Member News

Ultra-accurate ams sensor interface integrated into battery management systems in leading Electric Vehicles

Unterpremstaetten (2014-09-17) Current and voltage measurements captured by AS8510 help the battery manage-ment system in the BMW i3 for accurate range assessment Unterpremstaetten, Austria (17 September, 2014), ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, today announced that the BMW Group is using the AS8510, an integrated automotive sensor interface, to provide extremely accurate battery voltage and cur-rent measurements in its 'i3' series electric vehicles (EVs). The BMW i3 ...

Configurable AS3715 PMIC from ams supports plat-form designs for li-ion battery-powered devices

Unterpremstaetten (2014-09-15) AS3715's features particularly well suited to action cameras and portable navigation devices Unterpremstaetten, Austria (15 September, 2014), ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, today introduced the AS3715, a configurable power man-agement IC (PMIC) which enables OEMs to implement power circuits for multiple end products with the same hardware design. The new AS3715 includes all the essential power management building blocks required to ...

Unisem Announces QFN Side Wall Plating Capability and Leadframe Grid Array (LFGA) Package Offering

Batam, Indonesia (2014-09-09) Unisem, a global provider of semiconductor assembly and test services, today announced its QFN side wall plating capability and LFGA package offering at the company's facility located in Batam, Indonesia. The QFN side wall plating technology offers a unique set of advantages, as it protects the copper wire from exposure during the board mounting process and allows soldering to occur on the external side wall, so that a visual inspection can be made. The process that was developed at Unisem ...

Easy-to-use magnetic position sensor offers durable, contactless replacement for potentiometers

Unterpremstaetten (2014-09-08) Simple ratiometric output, high resolution, low power consumption and attractive price/performance ratio make new AS5600 attractive to designers of industrial and consumer equipment Unterpremstaetten, Austria (8 September, 2014), ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, today introduced the AS5600,a magnetic rotary position sensor which makes it easier than ever before to replace a traditional potentiometer with a more reliable contactless ...

Altis Semiconductor and TSI Semiconductor join eSilicon's online multi-project wafer quote system. More technology choices available for instant MPW quotes

San Jose, California (2014-09-04) eSilicon Corporation today announced the addition of two foundries -- Altis Semiconductor and TSI Semiconductor -- to its automated, instant online quote system for multi-project wafer (MPW) shuttles.

Sidense Demonstrates Working One-Time Programmable (OTP) Bit Cells in TSMC 16nm FinFET Technology. Test chips show successful read and program capability with excellent programmed cell characteristics for 1T-Fuse™ cells implemented in FinFET architecture

Ottawa, Canada (2014-09-04) Sidense Corp. today announced that it successfully demonstrated read and write capability for its 1T-OTP bit-cell architecture on test silicon fabricated in a 16nm CMOS FinFET process.

UMC Makes Investments in Fujitsu Semiconductor Subsidiary

(2014-08-29) United Microelectronics Corporation (UMC) has said it will invest JPY5 billion (US$48.1 million) in a new subsidiary set up by Fujitsu Semiconductor. UMC will hold a 9.3% stake in the new company.

Unisem Announces Exhibits at Upcoming Fall Conferences

Sunnyvale, CA (2014-08-28) Unisem, a global provider of semiconductor assembly and test services, today announced that it will be exhibiting at the following conferences this Fall: • MEMS Industry Group’s Shanghai 2014 Conference on Sept 11 in Shanghai, China. • iMAPS 47th International Symposium on Microelectronics on Oct 14-15 in San Diego, CA. • 2014 MEPTEC Semiconductor Packaging Technology Symposium on Oct 23 in Santa Clara, CA. • International Wafer-Level Packaging ...

Murata to Acquire Peregrine Semiconductor for $12.50 Per Share in Cash

(2014-08-22) Murata Electronics North America, Inc., a wholly owned subsidiary of Murata Manufacturing Co., Ltd., and Peregrine Semiconductor Corporation (Peregrine) today announced that they have entered into a definitive agreement under which Murata will acquire all outstanding shares of Peregrine not owned by Murata, for $12.50 per share in cash, or a total transaction value of $471 million ($465 million excluding Murata's existing holding).

Cirrus Logic Completes Acquisition of Wolfson Microelectronics

(2014-08-21) Cirrus Logic, Inc. today announced that it has completed its acquisition of Wolfson Microelectronics. Cirrus Logic believes that the acquisition will strengthen its position as a market leader with a highly differentiated global customer base and end-to-end signal processing solutions, including integrated circuits and software for portable audio applications.

STATS ChipPAC's fcCuBE Technology Surpasses 100 Million Unit Milestone

Singapore (2014-08-20) STATS ChipPAC, a leading provider of advanced semiconductor packaging and test services, has shipped over 100 million semiconductor packages with the Company's fcCuBE® technology, advanced flip chip packaging with fine pitch copper (Cu) column bumps, Bond-on-Lead (BOL) interconnection and enhanced assembly processes. fcCuBE® technology is well established in the mobile market with the most significant production volume to date in small chip scale packages where the performance, size and ...

Infineon Technologies AG to Acquire International Rectifier Corporation for US-Dollar 40 per Share, Approximately US-Dollar 3 Billion in Cash

(2014-08-20) Infineon Technologies AG and International Rectifier Corporation today announced that they have signed a definitive agreement under which Infineon will acquire International Rectifier for US-Dollar 40 per share in an all-cash transaction valued at approximately US-Dollar 3 billion. The acquisition combines two semiconductor companies with leadership positions in power management technology.

ON Semiconductor Completes Acquisition of Aptina Imaging and Provides Guidance for Third Quarter on Impact of Acquisition of Aptina Imaging

(2014-08-18) ON Semiconductor, driving energy efficient innovations, today announced the completion of its acquisition of Aptina Imaging. The total consideration of approximately $400 million in cash for the acquisition of Aptina Imaging was funded by cash on the balance sheet and ON Semiconductor's existing revolving line of credit.

Intel Buys Avago's Networking Business

(2014-08-13) Intel Corp. said it agreed to pay $650 million to Avago Technologies Ltd. for a networking business in an acquisition designed to bolster Intel's offerings in networking chips.

U-blox Pays $7M for Antcor Wi-Fi Base Band IP

(2014-08-07) Switzerland-based u-blox has struck a $6.95 million deal with Wi-Fi base band IP developer Antcor Advanced Network Technologies S.A. in an effort to strengthen its foothold in the wireless M2M sector.

STATS ChipPAC Honours Top Suppliers for Excellent Performance and Outstanding Support

Singapore (2014-08-06) STATS ChipPAC announced the recipients of its seventh annual Supplier Awards, honoring the excellent performance and outstanding contributions of the Company's top suppliers in 2013.

Vidatronic Announces Buck DC-DC Switching Converter IP with Excellent Power Efficiency for Low Power Applications

College Station, TX (2014-08-06) Vidatronic Inc, a leading provider of power management intellectual property (IP) solutions, announces the VBUCK400T110, a Buck DC-DC switching converter IP core in the TSMC 110nm CMOS process. The VBUCK400T110 is optimized for microprocessor, application specific integrated circuit (ASIC), and system-on-a-chip (SOC) integration. The Buck IP core can be used to implement dynamic voltage and frequency scaling (DVFS) for modern microchips.

Sondrel appoints new VP Asia Pacific as business grows

Theale, UK (2014-08-05) Sondrel, one of the world's leading system-to-silicon IC design consultancies, announces the appointment of Julian Kingsbury as VP, Asia Pacific, effective immediately. Kingsbury, a fluent Mandarin speaker, is based in Sondrel's Shanghai office and will work closely with the company's management team throughout the APAC region. Sondrel has flourished in China since the company first entered the market there in 2008. In this new senior-level role, a direct report to CEO Graham Curren, ...

Cavium Strikes $90M Acquisition Deal with Xpliant

(2014-08-01) Enterprise processor vendor Cavium, Inc. said it has reached an agreement to buy California-based switching firm Xpliant, Inc.--a move that is seen to accelerate deployment of software defined networks.

ARM Concludes its Acquisition of Duolog Technologies

(2014-08-01) ARM has concluded its acquisition of Duolog Technologies, a leader in design configuration and integration technology for the semiconductor industry. The acquisition strengthens ARM's IP configuration and integration capability, helping ARM partners design and deploy system IP and manage increasing SoC integration complexity.

Microsemi Buys Mingoa to Boost FPGA Capabilities

(2014-07-31) Microsemi Corp. has announced that it recently acquired Mingoa, a private venture capital funded company in Cork, Ireland, which develops IP that enables customers to add Ethernet OAM (operations, administration and maintenance) and/or test functionality to their Ethernet equipment.

Inphi Announces Definitive Agreement to Acquire Cortina Systems, Inc., a Leader in Network Infrastructure

(2014-07-30) Inphi Corporation, a leading provider of high-speed, mixed signal semiconductor solutions for the communications, data center and computing markets, and Cortina Systems, Inc., a leader in network infrastructure for optical transport and high speed networking interconnects, today announced they have entered into a definitive agreement, under which Inphi will acquire Cortina's High-Speed Interconnect and Optical Transport product lines for $52.5 million in cash and $73.5 million in stock.

STATS ChipPAC's Encapsulated Wafer Level Chip Scale Package (eWLCSP) Delivers Superior Quality Benefits

Singapore (2014-07-29) STATS ChipPAC Ltd., a leading provider of advanced semiconductor packaging and test services, today announced new quality benefits for fan-in wafer level packaging made possible by its encapsulated Wafer Level Chip Scale Package (eWLCSP) solution. The combined benefits of superior quality, lower cost structure and the ease of conversion through a drop-in replacement have led to a strong demand for eWLCSP and an accelerated adoption across its customer base.

Sondrel CEO Graham Curren re-elected Director of the China Britain Business Council

Theale, UK (2014-07-22) Sondrel, one of the world's leading system-to-silicon IC design consultancies, announced today that CEO Graham Curren has been re-elected to the Board of the China Britain Business Council at its AGM. The China-Britain Business Council (CBBC) helps UK companies develop business with China through practical in-market assistance, a comprehensive range of services and participating in many high-level events both here and in China, including Government-led initiatives and trade missions. CBBC ...

IMAGIS chooses Cortus APS1 Processor for Touchscreen Solutions

Montpellier, France and Suwon-City, Korea (2014-07-22) Cortus, a technology leader in low power, silicon efficient, 32-bit processor IP, and IMAGIS, a specialised touch and haptic solution product provider, announce that they are working together to offer touchscreen designs based on Cortus' APS1 processor core.

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