The 2023 GSA European Executive Forum gathered over 250 global senior executives from the semiconductor value chain for thought leadership and collaborative dialogue on topics surrounding the industry. The speakers covered a range of topics from the growth-driving markets of Automotive, 5G next-generation connectivity, New silicon design paradigms including RISC-V and chiplets, to big trends towards decarbonization and the positive effects of increased diversity and inclusion.
This year’s European Executive Forum also hosted various panel discussions, highlighted by the Fireside Chat moderated by Tien Wu, CEO of ASE/USI. This session featured the CEOs of Infineon and STMicroelectronics, Jochen Hanebeck and Jean-Marc Chery. Other panels focused on key topics for the industry such as the Automotive Supply Chain, Next Generation Connectivity, New Silicon Design Paradigms, and Advancements in Automotive. Additionally, Accenture led a Diversity & Inclusion panel with representatives from ATREG, Movandi, and Cadence, emphasizing the importance of diversity and inclusion in the semiconductor industry.