Member News

STATS ChipPAC's Encapsulated Wafer Level Chip Scale Package (eWLCSP) Delivers Superior Quality Benefits

Singapore (2014-07-29) STATS ChipPAC Ltd., a leading provider of advanced semiconductor packaging and test services, today announced new quality benefits for fan-in wafer level packaging made possible by its encapsulated Wafer Level Chip Scale Package (eWLCSP) solution. The combined benefits of superior quality, lower cost structure and the ease of conversion through a drop-in replacement have led to a strong demand for eWLCSP and an accelerated adoption across its customer base.

XMOS Adds Bosch, Huawei and Xilinx as Strategic Investors to Complete $26M Investment Round

(2014-07-21) XMOS Ltd. the fabless semiconductor company and leader in intelligent multicore microcontrollers, has today announced the completion of a $26.2m Series-D investment round.

Intel Reveals Rising CPU Sales Amid Falling Mobile Revenue

(2014-07-17) Intel has announced a remarkable increase in net income during its Q2 revenue report, as well as record quarterly microprocessor shipments. However, the positive news has been downplayed by massive losses in its mobile unit.

Qualcomm Acquires Imaging Division from CSR

(2014-07-14) Qualcomm, a cellphone chipmaker, has announced that it is set to acquire the imaging operations of Israel-based CSR plc, according to local reports. CSR said it would be selling the business for $44 million.

Leading IC design consultancy Sondrel appoints John Tinson as new Global VP Sales

Theale, UK (2014-07-14) Sondrel, one of the world's leading system-to-silicon IC design consultancies, has announced the appointment of John Tinson as its Global VP Sales effective 14 July. Tinson has over twenty years' director-level experience in fast-growing B2B technology companies and joins Sondrel from SPI Lasers, where he managed the commercial team that took the company from university spin out to a £50M enterprise.

TSMC June Revenues Down Slightly, but 2Q14 Sales Hit All-Time High

(2014-07-11) Taiwan Semiconductor Manufacturing Company (TSMC) has reported revenues of NT$60.34 billion (US$2.02 billion) for June, down 0.7% on month but up 11.7% on year. Revenues for the first six months of 2014 amounted to NT$331.24 billion, an increase of 14.8% from a year earlier.

UMC June Revenues Hit All-Time High

(2014-07-10) United Microelectronics Corporation (UMC) has reported revenues of NT$12.41 billion (US$415.01 million) for June, up 4% sequentially and 15.3% on year. The sum represents the company's highest monthly record.

ASE 2Q14 Revenues Meet Market Expectations

(2014-07-09) Advanced Semiconductor Engineering (ASE) has reported revenues of NT$58.62 billion (US$1.96 billion) for the second quarter of 2014, an increase of 7.2% on quarter and 15.5% on year that met market expectations.

InvenSense to Buy Movea for Sensor Fusion Software

(2014-07-08) InvenSense Inc., a fabless supplier of inertial MEMS sensors and MEMS microphones, has struck a deal to acquire sensor-hub firmware and software company Movea SA.

Audience to Acquire Sensor Platforms

(2014-07-08) Audience, Inc., the leader in advanced voice and audio processing, today announced that it has signed a definitive agreement to acquire Sensor Platforms, subject to customary closing conditions, for consideration consisting of $41 million of cash.

IDT and eSilicon to Collaborate on Next-Generation RapidIO Switches

San Jose, Calif. (2014-07-08) Integrated Device Technology, Inc. and eSilicon Corporation announced today a collaboration to expedite development of next-generation RapidIO® switches to meet the growing performance demands of new system architectures for wireless, embedded and computing infrastructures.

CEVA Acquires RivieraWaves, Expands IP Offering with Connectivity for Smartphones, Tablets, Small Cells and the Internet of Things

(2014-07-08) CEVA, Inc., the leading licensor of DSP-based IP platforms for vision, audio, communications and connectivity, announced that it has acquired RivieraWaves, a privately held company and a leading provider of wireless connectivity IP for Wi-Fi® and Bluetooth® technologies.

Five distributors win awards from ams for success with customers using its analog ICs and sensors

Unterpremstaetten (2014-07-07) Overall winner Excelpoint Systems of Singapore named Best Distributor of the Year Unterpremstaetten, Austria (7 July, 2014), ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, today announced the winners of its 2013 awards for excellence in distribution service, naming Excelpoint Systems the winner of its overall 'Best Distributor of the Year' award. The Quality award went to Anatec AG of Switzerland. Other winners included Lifetime Value Growth awards ...

Atmel to Buy Newport Media, Adding to Chipmakers' Spree

(2014-07-07) Atmel Corp., a maker of chips for cars and home appliances, agreed to acquire Newport Media Inc. for $140 million in cash to gain wireless-radio capabilities, joining an industry buying spree.

Sondrel CEO meets Chinese Premier Li Kequiang during UK trade visit

Theale, UK (2014-07-02) Graham Curren, CEO of Sondrel, one of the world's leading system-to-silicon IC design consultancies, met Chinese Premier Li Kequiang at a glittering gala dinner for 650 guests at the Natural History Museum in London on June 24. The UK-China Business Dinner was held in honour of Premier Li's visit to the UK accompanied by a large delegation of his ministers and SOE chairmen.

Qualcomm Gets The Jump On WiGig 60 GHz Wireless With Wilocity Acquisition

(2014-07-02) Qualcomm announced that they acquired Wilocity, one of the pioneers in 60 GHz WiGig technology.

Qualcomm Buys Power Amplifier Developer Black Sand

(2014-06-25) Qualcomm Inc. acquired Black Sand Technologies, a leading fables semiconductor manufacturer. Black Sand deploys its flagship CMOS semiconductor technology to develop advanced power amplifiers for wireless applications.

New series of ams magnetic position sensors enables world's best accuracy at high rotation speeds

Unterpremstaetten (2014-06-23) AS5047D, AS5147 and AS5247 with new DAEC™ compensation technology in a single-chip solution reduces dynamic angle error to almost zero Unterpremstaetten, Austria (23 June, 2014) -- ams AG (SIX: AMS), a leading provider of high perfor-mance analog ICs and sensors, today introduced a new series of magnetic position sensors featuring a breakthrough technology capable of producing extremely accurate angle measurements of rotors spinning at high speed. The new "47 series" position ...

Avago Technologies Limited to Acquire PLX Technology, Inc. for $6.50 per Share in Cash

(2014-06-23) Avago Technologies Limited and PLX Technology, Inc. today announced that they have entered into a definitive agreement under which Avago will acquire PLX, a leader in PCI Express silicon and software connectivity solutions, in an all-cash transaction valued at approximately $309 million, or $293 million net of cash and debt acquired.

Spearheading technology for an intelligent and ultra-high-speed optical solution - success for Bobst and CSEM

Neuchâtel/Lausanne (2014-06-13) CSEM and Lausanne-based company BOBST, the world's leading supplier of machinery to the packaging industry, have developed a unique ultra-high-speed vision sensor that meets the needs for the inspection and alignment of packages traveling at very rapid speeds. Since accuracy and reliability are indispensable to the achievement of perfect guiding and positioning when printing and shaping packaging, BOBST called on CSEM's expertise to develop a CMOS vision system able to capture and ...

Unisem Adds Teradyne FLEX Test System in Sunnyvale, CA for Mixed Signal and RF Testing Capabilities

Sunnyvale, CA (2014-06-13) Unisem, a global provider of semiconductor assembly and test services, today announced the addition of a Teradyne FLEX test system to its US-based test development center located in Sunnyvale, CA. The addition of the FLEX test system will further expand Unisem's existing testing capabilities in the mixed signal and RF spaces. The FLEX system has been the gold standard for analog-dominant SOC testing for over a decade. With over 2,300 systems installed worldwide, FLEX has been proven for a ...

Unisem to Expand Testing Capacity with Teradyne UltraFLEX Test System in Sunnyvale, CA for Engineering and Production Services

Sunnyvale, CA (2014-06-12) Unisem, a global provider of semiconductor assembly and test services, today announced the addition of a third Teradyne UltraFLEX Test System to its US-based test development center located in Sunnyvale, CA. The UltraFLEX is the most advanced tester for complex SOC devices in the mobile communication, processor and networking spaces. It offers the highest performance Digital, RF, SERDES and DC instrumentation available on any ATE to provide the most precise characterization capability and ...

2014 InvenSense Developers Conference

Santa Clara Convention Center (2014-06-11) The Third Annual InvenSense Developers Conference will again bring together System OEM's, Ecosystem Partners, Application Developers, and Industry Analysts to learn about the technologies, market and future applications for MotionTracking sensor system on chip (SoC) and Sound solutions for consumer electronic devices such as smartphones, tablets, wearables, gaming devices, optical image stabilization, and remote controls for Smart TVs.

Analog Devices to Acquire Hittite Microwave Corporation

(2014-06-09) Analog Devices, Inc., a global leader in high-performance semiconductors for signal processing applications, and Hittite Microwave Corporation, an innovative designer and manufacturer of high performance integrated circuits, modules, subsystems and instrumentation for RF, microwave and millimeter wave applications, today announced that the two companies have entered into a definitive agreement whereby ADI will acquire Hittite for $78 per share in cash. The closing price of Hittite's common ...

ON Semiconductor to Acquire Aptina Imaging

(2014-06-09) ON Semiconductor, driving energy efficient innovations, today signed a definitive agreement to acquire Aptina Imaging, a leading provider of high-performance CMOS image sensors for automotive and industrial markets, which are the key areas of strategic focus for ON Semiconductor. Other markets addressed by Aptina's products include cameras, mobile devices, and computing and gaming platforms.

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