NEW USER
separator
Forgot
Password?
separator
separator
FacebookTwitterLinkedInYouTube
separator
Global Semiconductor Alliance Logo

Member News

OCP 2019: eSilicon to demonstrate 56G DSP SerDes over a 5-meter cable assembly in Samtec booth

San Jose, Calif. (2019-03-12) eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will demonstrate its 7nm FinFET-class SerDes IP product at OCP 2019. What SerDes Demonstration: Samtec booth at OCP, San Jose Convention Center Thursday-Friday March 14-15, 2019 Using Samtec ExaMAX Backplane Connector paddle cards and a five-meter ExaMAX Backplane Cable Assembly, eSilicon will demonstrate the performance, flexibility and extremely low power consumption of ...

Interoperability demo at OFC: eSilicon 56G SerDes and Precise-ITC 400G FEC

San Jose, Calif. (2019-03-05) eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today at the OFC conference in San Diego an interoperability demonstration in their booth #5416. The demonstration verifies interoperability between eSilicon's 56G PAM4 & NRZ DSP-based long-reach 7nm SerDes and the SerDes embedded in an Intel® Stratix® 10 FPGA. 400Gb/s Forward Error Correction (FEC) for the demo is implemented with the Precise-ITC E-pak 400G core ...

OFC 2019: eSilicon to demonstrate two 7nm IP products: 56G DSP SerDes over a 5-meter Samtec cable assembly and a complete HBM2 PHY subsystem

San Jose, Calif. (2019-02-27) eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will demonstrate two 7nm FinFET-class IP products at OFC 2019. What: SerDes Demonstrations: eSilicon Booth 5416 Tuesday-Thursday March 5-7, 2019 Using Samtec ExaMAX Backplane Connector paddle cards and a five-meter ExaMAX Backplane Cable Assembly, eSilicon will demonstrate the performance, flexibility and extremely low power consumption of its 7nm, 56G PAM4 and NRZ ...

Majority of Tech Industry Leaders Expect Silicon Valley to Be Surpassed as Leading Innovation Center

Santa Clara, California (2019-02-21) For the first time in KPMG's annual Global Technology Industry Innovation Survey, more than half of the respondents believe Silicon Valley will no longer be the technology innovation center of the world in four years. Leaders tabbed New York to become the top tech hub in addition to Silicon Valley, followed by Beijing, Tokyo, and London.

KPMG issues blockchain report for technology companies

Santa Clara, California (2019-02-21) KPMG's latest blockchain publication Blockchain for Technology, Media & Telecommunications Companies, outlines what company leaders should understand about blockchain, its potential benefits and use cases, and next steps for technology company executives to consider.

 

Bookmark the permalink.