Member News

Cortus Targets Sensors, Wearables and other IoT applications With New Low Power Embedded 32-bit Processor Core

Montpellier, France (2014-10-07) Cortus, a technology leader in low-power, silicon-efficient, 32-bit processor IP, announced the first of a new family of products based on its v2 instruction set today. The APS23 core was built to deliver a new level of efficiency, ease of integration and cost of ownership for low-power, connected intelligent devices. The core reduces embedded system power by optimising the size of the instruction memory.

The APS25 IP core supports extendibility, dual- and multi-core systems and improved code density

Montpellier, France (2014-10-07) Cortus, a technology leader in low power, silicon efficient, 32-bit processor IP, today announced the release of the APS25 processor IP core, the second in a family of products based on the new Cortus v2 instruction set (see news release on APS23). The APS25 core is aimed at embedded systems demanding greater computational performance and system complexity while also requiring maximum code density and extendibility.

Intel and Tsinghua Unigroup Collaborate to Accelerate Development and Adoption of Intel-based Mobile Devices

(2014-09-26) Intel Corporation and Tsinghua Unigroup Ltd. today jointly announced that both parties have signed a series of agreements. The purpose of the agreements is to expand the product offerings and adoption for Intel-based mobile devices in China and worldwide by jointly developing Intel Architecture and communications-based solutions for mobile phones. Intel also has agreed to invest up to RMB 9 billion (about US$1.5 billion) for a minority stake of approximately 20 percent of the holding company ...

Intel Takes 20% Stake in China's Spreadtrum, Says Tencent

(2014-09-24) According to a brief item put out by one Chen Liang of Chinese news service Tencent, Intel has taken a 20% stake in Spreadtrum, the wireless chip maker bought out last year by Chinese state-funded Tsinghua Unigroup.

Unisem Announces New Business Development Manager for Taiwan Region

Hsinchu, Taiwan (2014-09-23) Unisem, a global provider of semiconductor assembly and test services, today announced that Dennis Chang has joined its sales team as a Business Development Manager for the Taiwan region, effective immediately. Dennis joins the company from a Taiwanese packaging manufactory where he was responsible for the sales and marketing of SiP, MCM, MCP, WLCSP and lead frame based packages. Dennis brings over 20 years of experience in the Taiwanese semiconductor assembly and multi die packaging ...

Sidense Exhibiting at TSMC Open Innovation Platform (OIP) Ecosystem Forum Sidense to discuss OTP for Mobile Applications

Ottawa, Canada and Santa Clara, Calif. (2014-09-23) Sidense will show a slide presentation entitled, "OTP for Mobile Applications" discussing how the Company ensures reliability for its OTP IP Macros and reviewing the OTP products Sidense has already qualified to meet TSMC9000 assessment criteria, as well as other OTP products in the TSMC9000 pipeline. Specifically for mobile applications, we will discuss how to obtain high-security OTP at both the bit-cell level and in supporting circuitry.

New development kit and software stack from ams make it easy to add NFC to microcontroller systems

Unterpremstaetten (2014-09-22) AS3911 NFC development kit includes an NCI standard-based interface to Android, Linux and Windows operating systems Unterpremstaetten, Austria (22 September, 2014), ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, today released the AS3911 NFC development kit and inter-face software stack, which provide a blueprint for an NFC implementation in any microcontroller-based system. NFC has already proved its popularity with consumers in applications such as ...

Cisco Announces Intent to Acquire Memoir Systems

(2014-09-18) Cisco announced its intent to acquire privately held Memoir Systems, a company that develops semiconductor memory intellectual property (IP) and tools that enable ASIC vendors to build programmable network switches with increasing speeds. This acquisition will enable the proliferation of affordable, fast memory for existing Cisco switch ASICs and will help advance Cisco's ASIC innovations necessary to meet next-generation IT requirements.

Ultra-accurate ams sensor interface integrated into battery management systems in leading Electric Vehicles

Unterpremstaetten (2014-09-17) Current and voltage measurements captured by AS8510 help the battery manage-ment system in the BMW i3 for accurate range assessment Unterpremstaetten, Austria (17 September, 2014), ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, today announced that the BMW Group is using the AS8510, an integrated automotive sensor interface, to provide extremely accurate battery voltage and cur-rent measurements in its 'i3' series electric vehicles (EVs). The BMW i3 ...

Configurable AS3715 PMIC from ams supports plat-form designs for li-ion battery-powered devices

Unterpremstaetten (2014-09-15) AS3715's features particularly well suited to action cameras and portable navigation devices Unterpremstaetten, Austria (15 September, 2014), ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, today introduced the AS3715, a configurable power man-agement IC (PMIC) which enables OEMs to implement power circuits for multiple end products with the same hardware design. The new AS3715 includes all the essential power management building blocks required to ...

Microsemi To Acquire Centellax

(2014-09-10) Microsemi Corporation, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it has signed an agreement to acquire Santa Rosa, Calif.-based Centellax, a supplier of high-speed analog and RF semiconductor products for the optical communications and Ethernet datacom markets. The terms of the transaction were not disclosed. The closing of the transaction is subject to customary closing conditions.

Unisem Announces QFN Side Wall Plating Capability and Leadframe Grid Array (LFGA) Package Offering

Batam, Indonesia (2014-09-09) Unisem, a global provider of semiconductor assembly and test services, today announced its QFN side wall plating capability and LFGA package offering at the company's facility located in Batam, Indonesia. The QFN side wall plating technology offers a unique set of advantages, as it protects the copper wire from exposure during the board mounting process and allows soldering to occur on the external side wall, so that a visual inspection can be made. The process that was developed at Unisem ...

Easy-to-use magnetic position sensor offers durable, contactless replacement for potentiometers

Unterpremstaetten (2014-09-08) Simple ratiometric output, high resolution, low power consumption and attractive price/performance ratio make new AS5600 attractive to designers of industrial and consumer equipment Unterpremstaetten, Austria (8 September, 2014), ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, today introduced the AS5600,a magnetic rotary position sensor which makes it easier than ever before to replace a traditional potentiometer with a more reliable contactless ...

Altis Semiconductor and TSI Semiconductor join eSilicon's online multi-project wafer quote system. More technology choices available for instant MPW quotes

San Jose, California (2014-09-04) eSilicon Corporation today announced the addition of two foundries -- Altis Semiconductor and TSI Semiconductor -- to its automated, instant online quote system for multi-project wafer (MPW) shuttles.

Sidense Demonstrates Working One-Time Programmable (OTP) Bit Cells in TSMC 16nm FinFET Technology. Test chips show successful read and program capability with excellent programmed cell characteristics for 1T-Fuse™ cells implemented in FinFET architecture

Ottawa, Canada (2014-09-04) Sidense Corp. today announced that it successfully demonstrated read and write capability for its 1T-OTP bit-cell architecture on test silicon fabricated in a 16nm CMOS FinFET process.

UMC Makes Investments in Fujitsu Semiconductor Subsidiary

(2014-08-29) United Microelectronics Corporation (UMC) has said it will invest JPY5 billion (US$48.1 million) in a new subsidiary set up by Fujitsu Semiconductor. UMC will hold a 9.3% stake in the new company.

Unisem Announces Exhibits at Upcoming Fall Conferences

Sunnyvale, CA (2014-08-28) Unisem, a global provider of semiconductor assembly and test services, today announced that it will be exhibiting at the following conferences this Fall: • MEMS Industry Group’s Shanghai 2014 Conference on Sept 11 in Shanghai, China. • iMAPS 47th International Symposium on Microelectronics on Oct 14-15 in San Diego, CA. • 2014 MEPTEC Semiconductor Packaging Technology Symposium on Oct 23 in Santa Clara, CA. • International Wafer-Level Packaging ...

Murata to Acquire Peregrine Semiconductor for $12.50 Per Share in Cash

(2014-08-22) Murata Electronics North America, Inc., a wholly owned subsidiary of Murata Manufacturing Co., Ltd., and Peregrine Semiconductor Corporation (Peregrine) today announced that they have entered into a definitive agreement under which Murata will acquire all outstanding shares of Peregrine not owned by Murata, for $12.50 per share in cash, or a total transaction value of $471 million ($465 million excluding Murata's existing holding).

Cirrus Logic Completes Acquisition of Wolfson Microelectronics

(2014-08-21) Cirrus Logic, Inc. today announced that it has completed its acquisition of Wolfson Microelectronics. Cirrus Logic believes that the acquisition will strengthen its position as a market leader with a highly differentiated global customer base and end-to-end signal processing solutions, including integrated circuits and software for portable audio applications.

STATS ChipPAC's fcCuBE Technology Surpasses 100 Million Unit Milestone

Singapore (2014-08-20) STATS ChipPAC, a leading provider of advanced semiconductor packaging and test services, has shipped over 100 million semiconductor packages with the Company's fcCuBE® technology, advanced flip chip packaging with fine pitch copper (Cu) column bumps, Bond-on-Lead (BOL) interconnection and enhanced assembly processes. fcCuBE® technology is well established in the mobile market with the most significant production volume to date in small chip scale packages where the performance, size and ...

Infineon Technologies AG to Acquire International Rectifier Corporation for US-Dollar 40 per Share, Approximately US-Dollar 3 Billion in Cash

(2014-08-20) Infineon Technologies AG and International Rectifier Corporation today announced that they have signed a definitive agreement under which Infineon will acquire International Rectifier for US-Dollar 40 per share in an all-cash transaction valued at approximately US-Dollar 3 billion. The acquisition combines two semiconductor companies with leadership positions in power management technology.

ON Semiconductor Completes Acquisition of Aptina Imaging and Provides Guidance for Third Quarter on Impact of Acquisition of Aptina Imaging

(2014-08-18) ON Semiconductor, driving energy efficient innovations, today announced the completion of its acquisition of Aptina Imaging. The total consideration of approximately $400 million in cash for the acquisition of Aptina Imaging was funded by cash on the balance sheet and ON Semiconductor's existing revolving line of credit.

Intel Buys Avago's Networking Business

(2014-08-13) Intel Corp. said it agreed to pay $650 million to Avago Technologies Ltd. for a networking business in an acquisition designed to bolster Intel's offerings in networking chips.

U-blox Pays $7M for Antcor Wi-Fi Base Band IP

(2014-08-07) Switzerland-based u-blox has struck a $6.95 million deal with Wi-Fi base band IP developer Antcor Advanced Network Technologies S.A. in an effort to strengthen its foothold in the wireless M2M sector.

STATS ChipPAC Honours Top Suppliers for Excellent Performance and Outstanding Support

Singapore (2014-08-06) STATS ChipPAC announced the recipients of its seventh annual Supplier Awards, honoring the excellent performance and outstanding contributions of the Company's top suppliers in 2013.

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