In December 2022, the GSA BOD appointed Matt Murphy as Chair of the GSA Board of Directors. Under his leadership, Murphy will continue to drive the GSA vision of creating and maintaining an efficient, profitable and sustainable global ecosystem, as well as represent an extended value chain including systems, software, solutions and services, in addition to semiconductors.
Matthew Murphy
Matthew Murphy
Chairman & CEO
Marvell Technology, Inc.
As Chairman and Chief Executive Officer, Matt Murphy led the transformation of Marvell into becoming a leader in data infrastructure semiconductor solutions. Joining the company in July 2016 as CEO, Matt is responsible for leading new technology development, directing ongoing operations and driving Marvell’s growth strategy.
Prior to joining Marvell, Matt worked for Maxim Integrated, where he advanced through a series of business leadership roles over two decades. Most recently, he served as Executive Vice President of Business Units and Sales and Marketing, overseeing all product development and go-to-market activities. Prior to that, he served as the Senior Vice President of the Communications and Automotive Solutions Group and Vice President of Worldwide Sales and Marketing.
Matt is a recipient of a Silicon Valley Business Journal 2019 C-Suite award for CEO of a Large Public Company and was a “40 Under 40” honoree in 2011. In 2018, Institutional Investor named him All-America Executive Team Best CEO in the semiconductor category. He also served as the Chairman of the Semiconductor Industry Association (SIA) in 2018.
Matt earned a B.A. from Franklin & Marshall College and is also a graduate of the Stanford Executive Program. He served on the Board of Directors of eBay Inc. from March 2019 to June 2022 and is on the Boards of Directors of the SIA and Global Semiconductor Alliance (GSA) – where he also serves as the GSA Board Chairman.
Jodi Shelton
Jodi Shelton
CEO
GSA
Jodi Shelton is the co-founder and CEO of GSA. A pioneer within the technology space, Shelton was instrumental in the creation of the Alliance and has continuously addressed global issues in the industry as the voice of its members. Under her leadership, GSA has grown its membership to include companies throughout the supply chain representing 45 countries across the globe. In her role as CEO, Shelton ensures that the Alliance remains focused on achieving its defined mission and goal to foster a more effective ecosystem through collaboration, integration and innovation. She is the key liaison between GSA and the business community at high-level financial and industry conferences, providing insight on key topics pertaining to the global fabless supply chain. Shelton earned her bachelor’s degree in political science from San Diego State University and her master’s degree in political science from the University of Houston. She received Corporate Governance program certification from Columbia Business School.
Cristiano Amon
Cristiano Amon
President & CEO
QUALCOMM Incorporated
Cristiano Amon is President and Chief Executive Officer of Qualcomm Incorporated, and also serves on the Company’s board of directors. Amon assumed the role of CEO on June 30, 2021.
Amon began his Qualcomm career in 1995 as an engineer, and during his tenure, has helped shape the strategic direction for the Company in several leadership roles. Prior to becoming CEO, Amon served as president of Qualcomm. In that role, he steered development of a leading and differentiated product roadmap, spearheaded Qualcomm’s 5G strategy – as well as its acceleration and global roll out – and drove the expansion and diversification of the business to serve multiple industries. Additionally, he has overseen the successful execution of M&A to augment Qualcomm’s capabilities and accelerate growth in key areas, including RF Front End, Connectivity and Networking.
Previously, Amon led Qualcomm’s semiconductor business as president of QCT. He also held several technical and business leadership positions, which included having overall responsibility for Snapdragon® platforms.
Prior to Qualcomm, Amon served as chief technical officer for Vésper, a wireless operator in Brazil, and held leadership positions at NEC, Ericsson and Velocom.
Amon holds a B.S. degree in Electrical Engineering and an honorary doctorate from UNICAMP – Universidade Estadual de Campinas, São Paulo, Brazil. He is a member of the USPTO Council for Inclusive Innovation.
Dr. Alexis B. Björlin
Dr. Alexis B. Björlin
Vice President, Global Infrastructure Hardware
Meta
Dr. Alexis B. Björlin is Vice President of Infrastructure at Meta, responsible for shaping the vision and strategy on global Software/Hardware Codesign for AI Systems and Platforms. Her organization drives the cutting-edge design, build, and integration of end-to-end systems within our data centers, including compute, storage, and custom silicon products.
Dr. Björlin served as the Senior Vice President and General Manager of the optical systems division at Broadcom, where she led the business unit responsible for developing and manufacturing devices and systems used in optical communications. Prior to Broadcom, Björlin was corporate Vice President and General Manager of the data center connectivity group at Intel, where she oversaw three business units; the networking division, high-performance computing fabric division, and the silicon photonics division. While at Intel, Dr. Björlin commercialized Intel’s silicon photonics technology, served on the board of directors for the Intel capital diversity initiative, and was a frequent speaker and advocate for women and diversity in technology.
Prior to Intel, she served as President and a member of the board of directors for Source Photonics, a private equity-owned, global fiber optics manufacturer. She also currently serves on the board of directors at Digital Realty [NYSE:DLR], Astera Labs, and Global Semiconductor Association (GSA). Dr. Björlin holds a BS in materials science & engineering from MIT and a Ph.D. in materials science from the University of California, Santa Barbara.
Rani Borkar
Rani Borkar
Corporate Vice President, Azure Hardware Systems and Infrastructure
Microsoft
Rani Borkar is the Microsoft Corporate Vice President for Azure Hardware Systems and Infrastructure. In her role, Borkar leads the core organizations building Microsoft’s leading cloud computing platform—from silicon, systems, to supply chain.
Throughout her career, Borkar has established herself as a pioneering hardware engineer in the semiconductor industry, a technology executive, product visionary, and trusted leader with decades of experience in the computing industry. She is passionate about delivering end-to-end solutions to empower customers to achieve more.
Since joining Microsoft, Borkar has been instrumental in strengthening Azure’s place as the industry-leading cloud computing platform. Currently, Azure is the global leader in enterprise cloud computing, as it serves more than 95% of the Fortune 500.
As the head of Azure Hardware Systems and Infrastructure, she strengthens Microsoft’s deeply integrated Azure cloud services, technology roadmap, and research and development efforts. She is responsible for the vision, strategy, and architecture of silicon development, cloud supply chain as well as global capacity deployment for Microsoft’s cloud data center infrastructure. Under her leadership, Microsoft’s brightest engineering minds focus on developing technologies that will solve the world’s toughest problems and drive end-to-end business value for Azure’s products and solutions.
Before joining Microsoft, Borkar served as the Vice President of OpenPOWER Development at IBM. Prior to IBM, Borkar spent most of her career at Intel. As Corporate Vice President, she led Intel’s silicon product development strategy while leading large, complex, and diverse global engineering organizations that developed world-class microprocessors for Intel servers, PCs, phones, tablets, and the Internet of Things.
Leading with the philosophy of “mission first, people always,” Borkar has inspired and transformed organizations by building close-knit communities. To produce great technology, Borkar believes in the power of combining technology assets and engineering talent with the values of collaboration and mentorship to empower teams to achieve more and move the industry forward.
Borkar is actively involved in the Global Semiconductor Alliance (GSA), where she serves on the board of directors and as a Champion of Women Sponsor for the GSA Women’s Leadership Council. She is also on the board of directors of Applied Materials. Borkar also serves on the Board of Trustees at Oregon State University to help guide the state’s effort to advance economic development and innovation.
Borkar earned a bachelor’s degree and a master’s degree—both in physics—from the University of Mumbai, India. She went on to earn a second master’s degree in electrical engineering from the Oregon Graduate Institute. Borkar also holds an Executive Program in Leadership (LEAD) certificate from the Stanford University Graduate School of Business.
Rick Cassidy
Rick Cassidy
SVP and CEO
TSMC
Throughout his career Cassidy has demonstrated a keen ability to manage both the technical and business areas of the semiconductor industry. His leadership and drive have had a dramatic and lasting impact on the way semiconductors are designed and manufactured.
Cassidy became President, TSMC North America in January 2005 and was elected a Corporate Vice President, TSMC, Ltd. in November 2008. Since joining the company in 1997 as Vice President, Account Management, he has driven many of the strategic initiatives and business process improvements that helped TSMC achieve its current market position. He also served as Senior Vice President, Operations, instituting productivity and business process efficiencies that kept customers and the company on-course during one of the semiconductor industry’s most turbulent times; and Executive Vice President, Office of the President, TSMC North America.
He began his career at Fairchild Semiconductor Company (later acquired by National Semiconductor) where he held a series of executive and management positions in engineering, manufacturing, quality and reliability, and marketing. Prior to Joining TSMC, he was Vice President and General Manager of National’s Military & Aerospace Division. Cassidy serves on the GSA board of directors, an organization dedicated to the advancement of the worldwide semiconductor industry.
A graduate of the United States Military Academy at West Point with a bachelor’s degree in engineering, Cassidy served as a U.S. Army officer before embarking on his business career.
Dr. Thomas Caulfield
Dr. Thomas Caulfield
President & CEO
GLOBALFOUNDRIES
Dr. Thomas Caulfield is the President and Chief Executive Officer (CEO) of GF which recently went public in October 2021. He was elected to the board of directors in March 2018 and joined the company in May 2014 as Senior Vice President and General Manager of the company’s Fab 8 semiconductor wafer manufacturing facility in Malta, NY. Dr. Caulfield led operations, process development, and the expansion and ramp-up of semiconductor manufacturing production. He has an extensive career spanning engineering, executive management, and global operational leadership with leading technology companies.
Prior to joining GF, Dr. Caulfield served as President and Chief Operations Officer (COO) at Soraa from May 2012 to May 2014, the world’s leading developer of GaN on GaNTM (gallium nitride on gallium nitride) solid-state lighting technology. Before Soraa, Dr. Caulfield served as President and COO of Ausra from 2009 to 2010, a leading provider of large-scale concentrated solar power solutions for electrical power generation and industrial steam production. Prior to leading at Ausra, Dr. Caulfield served as Executive Vice President of Sales, Marketing and Customer Service at Novellus Systems, Inc. Before that, Dr. Caulfield spent 17 years at IBM in a variety of senior leadership roles, ultimately serving as vice president of 300mm semiconductor operations for IBM’s Microelectronics division, leading its wafer fabrication and R&D operations in East Fishkill, NY.
He currently serves as a member of the board of directors for Western Digital Corporation. Dr. Caulfield earned a Bachelor of Science in Physics from St. Lawrence University before entering Columbia University’s Fu Foundation School of Engineering and Applied Science, where he earned both his Bachelor and Master of Science in Materials Science and Engineering as well as a Doctorate in Materials Science and Engineering. Dr. Caulfield was also a postdoctoral fellow at Columbia’s Engineering Center for Strategic Materials.
Naga Chandrasekaran
Senior Vice President, Technology Development
Micron Technology, Inc.
Naga Chandrasekaran is senior vice president of technology development at Micron Technology. Dr. Chandrasekaran leads Micron’s global technology development and engineering efforts related to the scaling of current memory technologies, advanced packaging technology, as well as investigating emerging memory technology solutions to support Micron’s future requirements. He also manages mask technology development, corporate characterization labs, advanced modeling and data analytics, and R&D fabrication operations at Micron’s headquarters in Boise, Idaho. He was appointed to his current position in 2019.
In 2001, Dr. Chandrasekaran joined Micron as a CMP development engineer and since then has held a series of positions of increasing responsibility in process and equipment development across multiple R&D process areas, leading manufacturing and technology transfer efforts, integration of new business units, and development of solar, LED and display technology. From 2007 to 2008, he also served as fab engineering manager for IM Flash, Singapore Operations. He most recently served as senior vice president of process research and technology development.
Dr. Chandrasekaran has authored several keynote publications and patents, and he has served as an invited panel speaker at several conferences. He has also received several awards, including Jiri Tlusty Outstanding Young Manufacturing Engineer of the Year, awarded by the Society of Manufacturing Engineers in 2003, and Engineering Manager of the Year, awarded by the American Society of Engineering Management (ASEM) in 2018.
Dr. Chandrasekaran earned a bachelor’s degree in mechanical engineering from the University of Madras. He earned both a master’s and a doctorate degree in mechanical engineering from Oklahoma State University and dual executive MBAs from the University of California, Los Angeles (UCLA-Anderson School of Management) and the National University of Singapore. Naga received a master’s degree in Information and Data Science from U.C. Berkeley in 2022.
Jean-Marc Chery
President and Chief Executive Officer
STMicroelectronics
Jean-Marc Chery is STMicroelectronics’ President and Chief Executive Officer and has held this position since May 31, 2018. He is the Sole Member of ST’s Managing Board and chairs its Executive Committee.
Chery began his career in the Quality organization of Matra, the French engineering group. In 1986, he joined Thomson Semiconducteurs, which subsequently became ST, and held various management positions in product planning and manufacturing, rising to lead ST’s wafer fabs in Tours, France, and later in Rousset, France. In 2005, Chery led the company-wide 6-inch wafer-production restructuring program before taking charge of ST’s Front-End Manufacturing operations in Asia Pacific. In 2008, he was promoted to Chief Technology Officer and assumed additional responsibilities for Manufacturing and Quality (2011) and the Digital Product Sector (2012). In 2014, Chery was appointed ST’s Chief Operating Officer responsible for Technology and Manufacturing operations. In July 2017, Chery was appointed Deputy CEO with overall responsibility for Technology and Manufacturing, as well as for Sales and Marketing operations.
Chery is a member of the Board of Directors at Legrand and Chairman of the France – Malaysia Business Council at Medef International. Previously, he was President of the European microelectronics R&D program AENEAS and served as President of the European Semiconductor Industry Association (ESIA) in 2019-2021. Chery was promoted Knight of the Legion of Honor by the French Ministry of Economy and Finance in July 2019.
Jean-Marc Chery was born in Orleans, France, in 1960, and graduated with a degree in Engineering from the ENSAM engineering school in Paris, France.
Dr. Aart J. de Geus
Dr. Aart J. de Geus
Chairman & Co-CEO
Synopsys, Inc.
Since co-founding Synopsys in 1986, Dr. Aart de Geus has expanded Synopsys from a start-up synthesis enterprise to a world leader in electronic design automation (EDA). As a technology visionary, he is frequently asked to speak on topics related to the electronics industry. As one of the leading experts on logic simulation and logic synthesis, Dr. de Geus was made a fellow of the Institute of Electrical and Electronics Engineers (IEEE) in January 1999. He has been honored for his industry achievements with the 2001 IEEE Circuits and Systems Society Industrial Pioneer Award, the 2007 IEEE Robert N. Noyce Medal, and the 2008 EDAC/CEDA Kaufman award. In 2002, shortly after transacting the largest merger in EDA history, Dr. de Geus was named CEO of the Year by Electronic Business magazine, and in 2004, Entrepreneur of the Year in IT for Northern California by Ernst & Young. In November 2005, Electronic Business magazine chose Dr. de Geus as one of “The 10 Most Influential Executives.” In November of 2007, he was awarded the Silicon Valley Leadership Group (SVLG) “Spirit of the Valley” Lifetime Achievement Award. In October 2008, he was presented with the Phil Kaufman Award for distinguished contributions to EDA and in 2009 was awarded the Dr. Morris Chang Exemplary Leadership Award by the Global Semiconductor Alliance (GSA).
Dr. de Geus is active in the business community as chairman of the Board of the Silicon Valley Leadership Group (SVLG), and a member of TechNet, the GSA, and the Electronic Design Automation Consortium (EDAC). He is also heavily involved in education for the next generation, having created in 1999 the Synopsys Outreach Foundation, which promotes project-based science and math learning throughout Silicon Valley.
Matt Johnson
Matt Johnson
President and CEO
Silicon Labs
Matt Johnson serves as President and CEO of Silicon Labs, a leader in secure, intelligent wireless technology for a more connected world. Prior to becoming CEO, Matt led the company’s Internet of Things (IoT) business unit through a period of accelerating growth and industry leadership. Silicon Labs is now solely focused on technology solutions to enable smart, connected devices, which are transforming industries, growing economies, and improving lives and our environment. Before joining Silicon Labs, Matt held leadership positions at NXP, Freescale, and Fairchild Semiconductor.
Matt is dedicated to a strong company culture, innovative product development and operational excellence. He holds a B.S. in Electrical Engineering Technology from the University of Maine and has completed executive programs at Harvard Business School and Stanford University. Matt currently serves on the boards of Dell Children’s Medical Center Foundation, the Global Semiconductor Alliance, and the Semiconductor Industry Association.
Anirudh Devgan
Anirudh Devgan
President and CEO
Cadence Design Systems, Inc.
Dr. Anirudh Devgan has served as President and CEO of Cadence Design Systems, Inc. since December 2021, and has been a member of the Board of Directors since August 2021. He served as President of the company from 2017 to 2021, overseeing all business groups, research and development, sales, field engineering and customer support, strategy, marketing, mergers and acquisitions, business development, and IT. Prior to becoming President, he was Executive Vice President and General Manager of the Digital & Signoff and System & Verification groups at Cadence.
Prior to joining Cadence in 2012, Dr. Devgan was General Manager and Corporate Vice President of the Custom Design Business Unit at Magma Design Automation. Previous roles include management and technical positions at IBM, where he received numerous awards including the IBM Outstanding Innovation Award. Dr. Devgan is an IEEE Fellow, has written numerous research papers, and holds several patents.
Dr. Devgan received a Bachelor of Technology degree in electrical engineering from the Indian Institute of Technology, Delhi, and MS and PhD degrees in electrical and computer engineering from Carnegie Mellon University.
Brian Faith
Brian Faith
President & CEO
QuickLogic Corporation
Brian Faith was promoted to CEO in June 2016 after having served as Vice President of Worldwide Marketing and Vice President of Worldwide Sales & Marketing between 2008 and 2016. Mr. Faith has been with QuickLogic since 1996, and during the last 20 years has held a variety of managerial and executive leadership positions in engineering, product line management, marketing and sales. Mr. Faith has also served as the Chairman of the Marketing Committee for the CE-ATA Organization. He holds a B.S. degree in Computer Engineering from Santa Clara University and was an Adjunct Lecturer at Santa Clara University for Programmable Logic courses.
Rene Haas
Rene Haas
CEO
ARM
Rene was appointed Chief Executive Officer and to the Arm Board in February 2022. Prior to being appointed CEO, Rene was President of Arm’s IP Products Group (IPG) from January 2017. Under his leadership, Rene transformed IPG to focus on key solutions for vertical markets with a more diversified product portfolio and increased investment in the Arm software ecosystem. In addition to his role as CEO, Rene also sits on the board of Arm China.
Rene joined Arm in October 2013 as Vice President of Strategic Alliances and two years later was appointed to the Executive Committee and named Arm’s Chief Commercial Officer in charge of global sales and marketing.
Before joining Arm, Rene held several applications management, applications engineering and product engineering roles, including seven years at NVIDIA as vice president and general manager of its computing products business. Prior to NVIDIA, Rene held executive roles at Scintera Networks and Tensilica.
Rene serves on the boards of Computacenter and Mythic and is based in Silicon Valley, U.S. He also spends significant time in the major technology centers of Europe and APAC.
Rene earned his BS in Electrical and Electronics Engineering from Clarkson University and is a graduate of the Stanford University Graduate School of Business Executive Education Program.
Jinman Han
Jinman Han
President, Samsung Device Solutions Americas
EVP, Samsung Electronics
Jinman Han serves as President of Samsung Device Solutions Americas (DSA) and Corporate EVP of Samsung Electronics, responsible for Samsung’s U.S. semiconductor business, which includes Memory, Foundry, System LSI, and LED.
Jinman is a respected leader who has held many leadership positions at Samsung throughout his career, most recently as head of the Memory Global Sales & Marketing team. He joined Samsung in 1989 and has worked in various departments, including DRAM design, Flash design, Flash solution product planning, Memory product planning and application engineering, and SSD development.
His expertise and insight in the industry have contributed significantly to the company’s presence within the memory market and have helped maintain Samsung’s market leadership for decades.
Jinman is based in San Jose, CA, and holds a bachelor’s degree in Electrical Engineering from Seoul National University in Korea.
Alper Ilkbahar
Alper Ilkbahar
Senior Vice President, Global Strategy & Technology
Western Digital Corporation
Alper Ilkbahar is Senior Vice President of Global Strategy and Technology at Western Digital. He oversees NAND Technology development, Next Generation Technologies as well as Corporate Research functions.
Prior to joining Western Digital in 2022, he was the Vice President of Data Center Group and General Manager of the Intel Optane Group, overseeing development of memory and storage solutions by integrating innovative hardware and software for next-generation data centers around Optane Technology.
Previously, he was Vice President and General Manager of several business units at SanDisk, which he joined through the acquisition of Matrix Semiconductor Inc.
Ilkbahar spent the first decade of his career at Intel’s microprocessor division, holding design engineering and management roles that spanned from the Intel486 processor to the Intel® Itanium® processor.
Ilkbahar earned a bachelor’s degree in electrical engineering from Boğaziçi University in Istanbul, Turkey; a master’s degree in electrical engineering from the University of Michigan; and an MBA degree from the Wharton School of the University of Pennsylvania.
He holds more than 50 patents in the fields of semiconductor process, device, design and testing and has published multiple conference and journal papers in his areas of expertise.
Dr. Ann B. Kelleher
Dr. Ann B. Kelleher
EVP and GM, Technology Development
Intel Corporation
Dr. Ann B. Kelleher is executive vice president and general manager of Technology Development at Intel Corporation. She is responsible for the company’s worldwide manufacturing operations, including Fab Sort Manufacturing, Assembly Test Manufacturing and strategic planning, as well as corporate quality assurance and corporate services.
Kelleher joined Intel in 1996 as a process engineer, going on to manage technology transfers and factory ramp-ups in a variety of positions spanning 200mm and 300mm technologies. She started her manufacturing leadership journey as the factory manager of Fab 24 in Leixlip, Ireland. She was site manager of Intel’s Fab 11X facility in Rio Rancho, New Mexico, and plant manager of Intel’s Fab 12 facility in Chandler, Arizona. She then became general manager of the Fab Sort Manufacturing organization where she was responsible for all aspects of Intel’s high-volume silicon manufacturing.
Before assuming her current position in Manufacturing and Operations, Kelleher was co-general manager of the Technology and Manufacturing Group where she was responsible for corporate quality assurance, corporate services, Intel product supply chain, corporate supply chain and strategic planning for the company’s worldwide manufacturing operations.
She holds a bachelor’s degree, a master’s degree and a Ph.D. in electrical engineering, all from University College Cork in Ireland.
Dr. Lawrence Loh
Dr. Lawrence Loh
President, MediaTek USA Inc. and Corporate Sr. Vice President
MediaTek Inc.
Over 20+ years of his professional career, Dr. Loh has demonstrated his contributions to the global semiconductor industry not only as a hands-on IC design engineer/architect, but also a seasoned corporate executive with management scope covering RD/engineering and business operations.
Dr. Loh is a Corporate Vice President of MediaTek Inc., responsible for centralized corporate RD and engineering functions including RF, analog/mixed-signal and circuits/hardware engineering and technology development for all MediaTek’s product lines including wireless communication, mobile application processors, wireless connectivity, home entertainment, optical storage and broadband/networking business. He is also serving as President of MediaTek USA, overseeing the company’s global operations in Europe and America.
Before joining MediaTek in 2004, Dr. Loh had contributed to IC design industry in areas of read/write channels for magnetic and optical storage, high-performance analog filters, solid-state fingerprint sensors, highspeed SERDES and wireline PHY transceivers for IT, broadband, networking and mass storage applications. Dr. Loh started his first circuit design position at IMP and later he joined Cirrus Logic, where his last position was Director of Analog IC Engineering. In 1998, Dr. Loh founded Silicon Bridge Inc., where he successfully led a number of analog/mixed-signal IC development projects with major semiconductor companies including MediaTek Inc. and Altera Corporation.
Dr. Loh received his Ph.D. degree in Electrical Engineering, with emphasis in analog circuit design, from Texas A&M University, College Station, Texas. He served on ISSCC International Technical Program Committee during 2005-1010. Dr. Loh has authored/co-authored dozens of technical papers/patents in areas of analog and mixed-signal integrated circuits/systems design and has contributed many panel talks and invited keynote speeches at numerous international conferences and professional communities.
Dr. Nicky Lu
Dr. Nicky Lu
Founder, Chairman and CEO
Etron Technology, Inc.
As a researcher, design architect, entrepreneur and chief executive, Dr. Lu has dedicated his career to the worldwide IC design and semiconductor industry. In addition to Etron Technology, where he serves as Founder, Chair, and CEO, he also co-founded several other notable high-tech companies including Ardentec, Global Unichip and GTBF.
He co-invented and pioneered a 3D-DRAM technology, known as the Substrate-Plate Trench-Capacitor (SPT) cell, along with its associated array architecture, which has been widely used by IBM and its licensees from 4Mb to 1Gb DRAMs and embedded DRAMs worth hundreds of billions of dollars. Dr. Lu designed several High-Speed CMOS DRAM (HSDRAM) chips, all with top world record performance. He was a co-architect leading the 8-inch wafer and DRAM/SRAM/LOGIC technology developments for Taiwan’s semiconductor industry in the early 1990s and also created many Taiwan companies as prominent silicon-chip suppliers. Since 1999 he has pioneered Known-Good-Die Memory Products enabling 3D stacked-die system chips; this work summoned the new rise of an IC Heterogeneous Integration Era as described in his ISSCC-2004 plenary talk, demonstrating a new 3D-IC trend. He was a keynote speaker at the 2016 A-SSCC declaring the Silicon-Age-4.0 Era with a new Virtual Moore’s Law for continual economic growth.
Dr. Lu received his B.S. in Electrical Engineering from National Taiwan University and M.S. and Ph.D. in EE from Stanford University. He holds over 37 granted U.S. patents and has published more than 60 technical papers. He serves or has served as Managing Board Director and was Chairman of TSIA, as Board Member of Global Semiconductor Alliance (GSA) and GSA’s General Chair (2009 to 2011), and Chairman of WSC (World Semiconductor Council) from 2014 to 2015.
He received the Scientific Management Award (2012) from Chinese Society for Management of Technology & Taiwan’s Golden Merchant Award (2007) from General Chamber of Commerce. He is an Outstanding Alumnus of National Taiwan University and National Chiao-Tung University (also Chair Professor ‘05-’07), the recipient of the IEEE 1998 Solid-State Circuits Award and a SEMI Industry Contribution Award in 2017, an IEEE Fellow and a member of NAE (National Academy of Engineering of USA).
Ganesh Moorthy
Ganesh Moorthy
President & CEO
Microchip Technology
Ganesh Moorthy was appointed as President and Chief Executive Officer of Microchip Technology in March 2021 and was also appointed to Microchip’s Board of Directors in January 2021. He served as the President and Chief Operating Officer of Microchip since February 2016, Chief Operating Officer since June 2009 and as Executive Vice President from October 2006 to May 2009. Earlier, Mr. Moorthy was Vice President with responsibility for several of Microchip’s business units. Prior to joining Microchip in 2001, he held successive engineering and executive leadership roles at Intel over a period of 19 years.
Mr. Moorthy serves on the Board of Directors of Rogers Corp., a global leader in engineered materials to power, protect, and connect our world. Mr. Moorthy holds a Master of Business Administration (MBA) in marketing from National University in Sacramento, Calif.; a Bachelor of Science degree in electrical engineering from the University of Washington; and a Bachelor of Science degree in physics from the University of Bombay.
Dr. Omkaram Nalamasu
Dr. Omkaram Nalamasu
CTO & Sr. Vice President
Applied Materials, Inc.
Dr. Omkaram (Om) Nalamasu is senior vice president and chief technology officer (CTO) for Applied Materials. He brings extensive experience and passion to the role of CTO, where he is leading the development of new product pipelines, securing government funding for key strategic projects and building a world-class team to maintain Applied Materials’ technology leadership in the industries it serves and enable growth into new markets.
Dr. Nalamasu is also the president of Applied Ventures, LLC, the venture capital fund of Applied Materials, overseeing the financial and strategic investments in early and growth-stage privately held companies.
A world-renowned expert in materials science and technology and one of our industry’s respected forward thinkers, Dr. Nalamasu has championed a renewed focus on the company’s innovation culture through various internal development programs and open innovation methods.
Dr. Nalamasu joined Applied Materials in 2006, after serving as vice president of research and NYSTAR Distinguished Professor of Materials Science and Engineering at Rensselaer Polytechnic Institute (RPI). Prior to this, He has held key research and development leadership positions at AT&T Bell Laboratories, Bell Laboratories/Lucent Technologies, and Agere Systems, Inc.
His research interests include nanomanufacturing, nanopatterning, electronic and photonic materials, and lithography, with special emphasis on applying patterning and materials know-how for device fabrication for electronics, photonics and energy applications.
Dr. Nalamasu has made seminal contributions to the fields of optical lithography and polymeric materials science and technology. He has received numerous awards, authored more than 180 papers, review articles and books, and holds more than 35 patents.
Dr. Nalamasu is a member of the board of directors of The Tech Museum in San Jose, and serves on several International and National advisory boards. He received his Ph.D. from the University of British Columbia, Vancouver, Canada.
mark papermaster
Mark Papermaster
Chief Technology Officer & Executive Vice President
AMD
Mark Papermaster is Chief Technology Officer and Executive Vice President of Technology and Engineering at AMD and is responsible for corporate technical direction, product development including system-on-chip (SOC) methodology, microprocessor design, I/O and memory and advanced research. He led the re-design of engineering processes at AMD and the development of the award-winning “Zen” high-performance x86 CPU family, high-performance GPUs and the company’s modular design approach, Infinity Fabric. He also oversees Information Technology that delivers AMD’s compute infrastructure and services.
His more than 35 years of engineering experience includes significant leadership roles managing the development of a wide range of products, from microprocessors to mobile devices and high-performance servers. Before joining AMD in October 2011 as Chief Technology Officer and Senior Vice President, Papermaster was the leader of Cisco’s Silicon Engineering Group, the organization responsible for silicon strategy, architecture, and development for the company’s switching and routing businesses. He served as Apple Senior Vice President of Devices Hardware Engineering, where he was responsible for iPod and iPhone hardware development. He also held a number of senior leadership positions at IBM overseeing development of the company’s key microprocessor and server technologies.
Papermaster received his bachelor’s degree from the University of Texas at Austin and master’s degree from the University of Vermont, both in Electrical Engineering. He is a long-term member of the University of Texas Cockrell School of Engineering Advisory Board, Olin College Presidents Council and the Juvenile Diabetes Research Foundation. Most recently, he was appointed to the CTO Forum Advisory Board and IEEE Industry Advisory Board.
Dr. Ren Qiwei
Dr. Qiwei Ren
Executive Vice President of TSINGHUA UNIGROUP
CEO of UNISOC
Dr. Qiwei Ren received the bachelor and master degrees from Tsinghua Univ. in 1992 and 1995 respectively, and Ph. D. from Delft Univ. of Technology in 2002. In 2001, he joined in Philips Semiconductors in the Netherlands, worked in Advanced Memory Design Center for embedded memory development. In 2006, he joined the design center of Qimonda Technology in Xi’an, China as the Design Director for DRAM product development. In 2009 he promoted the acquisition as co-founder and re-found the design center as Xi’an Sinochip Semiconductors Co. Ltd, worded as general manager. In 2015 the company was acquired again and renamed as Xi’an UniIC Semiconductors Co. Ltd. In 2018 he started to work as CEO of UNIC memory technology Co. Ltd in the same time. From March 2022, he become the acting CEO of UNISOC (Shanghai) Technologies Co., Ltd.. In 2012-2017 he was part time professor in Xi’an Jiaotong University, and IEEE senior member for many years.
Hidetoshi Shibata
Hidetoshi Shibata
President and CEO
Renesas
Mr. Shibata became President and CEO of Renesas Electronics Corporation in July 2019. He joined Renesas in November 2013, as Executive Vice President, and CFO. He served on the company’s Board of Directors from November 2013 to May 2016 and from March 2018 to the present. In these roles, Mr. Shibata is credited with having helped to define and execute the restructuring of Renesas’ businesses and successfully leading three large-scale acquisitions of Intersil, Integrated Device Technology, and Dialog Semiconductor.
Before joining Renesas, he was Executive Managing Director of Innovation Network Corporation of Japan (“INCJ”) a Japanese sovereign investment fund and he sat on the boards of the six companies in which he led investment up until 2013.
Prior to his career at INCJ, he was Managing Director, Global Private Equity, at Merrill Lynch. At the age of 35, he was the youngest Managing Director in their global team. Before Merrill Lynch he worked as Partner at MKS Partners, a private equity firm based in Japan, where he was responsible for various transactions.
Mr. Shibata started his career at Central Japan Railway and played key roles in a large-scale re-engineering project. He also obtained a license to drive Shinkansen bullet trains. He has an MBA from Harvard Business School and a BE from the University of Tokyo.
Kurt Sievers
Kurt Sievers
President and CEO
NXP Semiconductors
Kurt Sievers has served as president and chief executive officer of NXP since May 2020. As a member of NXP’s executive management team since 2009, Kurt has been instrumental in leading the definition and implementation of NXP’s strategy for “secure connections for a smarter world.” Prior to being elected CEO, Kurt served as president of NXP and oversaw all of the company’s business lines. In 2019, Kurt led the successful acquisition of Marvell’s Wi-Fi Connectivity Business Unit, enabling NXP to deliver complete, scalable processing and connectivity solutions to customers across NXP’s focus end markets. In 2015, he played a key role in the merger of NXP and Freescale Semiconductor, which created one of the world’s leading semiconductor companies and a leader in automotive semiconductors and secure edge processing. Kurt joined NXP in 1995, progressing through a series of sales and marketing, product definition and development, strategy and general management leadership positions across a broad number of market segments. Kurt earned a Master of Science degree in physics and information technology from Augsburg University, Germany.
Andreas Urschitz
Andreas Urschitz
CMO, Member of the Management Board
Infineon Technologies AG (IFX)
Andreas Urschitz serves as a Chief Marketing Officer and Member of the Management Board of Infineon Technologies AG (IFX).
Prior to being appointed to the Board, he led Infineon’s Power & Sensor Systems Division for ten years, which focuses on power semiconductors driving energy-efficiency and sensors powering IoT systems. Their products make devices consume less, and enable decarbonization and digitalization. Among the division‘s most important innovations in Andreas’ tenure are the energy-saving technologies CoolMOS™ and OptiMOS™, which can be found in almost every power-consuming application, e.g. in data centers. Pressure sensors, silicon microphones, radar and Time-of-Flight-imagers made by Infineon can be found in smartphones and other electrical devices all over the world.
Before becoming division president, Andreas already held several different management roles in the areas of production, marketing, development and sales at Infineon. He also has a degree in Commercial Science from the Vienna University of Economics and Business.
Andreas firmly believes that decarbonization and digitalization are the two defining challenges of our time. He is passionate about innovating and developing the best technologies, and doing his part to shape a future that is worth living – for ourselves, and for generations to come. He sees technical development not as an end in itself, but as a way to make life better, protect the future of humanity and make the world a safer and more livable place.
Dr. Tien Wu
Dr. Tien Wu
CEO, Advanced Semiconductor Engineering, Inc. (ASE)
CEO, Universal Scientific Industrial Co., Ltd. (USI)
Advanced Semiconductor Engineering, Inc. (ASE Group)
Dr. Tien Wu is the Chief Executive Officer of Advanced Semiconductor Engineering, Inc. (ASE) and concurrently the Chief Executive Officer of Universal Scientific Industrial Co., Ltd. (USI). He is also a member of the Board of Directors and Chief Operating Officer of the ASE Technology Holding Co., Ltd. (NYSE: ASX, TWSE: 3711).
Tien serves as a Board Member of the Global Semiconductor Association (GSA) and SEMI, which are global industry associations serving the manufacturing supply chain for the micro- and nano-electronics industries.
Prior to joining ASE, Tien held several management positions within IBM including R&D, manufacturing and sales in the United States, Europe and Asia-Pacific. He holds twelve U.S. patents and has authored over twenty-five articles. Tien holds a BSCE degree from Taiwan University, and also earned MS and Ph.D. degrees in mechanical engineering and applied mechanics respectively from the University of Pennsylvania. In 2015, Tien received an Honorary Degree of Doctor of Science from Binghamton University.
Dr. Haijun Zhao
Dr. Haijun Zhao
Co-CEO and Executive Director
Semiconductor Manufacturing International Corporation (SMIC)
Dr. Haijun Zhao joined SMIC in October of 2010, and has 25 years of experience in semiconductor operations and technology development. He has a Ph.D. in wireless from the University of TsingHua, an MBA from University of Chicago, and is a part of the National Integrated Circuit promotion committee members of China.
Yiming Zhu
Yiming Zhu
Chairman and CEO
ChangXin Memory Technologies, Inc. (CXMT)
Yiming Zhu is Chairman and Chief Executive Officer of ChangXin Memory Technologies, Inc. (CXMT).
Prior to joining CXMT, Yiming was Chief Executive Officer of GigaDevice Semiconductor Inc. (GigaDevice), which he founded in 2005 and soon became a leading player in the global NOR Flash market. He brought innovative minds and passion to the company to develop products empowering various smart applications. Currently, he also serves as Chairman of GigaDevice.
Yiming is widely credited as a pioneer in China’s memory industry. He has participated in a number of key R&D projects in China and filed more than 50 patents at home and abroad. Yiming has also won numerous honors and awards, including the “Innovator of the Year” by Global Sources and the “IC Design Leader of the Year in China” by China Semiconductor Industry Association IC Design Branch in 2013.
Yiming received his bachelor’s and master’s Degrees from Tsinghua University and another master’s Degree from the State University of New York at Stony Brook, before starting his career in US as an R&D engineer.