Intrinsic ID Presents Full Range of Chip Security Solutions at TSMC 2022 Open Innovation Platform® Ecosystem Forum

Trends in advanced semiconductor design – such as smaller processing nodes and chiplet-based designs – underscore need for scalable security solutions; Intrinsic ID to showcase its security expertise on site in North America OIP event on October 26 and virtual event on November 10. SUNNYVALE, Calif., October 18, 2022 – Intrinsic ID, the world’s leading provider of Physical Unclonable Function (PUF) technology for chip security and authentication, announced that it will be participating in the TSMC 2022 Open Innovation Platform® (OIP) Ecosystem Forum, on October 26, 2022 at the Santa Clara Convention Center. Intrinsic ID will feature its full line of patented SRAM Read More