Dr. Lisa Su
Dr. Lisa Su
CEO, President and Board Member
Advanced Micro Devices, Inc. (AMD)
Dr. Lisa Su is AMD’s president and chief executive officer and also serves on the company’s board of directors. Previously, she was chief operating officer responsible for integrating AMD’s business units, sales, global operations and infrastructure enablement teams into a single market-facing organization responsible for all aspects of product strategy and execution. Dr. Su joined AMD in January 2012 as senior vice president and general manager, global business units and was responsible for driving end-to-end business execution of AMD’s products and solutions.
Prior to joining AMD, Dr. Su served as senior vice president and general manager, Networking and Multimedia at Freescale Semiconductor, Inc., and was responsible for global strategy, marketing and engineering for the company’s embedded communications and applications processor business. Dr. Su joined Freescale in 2007 as chief technology officer, where she led the company’s technology roadmap and research and development efforts.
Dr. Su spent the previous 13 years at IBM in various engineering and business leadership positions, including vice president of the Semiconductor Research and Development Center responsible for the strategic direction of IBM’s silicon technologies, joint development alliances and semiconductor R&D operations. Prior to IBM, she was a member of the technical staff at Texas Instruments in the Semiconductor Process and Device Center (SPDC).
Dr. Su has bachelor’s, master’s and doctorate degrees in electrical engineering from the Massachusetts Institute of Technology (MIT). She has published more than 40 technical articles and was named a Fellow of the Institute of Electronics and Electrical Engineers (IEEE) in 2009. Dr. Su was named “2014 Executive of the Year” at the EETimes and EDN 2014 ACE Awards and was honored in MIT Technology Review’s Top 100 Young Innovators in 2002. She also serves on the Board of Directors for Analog Devices and the U.S. Semiconductor Industry Association.
Since joining Arm as one of its first employees, Simon has driven technical and business innovations to help transform the company into the leading architect of the most pervasive compute technology the world has ever seen.
Simon led the development of early ground-breaking Arm processors – the Arm7 and Arm9 – powering the world’s first digital mobile phones. He played a key role in developing industry standards, and his engineering work led to him being granted several embedded-systems patents. He became vice president of engineering in 2001, and before being named as Arm CEO in July 2013, he held several other strategy positions including global head of sales. He was personally responsible for expanding the company’s U.S. business and strengthening its leadership and relationships in California’s Silicon Valley, where he still lives with his family.
Simon helped steer the company through the 2016 acquisition by SoftBank, and, in June 2017, was elected to serve on the SoftBank board. He also sits on the boards of the Global Semiconductor Alliance (GSA), the Electronic System Design Alliance (ESD Alliance), TechWorks and is a non-executive director at Dolby Laboratories, Inc.
Simon earned his BEng in electronic engineering from the University of Sussex and an MSc in computer science from the University of Manchester.
Jodi Shelton is the co-founder and president of GSA. A pioneer within the technology space, Shelton was instrumental in the creation of the Alliance and has continuously addressed global issues in the industry as the voice of its members. Under her leadership, GSA has grown its membership to include companies throughout the supply chain representing 25 countries across the globe. In her role as president, Shelton oversees GSA daily operations, ensuring that the Alliance remains focused on achieving its defined mission and goal to foster a more effective ecosystem through collaboration, integration and innovation. She is the key liaison between GSA and the business community at high-level financial and industry conferences, providing insight on key topics pertaining to the global fabless supply chain. Shelton earned her bachelor’s degree in political science from San Diego State University and her master’s degree in political science from the University of Houston.
Cristiano Amon serves as executive vice president, Qualcomm Technologies, Inc. and president of Qualcomm CDMA Technologies (QCT), the world’s largest provider of wireless chipsets and software solutions. In this role, he is responsible for the oversight of all activities related to Qualcomm’s semiconductor business. Amon also serves as a member of Qualcomm’s executive committee.
Amon served as co-president of QCT for three years and prior to this was senior vice president of Product Management with QCT, managing the Company’s wireless chipset portfolio. Amon joined Qualcomm in 1995 as an engineer and during this time he has held several other business and technical leadership roles at the Company.
Prior to joining Qualcomm Amon served as the chief technical officer of Vésper, a wireless operator in Brazil and held positions in NEC, Ericsson and Velocom Inc.
Amon holds a B.S. degree in Electrical Engineering from UNICAMP – Universidade Estadual de Campinas, São Paulo, Brazil.
Sr. VP, Business Units
Dr. Bastani has over three decades of high-tech industry experience, including component to system-level RF enterprises and digital SoC companies. He has held the position of President, CEO, and board member in the mobility, consumer, and broadband markets.
Prior to joining GLOBALFOUNDRIES, Dr. Bastani was President, CEO, and board member of Meru Networks, a global enterprise-grade Wi-Fi networks solution provider. During his time with the company, Dr. Bastani transformed Meru Networks from a hardware company to a solution provider, delivering a portfolio of software, software-defined networks (2015 SDN Excellence Award), and subscription cloud offerings (WaaS).
Dr. Bastani served as President & CEO of Trident Microsystems, Inc., a global semiconductor company with primary products in “Smart Set Top Box” and “Smart TV”, as well as software and hardware (SoC) total system solutions.
Dr. Bastani also served as President, CEO, and board member, for ANADIGICS Inc., from 1998 to 2008. ANADIGICS focused on RF solutions for the mobility and broadband markets.
Prior to ANADIGICS, Dr. Bastani served in leadership positions at Fujitsu Microelectronics as EVP for System LSI Group, at National Semiconductor as VP and GM of Embedded Technologies Division, VP of Memory Products Division, and VP of Technology Development, and at Intel Corporation’s Memory and Microprocessor Technology Development organization.
Dr. Bastani has also served on the Board of Directors for several public and private companies, as well as several industry associations.
Dr. Bastani holds a Ph.D. & MSEE in Microelectronics from Ohio State University. He is co-inventor on three patents and has authored over a dozen publications.
Dr. Bastani & his wife, Janice, reside in Silicon Valley, California
Senior Vice President, Corporate Strategy Office
Throughout his career Cassidy has demonstrated a keen ability to manage both the technical and business areas of the semiconductor industry. His leadership and drive have had a dramatic and lasting impact on the way semiconductors are designed and manufactured.
Cassidy became President, TSMC North America in January 2005 and was elected a Corporate Vice President, TSMC, Ltd. in November 2008. Since joining the company in 1997 as Vice President, Account Management, he has driven many of the strategic initiatives and business process improvements that helped TSMC achieve its current market position. He also served as Senior Vice President, Operations, instituting productivity and business process efficiencies that kept customers and the company on-course during one of the semiconductor industry’s most turbulent times; and Executive Vice President, Office of the President, TSMC North America.
He began his career at Fairchild Semiconductor Company (later acquired by National Semiconductor) where he held a series of executive and management positions in engineering, manufacturing, quality and reliability, and marketing. Prior to Joining TSMC, he was Vice President and General Manager of National’s Military & Aerospace Division. Cassidy serves on the GSA board of directors, an organization dedicated to the advancement of the worldwide semiconductor industry.
A graduate of the United States Military Academy at West Point with a bachelor’s degree in engineering, Cassidy served as a U.S. Army officer before embarking on his business career.
Senior Vice President, Process Research and Development
Micron Technology, Inc.
Naga Chandrasekaran is Senior Vice President of Process Research and Development at Micron Technology in Boise Idaho. Mr. Chandrasekaran leads process and equipment technology development and supplier roadmap development efforts for all memory and non-memory products. In addition he also manages corporate characterization labs and R&D fabrication operations at Micron’s headquarters in Boise, Idaho.
In 2001, he joined Micron as CMP development engineer and has since then held a series of positions of increasing responsibility in process development across multiple R&D process areas, leading manufacturing and technology transfer efforts, integration of new business units, and development of solar, LED, and display technology. Between 2007 – 2008, he also served as Fab Engineering Manager for IM Flash, Singapore Operations.
Mr. Chandrasekaran has several keynote publications, patents, and served as invited panel speaker in several conferences. He has also received several awards including the “Jiri Tlusty Outstanding Young Manufacturing Engineer of the year” awarded by Society of Manufacturing Engineers (SME) in 2003, and the “Engineering Manager of the year” awarded by the American Society of Engineering Management (ASEM) in 2018.
Mr. Chandrasekaran holds doctorate and master’s degrees in mechanical engineering, both from Oklahoma State University and dual Executive MBA from University of California, LA (UCLA-Anderson School of Management) and National University of Singapore (NUS).
Dr. Joo Sun Choi
Dr. JS Choi
Samsung Semiconductor, Inc.
Joo Sun (JS) Choi is President of Samsung Semiconductor, Inc., a multi-billion dollar U.S. subsidiary of Samsung Electronics, where he is oversees all aspects of the company’s business activities within the Americas, including its Memory, Display, Storage, Foundry, System LSI, and LED organizations.
Most recently, he served as Executive Vice President and Head of Memory Sales & Marketing (including Product Planning and Application Engineering groups) for Samsung Electronics.
From 2011 to 2014, Dr. Choi directed DRAM product design and technology development as head of Samsung’s DRAM Product & Technology Division and prior to that, he served in various DRAM engineering positions at Samsung for more than a decade.
Dr. Choi earned a Bachelor’s Degree in Electronic Engineering from Seoul National University (1986), and received Master of Science (1989) and Ph.D. (1995) degrees in electrical engineering from the Korea Advanced Institute of Science (KAIST).
Dr. Aart J. de Geus
Dr. Aart J. de Geus
Chairman & Co-CEO
Since co-founding Synopsys in 1986, Dr. Aart de Geus has expanded Synopsys from a start-up synthesis enterprise to a world leader in electronic design automation (EDA). As a technology visionary, he is frequently asked to speak on topics related to the electronics industry. As one of the leading experts on logic simulation and logic synthesis, Dr. de Geus was made a fellow of the Institute of Electrical and Electronics Engineers (IEEE) in January 1999. He has been honored for his industry achievements with the 2001 IEEE Circuits and Systems Society Industrial Pioneer Award, the 2007 IEEE Robert N. Noyce Medal, and the 2008 EDAC/CEDA Kaufman award. In 2002, shortly after transacting the largest merger in EDA history, Dr. de Geus was named CEO of the Year by Electronic Business magazine, and in 2004, Entrepreneur of the Year in IT for Northern California by Ernst & Young. In November 2005, Electronic Business magazine chose Dr. de Geus as one of “The 10 Most Influential Executives.” In November of 2007, he was awarded the Silicon Valley Leadership Group (SVLG) “Spirit of the Valley” Lifetime Achievement Award. In October 2008, he was presented with the Phil Kaufman Award for distinguished contributions to EDA and in 2009 was awarded the Dr. Morris Chang Exemplary Leadership Award by the Global Semiconductor Alliance (GSA).
Dr. de Geus is active in the business community as chairman of the Board of the Silicon Valley Leadership Group (SVLG), and a member of TechNet, the GSA, and the Electronic Design Automation Consortium (EDAC). He is also heavily involved in education for the next generation, having created in 1999 the Synopsys Outreach Foundation, which promotes project-based science and math learning throughout Silicon Valley.
President & CEO
Brian Faith was promoted to CEO in June 2016 after having served as Vice President of Worldwide Marketing and Vice President of Worldwide Sales & Marketing between 2008 and 2016. Mr. Faith has been with QuickLogic since 1996, and during the last 20 years has held a variety of managerial and executive leadership positions in engineering, product line management, marketing and sales. Mr. Faith has also served as the Chairman of the Marketing Committee for the CE-ATA Organization. He holds a B.S. degree in Computer Engineering from Santa Clara University and was an Adjunct Lecturer at Santa Clara University for Programmable Logic courses.
Dr. Helmut Gassel
Dr. Helmut Gassel
Member of The Management Board and Chief Marketing Officer
Infineon Technologies AG
Helmut Gassel has been a member of the Management Board and Chief Marketing Officer of Infineon Technologies AG since 2016. He is responsible for Sales & Marketing, Regions, Strategy Development, Mergers & Acquisitions and Intellectual Property.
Helmut Gassel was born on March 13, 1964 in Dortmund, Germany. He studied at the Ruhr-University in Bochum and received a degree in physics and a doctorate in electrical engineering. He joined Infineon (Siemens AG until 1999) in 1995.
Positions within the company:
Since 2016 Member of the Management Board and Chief Marketing Officer, responsible for Sales & Marketing, Regions, Strategy Development, Mergers & Acquisitions and Intellectual Property
2012 Division President Industrial Power Control
2008 Division President Chip Card & Security
2006 Head of the Chip Card & Security ICs Business Unit with global business responsibility
2002 Head of Global Marketing and Application Technology for power semiconductors in automotive electronics
1999 Head of Marketing for power semiconductors for automotive electronics in North America, Detroit, MI, USA
1995 Project and Group Leader in power components development in Munich
1990 Project Manager at the Fraunhofer Institute for Microelectronic Circuits and Systems in Duisburg
Co-Founder, President and CEO
Jack Harding, co-founder, president and CEO of eSilicon Corporation, is responsible for eSilicon’s overall leadership, strategy and management. Mr. Harding brings more than 25 years of management experience in the semiconductor industry, spanning the electronic design automation (EDA) and IC sectors. Prior to co-founding eSilicon in 2000, Mr. Harding was the president and CEO of Cadence Design Systems. Mr. Harding entered Cadence upon the acquisition of Cooper & Chyan Technology (CCT), where he served as the president and CEO and was responsible for leading the company to an IPO. Prior to CCT Mr. Harding served as the executive vice president of Zycad Corporation. Mr. Harding began his career with distinction at IBM. Mr. Harding maintains a balanced career, providing his services to industry, academia and government. He has held various directorships in both public and private organizations and is currently on the board of directors of Qorvo (previously RF Micro Devices). Mr. Harding has also held leadership roles at Drew University and Indiana University (IU) where he was vice chairman of the board of trustees and a member of IU’s premier School of Public and Environmental Affairs (SPEA) advisory board, respectively. Mr. Harding holds a Bachelor of Arts in Chemistry and Economics from Drew University and attended the Stern School of Business at New York University.
Dr. Sam Heidari, Ph.D.
Dr. Sam Heidari, Ph.D.
Chairman & CEO
Quantenna Communications, Inc.
Dr. Sam Heidari is a connectivity and communication technologist seeking perfect solutions that enhance our everyday lives.
Dr. Heidari joined Quantenna in 2009 as VP of R&D and led the innovation effort in latest Wi-Fi technology. He was appointed as CEO in 2011, and under his leadership, the company has been raising the bar for Wi-Fi standards and improving user’s experience by delivering the most advanced Wi-Fi hardware and software solutions. Prior to Quantenna, he was CTO and Vice President of Engineering at Ikanos Communications (Nasdaq: IKAN). Dr. Heidari was one of the original team members of Ikanos, and then rejoined Ikanos Communications in 2006 via acquisition of Doradus Technologies, where he served as President and CEO. Under his leadership, Doradus Technologies grew from creation to profitability within 18 months. In his career, Dr. Heidari has held many senior management and technical positions in the different areas of wireless and wireline communications and networking at Sony Electronics, Linkabit Wireless and Torrey Communications.
Dr. Heidari is Chairman of the Board of Directors for SiTune Corporation and also serves on the advisory board for the Department of Electrical Engineering at the University of Southern California. He is a senior member of IEEE and holds 36 U.S patents. He has authored many refereed journals and conference papers as well as provided significant contributions in standard organizations such as IEEE and ITU-T covering wireline and mobile technologies.
Dr. Heidari earned his M.S. and Ph.D. degrees from University of Southern California, and a B.S. degree from Northeastern University, all in Electrical Engineering. He was named a winner of the 2014 CEO/Executive of the Year by the Golden Bridge Awards.
Dr. Ann B. Kelleher
Dr. Ann B. Kelleher
SVP and GM, Manufacturing and Operations
Dr. Ann B. Kelleher is senior vice president and general manager of Manufacturing and Operations at Intel Corporation. She is responsible for the company’s worldwide manufacturing operations, including Fab Sort Manufacturing, Assembly Test Manufacturing and strategic planning, as well as corporate quality assurance and corporate services.
Kelleher joined Intel in 1996 as a process engineer, going on to manage technology transfers and factory ramp-ups in a variety of positions spanning 200mm and 300mm technologies. She started her manufacturing leadership journey as the factory manager of Fab 24 in Leixlip, Ireland. She was site manager of Intel’s Fab 11X facility in Rio Rancho, New Mexico, and plant manager of Intel’s Fab 12 facility in Chandler, Arizona. She then became general manager of the Fab Sort Manufacturing organization where she was responsible for all aspects of Intel’s high-volume silicon manufacturing.
Before assuming her current position in Manufacturing and Operations, Kelleher was co-general manager of the Technology and Manufacturing Group where she was responsible for corporate quality assurance, corporate services, Intel product supply chain, corporate supply chain and strategic planning for the company’s worldwide manufacturing operations.
She holds a bachelor’s degree, a master’s degree and a Ph.D. in electrical engineering, all from University College Cork in Ireland.
President & CEO
Amkor Technology, Inc.
Steve Kelley was appointed President & Chief Executive Officer and a Director of Amkor Technology, Inc. on May 8, 2013.
Mr. Kelley, 50, has more than 25 years of experience in the global semiconductor industry, including as Executive Vice President and Chief Operating Officer of Cree, Inc. from 2008 to 2011, as Vice President/General Manager – Display, Standard Logic, Linear and Military Businesses at Texas Instruments, Inc. from 2003 to 2008, in various positions with Philips Semiconductors from 1993 to 2003 including Senior Vice President and General Manager, and in various positions with National Semiconductor Corporation and Motorola Semiconductor.
Mr. Kelley holds a B.S. in Chemical Engineering from Massachusetts Institute of Technology and a J.D. from Santa Clara University. He is a member of the Board of Directors at Switch Lighting, a leader in the LED lightbulb market.
Dr. Lawrence Loh
Dr. Lawrence Loh
President, MediaTek USA Inc. and Corporate Sr. Vice President
Over 20+ years of his professional career, Dr. Loh has demonstrated his contributions to the global semiconductor industry not only as a hands-on IC design engineer/architect, but also a seasoned corporate executive with management scope covering RD/engineering and business operations.
Dr. Loh is a Corporate Vice President of MediaTek Inc., responsible for centralized corporate RD and engineering functions including RF, analog/mixed-signal and circuits/hardware engineering and technology development for all MediaTek’s product lines including wireless communication, mobile application processors, wireless connectivity, home entertainment, optical storage and broadband/networking business. He is also serving as President of MediaTek USA, overseeing the company’s global operations in Europe and America.
Before joining MediaTek in 2004, Dr. Loh had contributed to IC design industry in areas of read/write channels for magnetic and optical storage, high-performance analog filters, solid-state fingerprint sensors, highspeed SERDES and wireline PHY transceivers for IT, broadband, networking and mass storage applications. Dr. Loh started his first circuit design position at IMP and later he joined Cirrus Logic, where his last position was Director of Analog IC Engineering. In 1998, Dr. Loh founded Silicon Bridge Inc., where he successfully led a number of analog/mixed-signal IC development projects with major semiconductor companies including MediaTek Inc. and Altera Corporation.
Dr. Loh received his Ph.D. degree in Electrical Engineering, with emphasis in analog circuit design, from Texas A&M University, College Station, Texas. He served on ISSCC International Technical Program Committee during 2005-1010. Dr. Loh has authored/co-authored dozens of technical papers/patents in areas of analog and mixed-signal integrated circuits/systems design and has contributed many panel talks and invited keynote speeches at numerous international conferences and professional communities.
Dr. Nicky Lu
Dr. Nicky Lu
Founder, Chairman and CEO
Etron Technology, Inc.
As a researcher, design architect, entrepreneur and chief executive, Dr. Lu has dedicated his career to the worldwide IC design and semiconductor industry. He is Chairman, CEO and Founder of Etron Technology and co-founded several other high-tech companies including Ardentec and Global Unichip Corp.
Dr. Lu worked for the IBM Research Division and then the Headquarters from 1982 to 1990 and won numerous IBM recognition awards, including an IBM Corporate Award. He co-invented and pioneered a 3D-DRAM technology, known as the Substrate-Plate Trench-Capacitor (SPT) cell, along with its associated array architecture, which has been widely used by IBM and its licensees in 1Mb to 1Gb DRAMs and embedded DRAMs. Dr. Lu designed a High Speed CMOS DRAM (HSDRAM) chip in 1984, 3X faster than normal DRAMs, the concept of which becomes core technologies of many major DRAMs. He was elected as an AdCom member of the IEEE Solid-State Circuits Society from 1977 to 1999, and is on the technical program committees of the IEEE International Solid States Circuits Conference (ISSCC) from 1988 to 2002 and of the Symposium on VLSI circuits since 1990. He is an IEEE Fellow, the recipient of the IEEE 1998 Solid-States Circuits Award, and a member of National Academy of Engineering of USA.
As a co-architect leading the 8-inch wafer and DRAM/SRAM/LOGIC technology developments for Taiwan’s semiconductor industry in early 1990s, which later creates many Taiwan companies as prominent silicon chip suppliers, Dr. Lu was thus awarded the Medal of Excellence in Science and Technology by the Premier of the Republic of China. Since 1999 he has pioneered DRAM Known-Good-Die Memory products enabling customers’ 3D stacked-die system chips. This work summoned the new rise of an IC Heterogeneous Integration Era as described in his plenary talk at the 2004 ISSCC, demonstrating a new 3D IC trend in parallel to the Moore’s Law.
Dr. Lu received his B.S. in Electrical Engineering from National Taiwan University and M.S. and Ph.D. in EE from Stanford University. He holds over 24 U.S. patents and has published more than 50 technical papers. He serves as Chairman of TSIA (Taiwan Semiconductor Industry Association), Chairman of WSC (World Semiconductor Council), Chairman of Asia-Pacific Leadership Council for GSA (Global Semiconductor Alliance), and was Chairman of the Board Director of GSA (2009 to 2011). He is an Outstanding Alumnus of National Taiwan University and a Chair Professor and an Outstanding Alumnus of National Chiao Tung University.
President & CEO
Marvell Semiconductor, Inc.
Matt Murphy is President and Chief Executive Officer of Marvell Technology. He has led the company since joining in July 2016 and also serves as a member of company’s Board of Directors. In his role as CEO, Matt is responsible for leading new technology development, directing ongoing operations and driving Marvell’s growth strategy.
Prior to joining Marvell, Matt worked for Maxim Integrated, where he advanced through a series of business leadership roles over two decades. Most recently, he served as Executive Vice President of Business Units and Sales & Marketing, overseeing all product development and go-to-market activities. In prior roles, Matt led the company’s communications, data center, and automotive business groups, all of which experienced significant growth under his leadership.
Matt earned a B.A. from Franklin & Marshall College, and is also a graduate of the Stanford Executive Program.
Dr. Omkaram Nalamasu
Dr. Omkaram Nalamasu
CTO & Sr. Vice President
Applied Materials, Inc.
Dr. Omkaram (Om) Nalamasu is senior vice president and chief technology officer (CTO) for Applied Materials. He brings extensive experience and passion to the role of CTO, where he is leading the development of new product pipelines, securing government funding for key strategic projects and building a world-class team to maintain Applied Materials’ technology leadership in the industries it serves and enable growth into new markets.
Dr. Nalamasu is also the president of Applied Ventures, LLC, the venture capital fund of Applied Materials, overseeing the financial and strategic investments in early and growth-stage privately held companies.
A world-renowned expert in materials science and technology and one of our industry’s respected forward thinkers, Dr. Nalamasu has championed a renewed focus on the company’s innovation culture through various internal development programs and open innovation methods.
Dr. Nalamasu joined Applied Materials in 2006, after serving as vice president of research and NYSTAR Distinguished Professor of Materials Science and Engineering at Rensselaer Polytechnic Institute (RPI). Prior to this, He has held key research and development leadership positions at AT&T Bell Laboratories, Bell Laboratories/Lucent Technologies, and Agere Systems, Inc.
His research interests include nanomanufacturing, nanopatterning, electronic and photonic materials, and lithography, with special emphasis on applying patterning and materials know-how for device fabrication for electronics, photonics and energy applications.
Dr. Nalamasu has made seminal contributions to the fields of optical lithography and polymeric materials science and technology. He has received numerous awards, authored more than 180 papers, review articles and books, and holds more than 35 patents.
Dr. Nalamasu is a member of the board of directors of The Tech Museum in San Jose, and serves on several International and National advisory boards. He received his Ph.D. from the University of British Columbia, Vancouver, Canada.
Dr. Siva Sivaram
Dr. Siva Sivaram
Exec. VP, Silicon Technology & Manufacturing
Western Digital Corporation
Dr. Siva Sivaram is the Executive Vice President of Silicon Technology and Manufacturing for Western Digital, responsible for the ongoing development of the company’s industry-leading NAND flash memory, as well as the development of next-generation technologies, including 3D NAND (BiCS) and 3D ReRAM. Sivaram has over 30 years of experience in semiconductors, 3-D memory architectures, process technology, equipment and materials. He has held executive positions at Intel and Matrix Semiconductor, and at SanDisk after its acquisition of Matrix. Additionally, he was the Founder and CEO of Twin Creeks Technologies, a solar panel and equipment company, has served as a board member of several start-up firms, was entrepreneur-in-residence at Crosslink Capital and XSeed Capital, a research scholar at Matsushita Electric, and an adjunct faculty member at San Jose State University.
Sivaram has published numerous technical papers as well as a textbook on Chemical Vapor Deposition, and he holds several patents. He earned his doctorate and master’s degrees in materials science from the Rensselaer Polytechnic Institute where he has been elected to its Board of Trustees. He is a Distinguished Alumnus of the National Institute of Technology, Tiruchi, India, where he earned his bachelor’s degree in mechanical engineering.
President & CEO
Akira Takata has been served as President and CEO of MegaChips Corporation (1st section of the TSE: 6875) since June 2011.
MegaChips was founded in 1990 as the first innovative fabless company in Japan dedicated to SoCs with the goal of integrating LSIs and application knowledge. Takata joined MegaChips as one of its startup members and acted as the key person to build the company’s core business and the strong relationship with the strategic partners. MegaChips now provides total solution from design and development to manufacturing for MEMS Timing Device and State-of-the-art LSIs produced by full use of unique analog, digital and MEMS technology. He has been demonstrated a strong leadership to enhance corporate value through globalization and optimization of business portfolio.
Prior to joining MegaChips, he worked for Ricoh Company, Ltd Semiconductor Division as a designer and manager of EPROM, PLD and DSP.
Takata received a bachelors degree in electronics engineering from the Osaka University, Japan.
Cadence Design Systems, Inc.
Lip-Bu Tan is President and Chief Executive Officer of Cadence Design Systems, Inc. He has been a member of the Cadence Board of Directors since 2004 and serves as a member of the Finance and Technology Committees of the Board. He also serves as chairman of Walden International, a venture capital firm he founded in 1987. Prior to founding Walden, Tan was Vice President at Chappell & Co. and held management positions at EDS Nuclear and ECHO Energy.
Tan received an M.S. in nuclear engineering from the Massachusetts Institute of Technology, an MBA from the University of San Francisco, and a B.S. from Nanyang University in Singapore. He serves on the Board of Directors of Flextronics, SINA, and SMIC. He is also a board member of the Electronic Design Automation Consortium (EDAC) and the Global Semiconductor Alliance (GSA).
President & CEO
Tyson Tuttle serves as President and Chief Executive Officer of Silicon Labs, a leading provider of silicon, software and solutions for a smarter, more connected world. Tyson joined Silicon Labs in 1997 as a design engineer working on the company’s first breakthrough product, which achieved market share leadership in PC modems and enabled the company to go public in 2000. Tyson subsequently led the marketing effort behind Silicon Labs’ first CMOS RF transceiver products for mobile handsets, spearheaded the development and market success of the company’s radio and TV tuner ICs, and served as Chief Technology Officer and Chief Operating Officer before being named CEO in 2012.
Tyson has more than 25 years of semiconductor experience with industry leaders like Broadcom and Cirrus Logic / Crystal Semiconductor and holds more than 70 patents in RF and mixed-signal IC design. Tyson received the B.S. degree in electrical engineering from Johns Hopkins University and the M.S. degree in electrical engineering from UCLA. He serves on the board of the Global Semiconductor Alliance, the advisory board for the Johns Hopkins Whiting School of Engineering, and is a respected leader in the Austin community, serving on the board for KLRU-TV, home of PBS and Austin City Limits.
Dr. Tien Wu
Dr. Tien Wu
CEO, Advanced Semiconductor Engineering, Inc. (ASE)
CEO, Universal Scientific Industrial Co., Ltd. (USI)
Dr. Tien Wu is the Chief Executive Officer of Advanced Semiconductor Engineering, Inc. (ASE) and concurrently the Chief Executive Officer of Universal Scientific Industrial Co., Ltd. (USI). He is also a member of the Board of Directors and Chief Operating Officer of the ASE Technology Holding Co., Ltd. (NYSE: ASX, TWSE: 3711).
Tien serves as a Board Member of the Global Semiconductor Association (GSA) and SEMI, which are global industry associations serving the manufacturing supply chain for the micro- and nano-electronics industries.
Prior to joining ASE, Tien held several management positions within IBM including R&D, manufacturing and sales in the United States, Europe and Asia-Pacific. He holds twelve U.S. patents and has authored over twenty-five articles. Tien holds a BSCE degree from Taiwan University, and also earned MS and Ph.D. degrees in mechanical engineering and applied mechanics respectively from the University of Pennsylvania. In 2015, Tien received an Honorary Degree of Doctor of Science from Binghamton University.
Dr. Haijun Zhao
Dr. Haijun Zhao
Co-CEO and Executive Director
Semiconductor Manufacturing International Corporation (SMIC)
Dr. Haijun Zhao joined SMIC in October of 2010, has 25 years of experience in semiconductor operations and technology development. Ph.D. in wireless from the University of TsingHua, and MBA from University of Chicago. A states “Thousand Person Plan” distinguished expert and the National Integrated Circuit promotion committee members of China.