accelerate ...

2016 Technology Industry Outlook

San Jose, CA (2016-01-13) Technology is not only fueling major business transformation across industries, it's also changing how technology enterprises sell their products and services, operate, and plan for future growth, says Paul Sallomi, Global Technology, Media & Telecommunications Industry leader and US and Global Technology Sector leader.

DSP Group Unveils SparkPA, Highest RF Transmit Power CMOS Power Amplifier (PA) for 802.11ac Access Points using TSMC Standard CMOS Process

LOS ALTOS, Calif. (2016-01-05) SparkPA - a revolutionary RF Power Amplifier (PA) for the high performance and technically challenging 802.11ac Access Point market, using a standard CMOS Process from TSMC (TWSE: 2330, NYSE: TSM) was officially launched! Leveraging a decade of DSP Group's core expertise in RF and CMOS PA technology, SparkPA achieves more than 100mW of output power at -35db EVM and more than 50 mW at -40db EVM with excellent stability over temperature. When incorporated into access points, SparkPA has ...

New 16-channel LED backlight controller from ams improves TV picture quality and saves power

Austria (2015-12-16) AS3824 controller enables independent, flexible PWM control of each of 16 LED chan-nels for local dimming and true reproduction of the darkest shades of black Unterpremstaetten, Austria (16 December, 2015), ams AG (SIX: AMS), a leading provider of high performance sensors and analog ICs, today introduced the AS3824, a 16-channel LED TV backlight controller which performs local dimming of sections of a display screen to provide both improved picture quality and valuable power savings of up to ...

KPMG's Semiconductor Global Webcast on Thursday December 10, 2015 - REGISTER HERE!

New York, New York (2015-12-10) This Webcast will present the findings of KPMG's eleventh annual global semiconductor industry survey. Semiconductor executives share their perspectives on future revenue, profitability, growth sectors, capital spending, workforce changes, M&A activity and other topics. The Webcast will provide insight into the forces shaping the future of the industry as well as the bellwether KPMG Semiconductor Industry Confidence Index.

Sunflower Mission Awards 59 University Scholarships to Vietnam's Future Engineers

HO CHI MINH CITY, VIETNAM (2015-12-10) Corporate sponsor, eSilicon, announced that the Sunflower Mission presented a total of 59 university scholarships to engineering and technology students in HCMC and Da Nang.

New Komfy Switch with camera by D-Link features ams gas sensor for accurate air quality measurements

Austria (2015-12-09) Unterpremstaetten, Austria (9 December, 2015), ams AG (SIX: AMS), a leading provider of high performance sensors and analog ICs, today announced that the new Komfy™ Switch with camera by D-Link features the ams iAQ-core indoor air quality module. The iAQ-core is a miniaturized, low-power gas sensor module that measures the indoor air quality with unrivaled accuracy. It uses a MEMS based VOC sensor component and provides an output of ppb TVOC and ppm CO2 equivalent units via an I2C ...

eSilicon to Present Real-World 2.5D Results at the 3D ASIP Conference

San Jose, CA (2015-12-08) eSilicon, a leading semiconductor design and manufacturing solutions provider, will present at the 2015 3D Architectures for Semiconductor Integration and Packaging (ASIP) Conference held in Redwood City, Calif., December 15-17, 2015.

Redpine Signals Launches the World's First Wireless MCU Module with Dual-band Wi-Fi®, Bluetooth Classic, Bluetooth Low Energy, and ZigBee Support

San Jose, CA (2015-12-08) SAN JOSE, CA, Dec. 8, 2015 - Redpine Signals today announced the launch of the world's first wireless microcontroller module with built-in support for multiple wireless protocols including Wi-Fi, Bluetooth Classic, Bluetooth Low Energy, and ZigBee. The WiSeMCU modules include the RS10001 - an ultra-small 8.6 x 8.6 mm wireless MCU with single-band Wi-Fi, dual-mode BT, ZigBee, and a 100 MHz ARM Cortex M4. By combining the processor with multi-protocol wireless support, Redpine Signals is ...

ams introduces complete single-chip hardware and software solution for ultrasonic water flow metering

Austria (2015-12-03) New acam TDC-GP30-F01 includes processor to compute water flow, volume and temperature measurements, making metering system implementation quick and easy Ultra-low power consumption allows for up to 20 years' operation on a single AA battery Unterpremstaetten, Austria (2 December, 2015), ams AG (SIX: AMS), a leading provider of high performance sensors and analog ICs, today extended its family of ultrasonic flow meter ICs with the TDC-GP30-F01, a complete hardware and firmware measurement ...

Sidense Qualifies 1T-OTP Memory IP at SMIC 130nm and 110nm Processes

Ottawa, ON Canada (2015-12-03) Sidense Corp., a leading developer of non-volatile memory OTP IP cores, today announced that it has fully qualified its SiPROM one-time programmable (OTP) non-volatile memory (NVM) embedded memory products at SMIC's (Semiconductor Manufacturing International Corporation) 130nm and 110nm G processes.

eSilicon opens office in Penang

Penang, Malaysia (2015-12-03) eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, today officially dedicated its new Asian hub for manufacturing operations in Penang, Malaysia.

Credo Delivers Industry's Lowest Power 16nmFF+ 28G LR-Compliant SerDes IP With Comprehensive Development Platform

Milpitas, CA (2015-12-02) Credo Semiconductor, a global innovation leader in Serializer-Deserializer (SerDes) technology, today announced the commercial availability of a complete development platform for its advanced 28G SerDes IP on the TSMC 16nmFF+ process node. The IP has been proven to deliver the industry's lowest power, consuming less than 200mW per transceiver at long reach (LR), and can be immediately deployed in chips and systems supporting a variety of industry standards such as IEEE 802.3bj and OIF ...

KPMG Appoints Lincoln Clark Global Semiconductor Leader

New York, New York (2015-11-21) KPMG LLP, the audit, tax and advisory firm, has appointed Silicon Valley-based Partner Lincoln Clark as the leader of the firm's Global Semiconductor Industry practice. A member of KPMG's Technology, Media and Telecommunications practice, Clark has over 29 years of experience providing auditing and accounting services, including as lead partner for a significant number of multinational companies. In his new role, Clark will be responsible for setting the strategic priorities and growth ...

ams acquires CMOSIS, a leading supplier of high-end area scan and miniature medical CMOS image sensors

Austria (2015-11-20) Acquisition expands ams' optical sensor portfolio and market leadership with high-value solutions for machine vision, medical, photographic and scientific imaging at expected 2015 revenues of approx. EUR 60m Unterpremstaetten, Austria (20 November 2015) - ams (SIX: AMS), a leading worldwide provider of high-performance sensor and analog solutions, has entered into an agreement to acquire 100% of the shares in CMOSIS, a leader in advanced area and line scan CMOS image sensors for high-end ...

New STM32 Nucleo expansion board with boostedNFC from ams provides complete hardware and software blueprint for ultra compact NFC de-signs

Austria (2015-11-17) Joint ST and ams NFC solution with software running on STM32 family of microcon-trollers is ideal for IoT nodes and contactless card emulation in wearables Unterpremstaetten, Austria (17 November, 2015) -- ams AG (SIX: AMS), a leading provider of high performance sensors and analog ICs, today announced that its proven boostedNFC technology, which enables reliable NFC coupling in space-constrained devices, has been implemented in a complete system development board compatible with the popular ...

Sidense become Inaugural Member of the Core Store

Ottawa, Canada (2015-11-17) Sidense Corp., a leading developer of non-volatile memory OTP IP cores, today announced that it is an inaugural member of the Core Store, a new semiconductor intellectual property portal. Sidense's 1T-OTP non-volatile memory (NVM) products, covering a broad range of silicon foundries, process nodes and variants, are listed on the site, along with key attributes of each.

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