Unterpremstaetten (2014-12-15) New AS3722 PMIC and AS3728 power stages supply new Tegra K1 mobile proces-sor SoC in Nvidia's 'Jetson' reference design kit Unterpremstaetten, Austria (15 December, 2014), ams AG (SIX: AMS), a leading provider of high performance sensors and analog ICs, today added to its family of power management ICs (PMICs) for mobile multi-core ARM processors with the AS3722, which provides a complete power-control solution for Nvidia's Tegra K1 mobile system-on-chip (SoC). ams is also ...
(2014-12-05) ams, a leading worldwide manufacturer of high performance sensor and analog solutions, has entered into an agreement to acquire 100% of the shares in acam-messelectronic, a leader in highly accurate time-based measurement and related sensor solutions, in an all-cash transaction.
(2014-12-01) Cypress Semiconductor Inc. is buying flash-memory maker Spansion Inc. for nearly $1.6 billion in stock, based on Cypress' closing price of $10.43 per share today.
(2014-11-24) NXP Semiconductors N.V. today announced that it has entered into a definitive agreement with Quintic to acquire assets and IP related to its Wearable and Bluetooth Low Energy (BTLE) IC business. This transaction contributes to NXP's drive to create security and connectivity solutions for fast-growing Internet-of-Things applications in Health & Fitness Wearables, Mobile Transactions, Proximity Marketing, Smart Home and Automotive.
(2014-11-19) SanDisk Corporation, a global leader in flash storage solutions, today announced that the company's venture arm, SanDisk Ventures, has invested in Altair Semiconductor, the leading developer of high-performance, single-mode LTE chipsets. Altair's high-performance products bring 4G LTE Internet connectivity to tablets, netbooks, USB dongles, portable hotspots, fixed routers and modems, machine-to-machine applications and other devices.
(2014-11-19) Taiwan Semiconductor Manufacturing Company (TSMC) has acquired a Qualcomm factory in Longtan, northern Taiwan, for US$85 million, according to a company filing with the Taiwan Stock Exchange (TSE).
Unterpremstaetten (2014-11-17) Unique combination of prototyping service plus chip scale packaging offers large cost savings and great flexibility to foundry customers Unterpremstaetten, Austria (17 November 2014), The Full Service Foundry division of ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, today announced its fast and cost-efficient IC prototyping service, known as Multi-Project Wafer (MPW) or shuttle run, with an updated schedule for 2015. The prototyping service, which combines ...
Unterpremstaetten (2014-11-11) TMG399x intelligent sensor modules offer a flexible, highly-integrated implementa-tion of touchless user interface and display management features for smartphones, tablets and many other consumer devices Unterpremstaetten, Austria (11 November, 2014), ams AG (SIX:AMS), a leading provider of high performance sensors and analog ICs, today released a new family of intelligent sensors that inte-grate six key sensing functions including gesture detection and Mobeam barcode emulation. The TMG399x ...
(2014-11-11) Cavendish Kinetics, the leading provider of high-performance RF MEMS tuning solutions for mobile and wearable devices, today announced the closing of a $7 million funding round as well as the appointment of Gilles Delfassy to its board of directors. The round was co-led by Tallwood Venture Capital and Wellington Partners, with participation from Qualcomm Ventures and other existing investors.
Ottawa, Canada (2014-11-11) Sidense Corp., a leading developer of non-volatile memory OTP IP cores, today announced Jim Roche as the company's new Chief Operating Officer. In that role, Mr. Roche will be responsible for driving strategic planning and taking corporate growth to the next level.
(2014-11-11) Ineda Systems, a developer of low-power SoCs (system on a chip) for use in the fast-growing wearables and Internet of Things market segment, today announced additional funding from Cisco Investments to bring the round of Series B funding to a total of $19M.
San Jose, CA (2014-11-04) eSilicon's Mike Gianfagna to participate in panel discussion on 3D integration at the International Wafer-Level Packaging Conference (IWLPC)
Unterpremstaetten (2014-11-03) AS5601 is optimized for use in rotary knobs, and provides an innovative push-button function Unterpremstaetten, Austria (3 November, 2014), The new AS5601 contactless rotary position sensor from ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, gives designers an extremely reliable replacement for conventional rotary encoders, while providing a software-compatible incremental quadrature output. In devices which use rotary knobs, the AS5601 and its paired ...
(2014-10-28) SiTime Corporation, a MEMS and analog semiconductor company, today announced that it has signed a definitive agreement under which MegaChips Corporation, a top 25 fabless semiconductor company based in Japan, will acquire SiTime for $200 million in cash. This transaction combines two complementary fabless semiconductor leaders that provide solutions for the growing Wearables, Mobile and Internet of Things markets.
San Jose, CA (2014-10-23) eSilicon Corporation announced enhancements aimed at simplifying the customer experience for its online quoting portals. One-click MPW and GDSII quoting access eSilicon's automated online multi-project wafer (MPW) and GDSII quoting portals now have one-click access.
Wichita, KS (2014-10-21) Integra Technologies LLC, announced that is has been awarded a contract by the Department of Defense, Missile Defense Agency (MDA) to assist with developing advanced screening techniques for eliminating counterfeit integrated circuits from the DOD supply chain. The contract will specifically target Field Programmable Gate Arrays, which are widely used throughout the MDA and are at the heart of many of the MDAâ€™s most sophisticated electronic systems.
(2014-10-20) IBM Corp said it would hive off its loss-making semiconductor unit to contract-chipmaker Globalfoundries Inc to focus on cloud computing and big data analytics. IBM will pay Globalfoundries $1.5 billion in cash over the next three years to take the chip operations off its hands, the companies said in a statement on Monday.
Montpellier, France (2014-10-07) Cortus, a technology leader in low-power, silicon-efficient, 32-bit processor IP, announced the first of a new family of products based on its v2 instruction set today. The APS23 core was built to deliver a new level of efficiency, ease of integration and cost of ownership for low-power, connected intelligent devices. The core reduces embedded system power by optimising the size of the instruction memory.
Montpellier, France (2014-10-07) Cortus, a technology leader in low power, silicon efficient, 32-bit processor IP, today announced the release of the APS25 processor IP core, the second in a family of products based on the new Cortus v2 instruction set (see news release on APS23). The APS25 core is aimed at embedded systems demanding greater computational performance and system complexity while also requiring maximum code density and extendibility.
(2014-09-26) Intel Corporation and Tsinghua Unigroup Ltd. today jointly announced that both parties have signed a series of agreements. The purpose of the agreements is to expand the product offerings and adoption for Intel-based mobile devices in China and worldwide by jointly developing Intel Architecture and communications-based solutions for mobile phones. Intel also has agreed to invest up to RMB 9 billion (about US$1.5 billion) for a minority stake of approximately 20 percent of the holding company ...
(2014-09-24) According to a brief item put out by one Chen Liang of Chinese news service Tencent, Intel has taken a 20% stake in Spreadtrum, the wireless chip maker bought out last year by Chinese state-funded Tsinghua Unigroup.
Hsinchu, Taiwan (2014-09-23) Unisem, a global provider of semiconductor assembly and test services, today announced that Dennis Chang has joined its sales team as a Business Development Manager for the Taiwan region, effective immediately. Dennis joins the company from a Taiwanese packaging manufactory where he was responsible for the sales and marketing of SiP, MCM, MCP, WLCSP and lead frame based packages. Dennis brings over 20 years of experience in the Taiwanese semiconductor assembly and multi die packaging ...
Ottawa, Canada and Santa Clara, Calif. (2014-09-23) Sidense will show a slide presentation entitled, "OTP for Mobile Applications" discussing how the Company ensures reliability for its OTP IP Macros and reviewing the OTP products Sidense has already qualified to meet TSMC9000 assessment criteria, as well as other OTP products in the TSMC9000 pipeline. Specifically for mobile applications, we will discuss how to obtain high-security OTP at both the bit-cell level and in supporting circuitry.
Unterpremstaetten (2014-09-22) AS3911 NFC development kit includes an NCI standard-based interface to Android, Linux and Windows operating systems Unterpremstaetten, Austria (22 September, 2014), ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, today released the AS3911 NFC development kit and inter-face software stack, which provide a blueprint for an NFC implementation in any microcontroller-based system. NFC has already proved its popularity with consumers in applications such as ...
(2014-09-18) Cisco announced its intent to acquire privately held Memoir Systems, a company that develops semiconductor memory intellectual property (IP) and tools that enable ASIC vendors to build programmable network switches with increasing speeds. This acquisition will enable the proliferation of affordable, fast memory for existing Cisco switch ASICs and will help advance Cisco's ASIC innovations necessary to meet next-generation IT requirements.