Dublin, Ca, 01/27/2026 – -Major milestone marks a disruptive shift in power delivery for next-generation AI Processors-
Amber Semiconductor, Inc. (AmberSemi™), a fabless semiconductor company pioneering the next generation of power management for data centers, today announced the successful tape out of its AmberSemi PowerTile™ vertical power delivery solution designed specifically for AI processors in data centers.
The ultra-low-profile PowerTile™ is a 1,000 Amp vertical power device that can be mounted on the backside of a server board, directly beneath the processor. By delivering power through a vertical path rather than traditional lateral distribution, PowerTile™ reduces power distribution losses to the processor by more than 85%, significantly improving efficiency and scalability for AI systems.
AmberSemi's Website
Full Article: https://ambersi.com/ambersemi-announces-silicon-tape-outof-powertile-vertical-power-solution-for-ai-data-centers/