Member News

High speed rotary position sensor from ams ideal for use in safety-critical automotive applications

Unterpremstaetten (2015-06-09) New AS5147P position sensor IC offers magnetic stray field immunity and supports ISO26262 compliance programmes Unterpremstaetten, Austria (9 June, 2015), ams AG (SIX: AMS), a leading provider of high perfor-mance sensors and analog ICs, today released the AS5147P, an ultra-high speed magnetic rotary position sensor which offers reliable performance in automotive applications compatible with the requirements of the ISO26262 functional safety standard. Providing accurate absolute and ...

Satellite-based exploration of the Earth's magnetosphere

Unterpremstaetten (2015-06-03) Advanced electronics developed for ultra-precise measurements of the Earth's magnetosphere captures stunning early results Unterpremstaetten, Austria (3 June, 2015). The Full Service Foundry division of ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, Fraunhofer Institute for Integrated Cir-cuits IIS and the Space Research Institute (Institut für Weltraumforschung, IWF) of the Austrian Acad-emy of Sciences (-sterreichische Akademie der Wissenshaften, ...

eSilicon Adds SMIC as a Foundry Choice for Online GDSII Quoting

San Jose, California (2015-06-03) eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, today announced the addition of Semiconductor Manufacturing International Corporation ("SMIC") SMI, -1.95% (sehk:981) as a new foundry choice for its GDSII Explorer online quoting tool.

eSilicon at DAC 2015: New Online Tools, Lower Power/Smaller Die, IoT and IP Parties

San Jose, California (2015-06-02) eSilicon, a leading semiconductor design and manufacturing solutions provider, will participate in several venues at the 2015 Design Automation Conference (DAC) at Moscone Center in San Francisco, Calif., June 8-10, 2015.

Marquardt chooses RF technology from ams for new contactless car key application

Unterpremstaetten (2015-05-27) The tiny ams AS3914 NFC reader IC in a car's door handle enables 'touch to open' function when coupled with a driver's smartphone, smart watch or tablet Unterpremstaetten, Austria (27 May, 2015), ams AG (SIX: AMS), a leading provider of high perfor-mance sensors and analog ICs, today announced that automotive equipment supplier Marquardt is using its AS3914 NFC reader IC in a new series of contactless door lock and ignition control modules. Marquardt, a mechatronics specialist ...

M31 Technology Announces Low-power Focused Collaboration with Imagination Technologies

Hsinchu, Taiwan (2015-05-26) Hsinchu, Taiwan - May 26, 2015 - M31 Technology Corporation, a professional silicon intellectual property (IP) provider, today announced a collaboration with Imagination Technologies. The companies will focus on low power technologies for the IoT, wearables and other applications where embedded computation along with integrated wireless communications are required to be powered for extended periods of time on a small coin cell battery.

ams launches next-generation NFC interface tag IC with advanced data and energy management fea-tures

Unterpremstaetten (2015-05-20) New AS3955 industry-best energy harvesting capability enables battery-less de-signs and wireless Li-ion battery charging Unterpremstaetten, Austria (20 May, 2015) -- ams AG (SIX: AMS), a leading provider of high per-formance sensors and analog ICs, today launched the AS3955, an NFC interface chip (NFiC™) which offers unique energy harvesting and data transfer capabilities. Like its predecessor the AS3953, the AS3955 provides a contactless bridge between an NFC read-er (for instance, a ...

eSilicon Brings Virtualization to Online Portal

San Jose, Calif. (2015-05-19) eSilicon Corporation announced its second-generation online ASIC design and manufacturing platform. Named eSilicon STAR (self-service, transparent, accurate, real-time), the platform supports eSilicon's existing IP browsing, instant quoting and work-in-process tracking capabilities along with a new chip optimization offering that leverages design virtualization technology.

Sidense Announces New Chief Financial Officer

Ottawa, Canada (2015-05-15) Sidense Corp. announces Bob Daly as the company's Chief Financial Officer.

Blue Danube Systems Raises $16 Million in Series B Funding, Includes a Strategic Investment from AT&T

Mountain View, CA (2015-05-12) Blue Danube Systems, a provider of mobile wireless access solutions that significantly and cost-effectively increase network capacity and enhance quality of service, today announced that it closed $16 million in Series B funding. Previous investor Sequoia Capital and new investor Northgate participated in the round, which also includes a strategic investment by AT&T that will help accelerate early product testing and deployment. To date, Blue Danube has raised a total of $23.7 million in equity ...

Sondrel Release Helium 8: A Design Flow Delivering Low Power in Advanced Nodes

Reading, UK (2015-05-05) Sondrel today announced the release of Helium 8, a new design flow & technique developed to deliver low power on large area advanced node chip designs. A recent large area (>500mmsq) chip project completed using the tools and techniques incorporated into Helium 8 produced a dynamic power saving of 20% over the design-ready flow provided by the EDA vendor, as well as achieving a significant reduction of the leakage power through the design of multi-voltage and supply island groups. The ...

Renesas' Kofu Technology Campus Available for Sale - Initial Bid Due Date is July 8th, 2015

Seattle, WA (2015-05-04) ATREG, Inc., which specializes in helping global companies dispose of infrastructure-rich advanced technology manufacturing assets, announced today in conjunction with Cushman & Wakefield, K.K. that the initial bid due date for the sale of Renesas Electronics Corporation's 23.4-acre Kofu technology campus located in the Yamanashi Prefecture, Japan is July 8th, 2015. All qualified parties interested in purchasing part or all of this campus are invited to express their intent with Renesas' ...

ams launches world's smallest ambient light sensor for next generation thinner wearable products

Unterpremstaetten (2015-04-29) Integrated on-chip interference filters reject IR producing a near-photopic response Unterpremstaetten, Austria (29 April, 2015), ams AG (SIX: AMS), a leading provider of high perfor-mance sensors and analog ICs, today introduced the TSL2584TSV, an ambient light sensor (ALS) in a through-silicon via (TSV) package which has a footprint of just 1.145 x 1.66 mm and a height of 0.32 mm. In display management applications, automatically controlling the backlight intensity with an ALS ensures ...

eSilicon's Javier DeLaCruz to Present: Cost Structure Advantages of 2.5D Integration

San Jose, California (2015-04-29) Javier DeLaCruz, senior director of product strategy, will be presenting at the 2015 IMAPS symposium. Javier will be discussing the cost structure advantages of 2.5D integration

Sidense Webinar on Memory Considerations for the Smart Connected Universe

Ottawa and San Jose (2015-04-28) Attend the Sidense Webinar on May 6 and learn how your Smart Connected design can benefit from Sidense's 1T-OTP memory IP.

SWS Enables First Sensor's Accelerometers and Inclinometers

Cairo, Egypt (2015-04-23) High Performance Inertial Sensing ASIC Continues to Deliver Best in Class Performance CAIRO, Egypt - April 23, 2015 - Si-Ware Systems (SWS), a premier provider of IC- and MEMS-based solutions for industrial and consumer applications, is supplying its SWS1110, high performance inertial sensing conditioning ASIC, for First Sensor's new line of accelerometers and inclinometers.

Longer run-times in view for single-cell li-ion battery applications as ams launches 96%-efficient 1A buck converter

Unterpremstaetten (2015-04-22) New AS1382's tiny footprint and 4MHz switching frequency enable implementation of very small power circuits in mobile phones and wearables Unterpremstaetten, Austria (22 April, 2015), ams AG (SIX: AMS), a leading provider of high perfor-mance sensors and analog ICs, today introduced a 1A synchronous buck converter with the wide input voltage range, high efficiency and low stand-by current required in designs powered by a single-cell lithium-ion battery. The new AS1382 step-down ...

NCAP China and Brite Semiconductor R&D Partnership for Complex System Packaging Solutions

Shanghai, China (2015-04-21) Collaborative innovation in China for next generation SoC and SiP solutions April 21st, 2015. Shanghai, China. The National Center for Advanced Packaging Co., Ltd. ("NCAP China"), a company dedicated to developing and commercializing advanced packaging and system integration technologies, has joined with Brite Semiconductor, an emerging ASIC design services firm headquartered in Shanghai, China, to announce a research and development (R&D) collaboration targeting single and multi-die ...

Frost and Sullivan "Movers & Shakers" Interview with Semitrex

San Antonio, TX (2015-04-17) Michael serves as Semitrex's CEO/CTO and is the founding inventor of its new technology, which changes the power conversion dynamic by bringing over 90% efficiencies to the market in a single module. Michael's inventions and business acumen have been the foundation for numerous successful start-up companies over the last twenty-five years. He holds multiple issued patents in the mobile video, RFID, smart grid, power supply industries, and nanotechnology Sectors. He co-invented a two-time Emmy ...

Unisem Announces Participation in Upcoming April and May Conferences

Sunnyvale, California (2015-04-16) Unisem, a global provider of semiconductor assembly and test services, today announced that it will be exhibiting at the following upcoming conferences: MEMS Industry Group's MEMS Technical Congress 2015 on May 6-7 in Boston, MA. MEMS Journal's Automotive Sensors and Electronics Expo 2015 on May 20 in Detroit, MI. MEPTEC MEMS Tech Symposium on May 20 in San Jose, CA. MEPTEC Internet of Things Symposium on May 21 in San Jose, CA. The company will also be participating but not ...

AMS' Unveils Specialty Sensor Technology Portfolio Optimized For IoT Applications

Unterpremstaetten (2015-04-15) Complete turnkey offering for complex sensor solutions boosts time to market and provides proven route to silicon for foundry customers Unterpremstaetten, Austria (April 15, 2015), The Full Service Foundry division of ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, today presented at the GSA Silicon Summit 2015 its comprehensive sensor technology and solutions portfolio which provides foundry customers a complete tool set to develop advanced sensor ...

The Internet of Things (IoT): Exploring revenue generating use cases

Silicon Valley, CA (2015-04-10) Discover the key takeaways from a recent convening of IoT thought leaders designed to explore how organizations can make the leap to revenue generation through IoT technologies.

TSMC March Sales Rise 15%

(2015-04-10) Pure-play IC foundry Taiwan Semiconductor Manufacturing Company (TSMC) has reported consolidated revenues of NT$72.27 billion (US$2.32 billion) for March 2015, up 15.4% on month and 44.7% on year.

MStar to Acquire Alpha for NT$37 Per Share

(2015-04-09) Eyeing IoT and image sensor chip business opportunities, MStar Semiconductor plans to acquire Alpha Imaging Technology for a total of NT$2.07 billion (US$66.37 million).

MediaTek March Sales Rebound

(2015-04-09) MediaTek saw its March revenues soar almost 111% sequentially to more than NT$20 billion (US$642 million). Revenues for the first quarter of 2015 came in line with the company's guidance.

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