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High-performance, high-bandwidth IP platform for Samsung 14LPP process technology

San Jose, California (2017-03-22) eSilicon Corporation today announced the successful tapeout for production of a customer ASIC with eSilicon® eFlexCAM™ TCAMs, eFlex™ embedded memories, extended-voltage-range general-purpose I/O (EVGPIO) and high-bandwidth memory (HBM2) PHY for Samsung's 14LPP process technology. The tapeout marks a significant milestone in eSilicon's enablement of high-performance networking and communication chips in Samsung FinFET technology.

KPMG Global Technology Innovation Hubs report

Santa Clara, California (2017-03-21) KPMG's publication series, The Changing Landscape of Disruptive Technologies, provides perspectives about innovation trends, commercialization barriers, and leading management practices. Part 1 of the 2017 series, Global Technology Innovation Hubs, unfolds the cities and countries outside of Silicon Valley/San Francisco that are making significant strides in innovation development. The report also provides 15 unique country perspectives.

STATS ChipPAC Achieves 1.5 Billion Unit Milestone in Fan-out Wafer Level Packaging Shipments

Singapore (2017-03-15) STATS ChipPAC has shipped 1.5 billion fan-out wafer level packages (FOWLP), also known in the industry as embedded Wafer Level Ball Grid Array (eWLB). In high volume production for over 7 years, STATS ChipPAC has led the industry in FOWLP technology innovations and unit shipments. Customer adoption has been strong in the mobile market and is accelerating in new and emerging market segments such as the Internet of Things (IoT), wearable electronics, millimeter wave (mmWave) technology for 5G ...

New ams 3.5mm jack interface lets smart active noise cancellation (ANC) headsets run battery-free

Austria (2017-03-14) First-to-market Accessory Communication Interface (ACI) enables small form factor noise cancellation headsets while offering the flexibility to include sensors, LEDs and displays Premstaetten, Austria (14 March 2017) -- ams AG (SIX: AMS), a leading provider of high performance sensor solutions, today announces the launch of a technology which enables noise-cancelling headsets with a four-pole 3.5mm jack to operate for the first time without a dedicated battery power supply. The new ...

KPMG Global Semiconductor Outlook Report

Santa Clara, California (2017-03-08) KPMG's new semiconductor outlook report, "The road to growth in semiconductors," is based on a survey of over 150 global semiconductor leaders. The publication details strategic priorities, projections for revenue growth & investment, geographic impact, product expectations, and future production technology. The report concludes that the road to growth lies in product diversification, acquiring adjacent technologies, and effective portfolio management.

Sidense Exhibiting at TSMC 2017 North American Technology Symposiums

Ottawa, ON and Santa Jose, Calif. (2017-03-08) Sidense will be exhibiting at the North American TSMC Technology Symposiums (Santa Clara, CA, Austin, TX and Boston, MA).

M31 Deploys a Full Range of IP for TSMC 16nm FFC Process

Hsinchu, Taiwan (2017-03-08) H.P. Lin, Chairman of M31 Technology today announced that it deploys a full range of silicon IP in TSMC's 16nm FFC (FinFET Compact) process technology. With TSMC's advanced 16nm FFC process technology, M31's IP solutions help IC customers design cost-effective SoCs with low power consumption, high performance and compact area. The advanced 16nm FFC process not only enables more IC functions with less space, but also dramatically enhances the circuits by reducing leakage currents. M31 ...

ATREG successfully advises Cypress Semiconductor on sale of 200mm Bloomington, Minn. fab

Seattle, WA (2017-03-02) ATREG announced today that it has successfully advised Cypress Semiconductor Corp. (Nasdaq: CY) on the sale of the subsidiary that owns its operational 200mm semiconductor manufacturing facility based in Bloomington, Minn., USA. Under the terms of the agreement, SkyWater Technology Foundry, backed by Minn.-based holding company Oxbow Industries, LLC, purchased the capital stock of the subsidiary to operate the fab as a stand-alone specialized foundry. The company will continue to manufacture ...

Goodix Debuts World's First In-Display Fingerprint Sensor at MWC 2017

Barcelona, Spain (2017-02-27) Goodix, the leading developer of human interface and biometric solutions for mobile devices, today unveiled at Mobile World Congress (MWC) 2017 its new In-Display Fingerprint Sensor. This is the world's first fingerprint sensor integrated into the AMOLED display of mobile devices. The sensor's state-of-the-art technology has brought about a new generation of mobile device design. baikal??.jpg Goodix's In-Display Fingerprint Sensor can turn a defined area of an AMOLED display into a ...

Hua Hong Semiconductor Doubles its Financial IC Card Chips Shipment in 2016

Hong Kong (2017-02-16) (16 February 2017, Hong Kong) Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group"; stock code: 1347.HK), a global leading pure-play 200mm foundry, today announced that its financial IC card chips shipment has more than doubled in 2016, up to about 200 million, including chips for bank IC cards, as well as social security and health cards with financial payment function. Compared with traditional magnetic cards, ...

Spirox Resolved to Propose Termination of Exclusive Distributor Agreement with Xcerra Corporation

Hsinchu, Taiwan (2017-02-11) Spirox (TWSE:3055), the sole and exclusive distributor of Xcerra Corporation (NASDAQ: XCRA) in China, Hong Kong and Taiwan, recently received an email message from Xcerra advising that Xcerra intends to limit the exclusive distribution territory ("Territory") to only Taiwan. Given that both parties' original intentions for cooperation has changed and the mode of business recognized by both parties has differed, to maintain the interests of the company, our shareholders and employees, ...

KPMG Semiconductor Outlook Webcast

Santa Clara, CA (2017-01-24) KPMG invites the global semiconductor community to attend our webcast on January 24, 2017. This webcast will present the findings of KPMG's annual global semiconductor industry survey and share perspectives on strategic priorities, revenue growth, investment spending, M&A activity, growth applications and other topics. Register today!

New time-to-digital converter from ams offers industry-best combination of speed, precision and power

Austria (2017-01-24) The ams TDC-GPX2 measures time intervals at a resolution of up to 10ps for ultra-accurate time-of-flight measurements in laser ranging and medical scanning applications Premstaetten, Austria (24 January, 2017) -- ams AG (SIX: AMS), a leading provider of high perfor-mance sensor solutions and analog ICs, has launched a new version of its market-leading time-to-digital converter (TDC) offering improved speed and precision together with low power consump-tion. The new TDC-GPX2 also features ...

ams announces completion of transaction to acquire Heptagon and related capital increase

Austria (2017-01-24) Premstaetten, Austria (24 January 2017) - ams (SIX: AMS), a leading worldwide supplier of high-performance sensor and analog solutions, announces the completion of the transaction to acquire 100% of the shares in Heptagon and the related capital increase of 11,011,281 new shares from authorized capital excluding subscription rights. ams announced on 24 October 2016 that the company had signed an agreement to acquire Heptagon, the worldwide leader in high performance optical packaging and ...

Hua Hong Semiconductor Achieves a Major Milestone in R&D of the Third-Generation Super Junction Technology

Hong Kong (2017-01-23) (23 January 2017, Hong Kong) Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group"; stock code: 1347.HK), a global leading pure-play 200mm foundry, today announced that it has achieved an initial success by concluding the Stage?in its R&D of the third-generation Super Junction MOSFET ("SJNFET") process platform, which will be introduced to the market gradually in the first half of 2017. As a global leading ...

STATS ChipPAC Recognized for Patent Innovations for the Seventh Consecutive Year by IEEE

Singapore (2017-01-23) STATS ChipPAC has been ranked among the world's top 10 semiconductor equipment manufacturing companies in the 2016 Patent Power Scorecards published by IEEE. This is the seventh consecutive year that STATS ChipPAC has been recognized in the annual scorecards.

ams launches world's first digital multispectral sensor-on-chip leveraging breakthrough wafer-level filter technology

Austria (2017-01-17) AS7262 and AS7263 six-channel digital multispectral sensor ICs bring the lab to the sample to enable a revolution in consumer and industrial spectral analysis applica-tions Premstaetten, Austria (17 January, 2017) -- ams AG (SIX: AMS), a leading provider of high perfor-mance sensor solutions and analog ICs, today launched the world's first series of cost-effective multispectral sensor-on-chip solutions, opening the way for a new generation of spectral analyzers for consumer and industrial ...

Sidense Receives Coveted ISO 9001:2015 Quality Management System Certification

San Jose, California (2017-01-16) Sidense Corp., a leading developer of Non-Volatile Memory (NVM) One-Time Programmable (OTP) IP cores, today announced that with a first-time successful registration audit it has met ISO 9001:2015 Quality Management System (QMS) Certification.

Sidense Receives Coveted ISO 9001:2015 Quality Management System Certification

San Jose, California (2017-01-16) Sidense Corp., a leading developer of Non-Volatile Memory (NVM) One-Time Programmable (OTP) IP cores, today announced that with a first-time successful registration audit it has met ISO 9001:2015 Quality Management System (QMS) Certification.

Silicon-proven HBM Gen2 Hardened PHY from eSilicon 14LPP and 28HPC high-bandwidth memory PHY now available

San Jose, California (2016-12-15) eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, today announced the availability of its silicon-proven 14nm FinFET and 28nm planar HBM Gen2 Hardened PHY solution. High-bandwidth memory (HBM), integrated with 2.5D technology, achieves higher bandwidth while using less power in a substantially smaller form factor than DDR4, GDDR5 or hybrid memory cube (HMC).

Sunflower Mission awards 59 university scholarships to Vietnam's future engineers

San Jose, California (2016-12-13) Sunflower Mission presented a total of 59 university scholarships to engineering and technology students in Ho Chi Minh City on November 29 and in Da Nang on December 1. Sunflower Mission, a U.S.-based nonprofit organization, was founded in 2002 to improve the lives of people in Vietnam through educational assistance programs and to also provide life-long leadership skills for students in America.

ams' new High Performance Analog technology A30 offers superior noise performance

Austria (2016-12-06) Enhanced 0.30µm process is ideally suited for ultra-low noise sensing applications and analog read-out ICs for consumer electronics, automotive, medical and IoT devices Premstaetten, Austria (6 December, 2016) -- ams AG (SIX: AMS), a leading provider of high per-formance sensors and analog ICs, today announced the availability of its High Performance Ana-log Low Noise CMOS process ("A30"). The new A30 process provides superior noise performance and is realized as an optical shrink by a ...

eSilicon to present "Demystifying 2.5D ASIC Production" at 3D ASIP 2016

San Jose, California (2016-12-06) eSilicon will present at the 2016 3D Architectures for Semiconductor Integration and Packaging (ASIP) Conference held in San Francisco, CA, December 13-15. eSilicon will describe how it manages a complex HBM/2.5D ecosystem of suppliers and advanced technologies - such as high-bandwidth memory (HBM) and high-bandwidth interconnect (HBI) - for tier-one customers demanding very high-performance chips.

ams Launches AS7221 Spectral Tuning IoT Smart Lighting Manager

Austria (2016-11-29) Extension to smart lighting manager family enables cost-effective, accurate, IoT-connected variable-CCT LED lighting Premstaetten, Austria (29 November, 2016) -- ams AG (SIX: AMS), a leading provider of high per-formance sensors and analog ICs, today announced the AS7221, the industry's first integrated white-tunable smart lighting manager. Lighting manufacturers designing with the AS7221 can now quickly integrate high-precision CCT, or "Kelvin-tuning", capabilities into their ...

eSilicon takes TSMC OIP Ecosystem Forum Customers' Choice Award for Best Paper

San Jose, California (2016-11-29) eSilicon Corporation's paper "Enabling the Expanding Cloud: High-Bandwidth Memory and 2.5D Solutions" received the 2016 TSMC OIP Ecosystem Forum Customers' Choice Award for best paper.

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