Nationwide Building Society to Modernize its Digital Payments System in the Cloud with Accenture and Form3
LONDON; March 6, 2023 – Nationwide Building Society has selected Accenture (NYSE: ACN) and Form3 to transform its digital payments infrastructure through the adoption Read More..
Achieving gender parity in Asia
To make sustainable progress toward gender equality, businesses need to go beyond table stakes. What steps can companies in Asia take to address this Read More..
How Blackstone is helping to build India’s next generation of global companies
Blackstone Private Equity’s head of Asia, Amit Dixit, reveals elements of its long-term success in India. Hint: it requires the right mix of ownership, Read More..
Six new imperatives for real estate players
Higher inflation, higher interest rates, and other challenges mean that the real estate industry needs new paths to success.
Accelerating customer-centric innovation in medtech
Investing in understanding the needs of customers and the healthcare ecosystem in the early stages of innovation can boost performance and reduce the risk Read More..
The McKinsey Crossword: Sun Screens | No. 118
Sharpen your problem-solving skills the McKinsey way, with our weekly crossword. Each puzzle is created with the McKinsey audience in mind, and includes a Read More..
STMicroelectronics Announces Changes to Euronext Trading Symbols
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announces that effective Monday, March 13, 2023, prior to Read More..
Broadcom Introduces Industry’s First 5nm 100G/lane Optical PAM-4 DSP PHY with Integrated TIA and Laser Driver
Monolithic fully integrated 800G PAM-4 PHY delivers best-in-class performance and efficiency for pluggable transceiver modules SAN JOSE, Calif. , March 06, 2023 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the availability of its 5nm 100G/lane optical PAM-4 DSP PHY with
STMicroelectronics’ all-in-one motion and bone-conduction sensor saves space and power in hearables and headsets
STMicroelectronics’ LSM6DSV16BX is a unique highly integrated sensor that delivers tremendous space savings inside hearable devices including sports and general-purpose earbuds. It combines a Read More..