Ottawa and Santa Clara (2013-12-03) Sidense has released a white paper, Optimizing Sensor Performance with 1T-OTP Trimming, discussing the advantages of using antifuse-based one-transistor, one-time programmable (1T-OTP) memory to trim sensors.
San Jose, California (2013-12-03) Javier DeLaCruz, eSilicon's senior director of engineering, will be part of the session on "Practical Perspectives on Thin Wafer Handling and Direct Bonding."
Washington, DC (2013-11-26) WASHINGTON, DC November 26, 2013 Coventor®, Inc., a leading supplier of virtual fabrication software to accelerate the development of new manufacturing processes, will host an expert roundtable discussion at the 2013 edition of IEDM (December 7-11, 2013. Washington, DC). The discussion will provide an in-depth and comprehensive view of the current and next generation of challenges facing IC designers and manufacturers as process technologies head to unprecedented levels of complexity, cost a...
Ottawa, Ontario Canada (2013-11-26) Sidense Corp., a leading developer of non-volatile memory OTP IP cores, today announced that its fiscal year 2013, which ended September 30, 2013 (FY2013), was its best year yet for revenue. In addition, the fourth quarter of FY2013 established a new quarterly revenue record for Sidense.
San Francisco, California (2013-11-21) Multiple drivers of growth are converging on the mobile semiconductor industry. To compete in the mobile 4G era, it will be important for companies to transition from traditional, closed business models to a more open, collaborative approach, using open innovation and platform leadership strategies to gain ground in emerging mobile growth markets.
SAN JOSE, California (2013-11-21) Redpine Signals, Inc., a leading developer of ultra-low-power and high-performance multi-standard wireless chipsets and systems, today announces the release of the industry's first wearable Wi-Fi and BLE RTLS tag with dual-band capability. The WM4-50 device is available in several form factors and is worn around the wrist or neck and features sensors, an alarm button and LEDs for two- way communication with the network and for emergency use. The tags, in conjunction with Redpine's RTLS infrastru...
San Jose, California (2013-11-20) Redpine Signals, Inc., a leading developer of ultra-low-power and high-performance multi-standard wireless chipsets and systems, today announces the release of the industry's first multi-functional device with Wi-Fi, BT and BT-LE connectivity and incorporating photo-voltaic energy harvesting. The device includes a sensor and an e-paper display that maintains display content at microwatts of power consumption. The device uses Redpine's RS9113 M2MCombo SoC device to provide connectivity through ...
Unterpremstaetten (2013-11-13) Multi-project prototyping service offers large cost savings as manufacturing costs are shared between multiple users Unterpremstaetten, Austria (November 13, 2013), The Full Service Foundry business unit of ams AG (SIX: AMS) today announced its fast and cost-efficient IC prototyping service, known as Multi-Project Wafer (MPW) or shuttle run, with an updated schedule in 2014. The prototyping service, which combines several designs from different customers onto a single wafer, offers significan...
Wichita, KS (2013-11-13) Integra Technologies, is pleased to announce that their facility in Wichita Kansas has been approved by the Defense Logistics Agency (DLA) Land and Maritime to support screening to MIL-PRF-19500P and MIL-STD-750. The approval covers 76 individual test methods. For a complete list of all of Integras DLA approved test methods, see the datasheet on our web site at www.integra-tech.com.
Ottawa, Canada (2013-11-12) Novatek Microelectronics Corp. has selected Sidenses 1T-Fuse-based 1T-OTP memory IP for its display driver ICs for flat-panel displays. Novateks decision to use Sidenses high-voltage SLP NVM macros was based on several compelling features, including very low power consumption, high reliability and small OTP macro footprint.
San Jose, California (2013-11-05) eSilicon Corporation announced the addition of Mike Gianfagna to its executive team as vice president, marketing.
(2013-11-05) Lowell, Mass.-based semiconductor company M/A-COM Technology Solutions Holdings Inc. announced Tuesday it will acquire California-based Mindspeed Technologies Inc. in a cash transaction valued at $272 million.
(2013-11-01) Qualcomm Technologies has bought certain technology assets of Arteris Inc., a supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, for an undisclosed amount.
Ottawa Canada (2013-10-29) Sigma Designs has signed a multi-year license to use the Sidenses SHF OTP macros. Designed by Sidense for advanced processes from 40nm down to 16nm FinFET technology, Sigma Designs will use SHF in a 40nm implementation, which has already been qualified in G and low-power/low-leakage variants, for set-top box and digital TV applications.
(2013-10-25) Microsemi Corporation has announced its intent to buy Symmetricom, a company that specializes in precision time and frequency technologies, for approximately $230 million or $7.18 per share through a cash tender offer.
Tokyo, JAPAN (2013-10-22) Advantest Corporation (TSE: 6857, NYSE: ATE) today announced that it has logged its first three orders for its new EB (electron beam) lithography system, the F7000, from the University of Tokyo, the University of Kyoto, and a semiconductor industry customer. The systems will be shipped within the fiscal year ending March 2014.
(2013-10-21) Xilinx and TSMC have jointly announced production release of the Virtex-7 HT family, what the pair claims is the industry's first heterogeneous 3D ICs in production. With this milestone, all Xilinx 28nm 3D IC families are now in volume production. These 28nm devices were developed on TSMC's chip-on-wafer-on-substrate (CoWoS) 3D IC process that produces significant silicon scaling, power and performance benefits by integrating multiple components on a single device, the companies said.
Unterpremstaetten (2013-10-16) New AS8506 cell monitoring IC eliminates need for complex software and reduces hardware requirements in battery cell management systems Unterpremstaetten, Austria (16 October, 2013), ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, today introduced a vastly simplified and more robust method of implementing cell monitoring and balancing in lithium battery systems. The innovative architecture developed by ams has been implemented in a new, highly integrated c...
(2013-10-15) Invensense Inc. in San Jose, Calif. has agreed to purchase the MEMS microphone business line of Analog Devices Inc. (ADI) in Norwood, Mass. for $100 million in cash. Approximately 30 to 40 employees will move from ADI to Invensense as a result of the acquisition, but will remain in the Massachusetts area. Also remaining in place will be the MEMS microphone support operations in Bratislava, Slovakia and Shanghai, China.
(2013-10-07) Two emerging semiconductor technologies - 16nm FinFET design and 3D-ICs - are moving closer to volume production, according to Dr. Cliff Hou, vice president for R&D at TSMC. Speaking at the TSMC Open Innovation Platform® Ecosystem Forum (TSMC OIP) Oct. 1, 2013, Hou (right) said that the EDA and semiconductor IP ecosystem needed to support those technologies is nearly complete, although work continues in a few challenging areas.
San Jose, California (2013-10-01) eSilicon Corporation, the largest independent semiconductor design and manufacturing services provider, today announced its new automated, instant online quotes for multi-project wafer (MPW) shuttle services. The service, accessed through user-friendly web or smartphone interfaces, instantly generates executable MPW quotes.
Wichita, KS (2013-10-01) Integra Technologies, a world leader in integrated circuit test and related services, announced that it has acquired Analytical Solutions Incorporated (ASI). Analytical Solutions provides product evaluation services through Destructive Physical Analysis, Construction Analysis, Failure Analysis, Non-Destructive Testing and Counterfeit Device Investigation of semiconductor devices. These services will complement the extensive electrical test and related services already provided by Integra. The co...
(2013-10-01) Integra Technologies, a world leader in integrated circuit test and related services, announced today that it has acquired Analytical Solutions Incorporated (ASI). Analytical Solutions provides product evaluation services through Destructive Physical Analysis, Construction Analysis, Failure Analysis, Non-Destructive Testing and Counterfeit Device Investigation of semiconductor devices.
(2013-09-30) Intel will take over a plant in Israel's Kiryat Gat city after it was shut down by the US microchip manufacturer Micron in a bid to save 800 jobs, it was announced Sunday.
Unterpremstaetten (2013-09-17) Innovations in latest ANC devices include ultra-low noise amplifiers and integrated bypass switches Unterpremstaetten, Austria (17 September, 2013), ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, has introduced the AS3435 and AS3415 ANC speaker driv-ers, paving the way for a new generation of noise cancellation stereo headsets with zero audible hiss. The AS3435 and AS3415 are also the industrys first ANC (active noise cancellation) ICs to feature integrat...