Member News

ATREG Appoints Ex-Amazon Wade Moller As Vice President

Seattle, WA (2015-08-25) ATREG today announced that it has appointed Wade Moller as vice president. Wade, who brings over 12 years of experience to the company, will assist the Seattle team with global account management and the facilitation of fab and cleanroom disposition transactions. Wade comes from the online retail giant Amazon where he advised the company on the efficient structuring for its foreign supply chains, non-U.S. business operations, as well as asset acquisitions and dispositions. Wade also advised ...

CSMC Technologies Corporation joins eSilicon's online multi-project wafer quote system

San Jose, California (2015-08-19) eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, today announced the addition of CSMC Technologies Corporation, a leading pure-play specialty analog foundry, to MPW Explorer. MPW Explorer is eSilicon's automated, instant online quote system for multi-project wafer (MPW) shuttles.

ams offers More Than Silicon in optoelectronics

Austria (2015-08-12) Expanded process portfolio for foundry customers improves sensitivity and form factor of advanced optoelectronic devices Unterpremstaetten, Austria (12 August, 2015) -- The Full Service Foundry division of ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, today announced it is extending its 0.35µm CMOS optoelectronics IC foundry platform to offer chip designers greater sensitivity and precision and more light filtering capabilities. This platform is an ...

ams acquires advanced CMOS sensor business from NXP

Unterpremstaetten (2015-07-28) New monolithic and integrated CMOS environmental sensors drive signif-icant opportunities in smart phones, wearables, smart homes, industrial, medical and automotive markets Unterpremstaetten, Austria (28 July, 2015), ams AG (SIX: AMS), a leading provider of high perfor-mance sensors and analog ICs, announced today that the company has acquired the CMOS Sensor Business from NXP Semiconductors. The acquisition expands ams' environmental sensor portfolio with advanced monolithic and ...

New Eve home air-quality monitor from Elgato uses ams gas sensor for accurate VOC measurements

Unterpremstaetten (2015-07-27) Tiny, low-power AS-MLV-P2 MEMS gas sensor helps Eve Room run for months on a small, replaceable battery Unterpremstaetten, Austria (27 July, 2015), ams AG (SIX: AMS), a leading provider of high perfor-mance sensors and analog ICs, today announced that Elgato (www.elgato.com) is using the ams AS-MLV-P2 MEMS VOC (volatile organic compound) gas sensor in its new Eve family of home monitoring devices. The 9.1mm x 9.1mm x 4.5mm AS-MLV-P2 is a low-power gas sensor which measures levels of VOCs ...

Brite Semiconductor and HKUST Jointly Establish Brite Top Talents Fellowship Program

Shanghai, China (2015-07-27) Brite Semiconductor, a leading ASIC design services company headquartered in Shanghai, China, announced today the establishment of the Brite Top Talents Fellowship Program with Hong Kong University of Science and Technology (HKUST) to encourage graduates to be more active in academic and engineering projects.

ams delivers industry's first sensor module to integrate universal remote control, barcode emulation, color sensing, proximity and 3D gesture detection

Unterpremstaetten (2015-07-20) Low-profile, optical sensor module reduces board space requirements and lowers smartphone BOM cost Unterpremstaetten, Austria (20 July, 2015), ams AG (SIX: AMS), a leading provider of high perfor-mance sensors and analog ICs, launched today a new series of advanced optical sensing modules, the TMx4903, integrating multiple functions including universal remote control, barcode emulation, RGB color sensing, proximity and 3D gesture detection in a low-profile 5.0x2.0x1.0mm package. The high ...

Synopsys Acquires Bluetooth Smart IP from Silicon Vision Asset Acquisition Expands Leading DesignWare IP Portfolio with Low-Power Wireless Interface IP for IoT Applications

MOUNTAIN VIEW, California (2015-07-16) Highlights: - Silicon-proven Bluetooth® Smart radio IP implements the Bluetooth 4.0, 4.1 and 4.2 low energy standards and supports down to one-volt operation for extended battery life - Low-power Bluetooth Smart IP targets a range of applications such as wearables, beacons, portable health, smart home and industrial that require on-chip wireless integration - Asset acquisition expands Synopsys' extensive DesignWare IP portfolio for IoT, consisting of logic libraries, memory ...

eSilicon Adds Jens Andersen to Head STAR Online Initiatives

San Jose, California (2015-07-09) Jens Andersen joins eSilicon as its new vice president of business development for the recently announced eSilicon® STAR online IC design virtualization platform.

eSilicon's Colby Gartin Promoted to Vice President and General Counsel

San Jose, Calif (2015-07-08) Colby Gartin was promoted to vice president and general counsel for eSilicon. Gartin is responsible for eSilicon's commercial agreements, strategic transactions, IP portfolio, litigation and corporate governance matters.

High speed rotary position sensor from ams ideal for use in safety-critical automotive applications

Unterpremstaetten (2015-06-09) New AS5147P position sensor IC offers magnetic stray field immunity and supports ISO26262 compliance programmes Unterpremstaetten, Austria (9 June, 2015), ams AG (SIX: AMS), a leading provider of high perfor-mance sensors and analog ICs, today released the AS5147P, an ultra-high speed magnetic rotary position sensor which offers reliable performance in automotive applications compatible with the requirements of the ISO26262 functional safety standard. Providing accurate absolute and ...

Satellite-based exploration of the Earth's magnetosphere

Unterpremstaetten (2015-06-03) Advanced electronics developed for ultra-precise measurements of the Earth's magnetosphere captures stunning early results Unterpremstaetten, Austria (3 June, 2015). The Full Service Foundry division of ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, Fraunhofer Institute for Integrated Cir-cuits IIS and the Space Research Institute (Institut für Weltraumforschung, IWF) of the Austrian Acad-emy of Sciences (-sterreichische Akademie der Wissenshaften, ...

eSilicon Adds SMIC as a Foundry Choice for Online GDSII Quoting

San Jose, California (2015-06-03) eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, today announced the addition of Semiconductor Manufacturing International Corporation ("SMIC") SMI, -1.95% (sehk:981) as a new foundry choice for its GDSII Explorer online quoting tool.

eSilicon at DAC 2015: New Online Tools, Lower Power/Smaller Die, IoT and IP Parties

San Jose, California (2015-06-02) eSilicon, a leading semiconductor design and manufacturing solutions provider, will participate in several venues at the 2015 Design Automation Conference (DAC) at Moscone Center in San Francisco, Calif., June 8-10, 2015.

Marquardt chooses RF technology from ams for new contactless car key application

Unterpremstaetten (2015-05-27) The tiny ams AS3914 NFC reader IC in a car's door handle enables 'touch to open' function when coupled with a driver's smartphone, smart watch or tablet Unterpremstaetten, Austria (27 May, 2015), ams AG (SIX: AMS), a leading provider of high perfor-mance sensors and analog ICs, today announced that automotive equipment supplier Marquardt is using its AS3914 NFC reader IC in a new series of contactless door lock and ignition control modules. Marquardt, a mechatronics specialist ...

M31 Technology Announces Low-power Focused Collaboration with Imagination Technologies

Hsinchu, Taiwan (2015-05-26) Hsinchu, Taiwan - May 26, 2015 - M31 Technology Corporation, a professional silicon intellectual property (IP) provider, today announced a collaboration with Imagination Technologies. The companies will focus on low power technologies for the IoT, wearables and other applications where embedded computation along with integrated wireless communications are required to be powered for extended periods of time on a small coin cell battery.

ams launches next-generation NFC interface tag IC with advanced data and energy management fea-tures

Unterpremstaetten (2015-05-20) New AS3955 industry-best energy harvesting capability enables battery-less de-signs and wireless Li-ion battery charging Unterpremstaetten, Austria (20 May, 2015) -- ams AG (SIX: AMS), a leading provider of high per-formance sensors and analog ICs, today launched the AS3955, an NFC interface chip (NFiC™) which offers unique energy harvesting and data transfer capabilities. Like its predecessor the AS3953, the AS3955 provides a contactless bridge between an NFC read-er (for instance, a ...

eSilicon Brings Virtualization to Online Portal

San Jose, Calif. (2015-05-19) eSilicon Corporation announced its second-generation online ASIC design and manufacturing platform. Named eSilicon STAR (self-service, transparent, accurate, real-time), the platform supports eSilicon's existing IP browsing, instant quoting and work-in-process tracking capabilities along with a new chip optimization offering that leverages design virtualization technology.

Sidense Announces New Chief Financial Officer

Ottawa, Canada (2015-05-15) Sidense Corp. announces Bob Daly as the company's Chief Financial Officer.

Blue Danube Systems Raises $16 Million in Series B Funding, Includes a Strategic Investment from AT&T

Mountain View, CA (2015-05-12) Blue Danube Systems, a provider of mobile wireless access solutions that significantly and cost-effectively increase network capacity and enhance quality of service, today announced that it closed $16 million in Series B funding. Previous investor Sequoia Capital and new investor Northgate participated in the round, which also includes a strategic investment by AT&T that will help accelerate early product testing and deployment. To date, Blue Danube has raised a total of $23.7 million in equity ...

Sondrel Release Helium 8: A Design Flow Delivering Low Power in Advanced Nodes

Reading, UK (2015-05-05) Sondrel today announced the release of Helium 8, a new design flow & technique developed to deliver low power on large area advanced node chip designs. A recent large area (>500mmsq) chip project completed using the tools and techniques incorporated into Helium 8 produced a dynamic power saving of 20% over the design-ready flow provided by the EDA vendor, as well as achieving a significant reduction of the leakage power through the design of multi-voltage and supply island groups. The ...

Renesas' Kofu Technology Campus Available for Sale - Initial Bid Due Date is July 8th, 2015

Seattle, WA (2015-05-04) ATREG, Inc., which specializes in helping global companies dispose of infrastructure-rich advanced technology manufacturing assets, announced today in conjunction with Cushman & Wakefield, K.K. that the initial bid due date for the sale of Renesas Electronics Corporation's 23.4-acre Kofu technology campus located in the Yamanashi Prefecture, Japan is July 8th, 2015. All qualified parties interested in purchasing part or all of this campus are invited to express their intent with Renesas' ...

ams launches world's smallest ambient light sensor for next generation thinner wearable products

Unterpremstaetten (2015-04-29) Integrated on-chip interference filters reject IR producing a near-photopic response Unterpremstaetten, Austria (29 April, 2015), ams AG (SIX: AMS), a leading provider of high perfor-mance sensors and analog ICs, today introduced the TSL2584TSV, an ambient light sensor (ALS) in a through-silicon via (TSV) package which has a footprint of just 1.145 x 1.66 mm and a height of 0.32 mm. In display management applications, automatically controlling the backlight intensity with an ALS ensures ...

eSilicon's Javier DeLaCruz to Present: Cost Structure Advantages of 2.5D Integration

San Jose, California (2015-04-29) Javier DeLaCruz, senior director of product strategy, will be presenting at the 2015 IMAPS symposium. Javier will be discussing the cost structure advantages of 2.5D integration

Sidense Webinar on Memory Considerations for the Smart Connected Universe

Ottawa and San Jose (2015-04-28) Attend the Sidense Webinar on May 6 and learn how your Smart Connected design can benefit from Sidense's 1T-OTP memory IP.

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