Intrinsic ID Presents Full Range of Chip Security Solutions at TSMC 2022 Open Innovation Platform® Ecosystem Forum

Trends in advanced semiconductor design – such as smaller processing nodes and chiplet-based designs – underscore need for scalable security solutions; Intrinsic ID to showcase its security expertise on site in North America OIP event on October 26 and virtual event on November 10. SUNNYVALE, Calif., October 18, 2022 – Intrinsic ID, the world’s leading provider of Physical Unclonable Function (PUF) technology for chip security and authentication, announced that it will be participating in the TSMC 2022 Open Innovation Platform® (OIP) Ecosystem Forum, on October 26, 2022 at the Santa Clara Convention Center. Intrinsic ID will feature its full line of patented SRAM Read More

Intrinsic ID Presents Full Range of Chip Security Solutions at TSMC 2022 Open Innovation Platform® Ecosystem Forum2022-10-18T06:57:11-05:00