Dr. Maria Marced
Dr. Maria Marced
Board Member, Semiconductor Executive, GSA EMEA Chairwoman
Dr. Marced is responsible for driving the development, strategy and management of TSMC’s business in Europe.
Before joining TSMC she was Senior Vice President and General Manager of Sales and Marketing at NXP/Philips. She also served as Philips’ General Manager of The Connected Multimedia Solutions Business Unit, overseeing semiconductor solutions for Connected Consumer applications.
Dr. Marced spent 19 years with Intel before that, rising to become Vice President and General Manager responsible for Europe, the Middle East and Africa. She holds a Ph.D. in telecommunications engineering from Universidad Politecnica de Madrid, Spain.
Dr. Jalal Bagherli, Ph.D.
Dr. Jalal Bagherli, Ph.D.
Board Member & Semiconductor Executive
Dialog Semiconductor
Dr. Jalal Bagherli is a visionary leader of the semiconductor industry who created multiple billion-dollar businesses. Currently Dr. Jalal chairs the board of PTSL, a private high growth semiconductor manufacturing company, and is an advisor to several chip startups.
Jalal was formerly the CEO of Dialog Semiconductor plc. Some of his professional highlights at Dialog include creating new design centers in seven countries; successfully negotiating a strategic licensing deal to transfer IP and resources to Apple Inc.; raising equity in European capital markets; acquiring and integrating several chip companies totaling over $1bn.
Dr. Jalal led the company to become the world leader in Power Management products, used for all Apple devices, and led the expansion into new product lines for Connectivity (low power Bluetooth SIG/Wi-Fi), Power Conversion and Mixed Signal products for mobile consumer and IOT markets. He led the strategic M&A deal resulting in the sale of Dialog Semiconductor to Renesas Corporation of Japan in August 2021 for $5.8bn.
Gary Campbell
Gary Campbell
EVP, Central Engineering
Arm, Inc.
Gary is the Senior Vice President of Arm’s Central Engineering team, comprising CPU, GPU, CE Operations, Central Technology, Systems, Productivity Engineering and Open Source Software teams. Previous to this Gary was Vice President of Engineering for Arm’s CPU and Media Engineering teams. Gary joined Arm in 1998 as a CPU designer, and prior to this he started his career at Inmos working as a design engineer on SRAM and graphics development.
Alessandro Cremonesi
Alessandro Cremonesi
EVP, Chief Innovation Officer
STMicroelectronics
Alessandro Cremonesi is STMicroelectronics’ Executive Vice President, Chief Innovation Officer and General Manager of STMicroelectronics’ System Research and Applications (SRA) Group. He has managed the SRA group since 2013 and added the Innovation Office to his mandate in early 2020. Cremonesi’s responsibilities span from global innovation coordination to corporate advanced R&D to system-solutions support for ST customers.
Cremonesi joined STMicroelectronics in 1984 after conducting research in opto- electronics at University of Pavia, Italy. He has served in managerial roles with both Strategic Marketing and R&D responsibilities across domains from telecommunications to audio/video digital-signal processing and multimedia applications. He has been a key contributor to ST’s extensive efforts and strategy in IoT and Artificial Intelligence and, more recently, has led the creation of strategic initiatives to increase ST’s innovation capability.
Cremonesi advises several industrial and academic bodies. He is a member of an expert group defining the strategy for Artificial Intelligence for the Italian Ministry of Economic Development. He has authored several technical papers and patents and is a member of the Scientific Advisory Board at IMEC.
Guillaume D'Eyssautier
Guillaume D’Eyssautier
Chairman
Thalia
Guillaume d’Eyssautier career has spanned over the past 30 years in the semiconductor industry, including management positions in both Europe and the USA. He was CEO of DelfMEMS and, prior to that, CEO of ADD Semiconductor which he sold to Atmel in October 2011. Prior to ADD he was CEO of picoChip, sold to Mindspeed. Prior to that, he served as Senior VP-GM at Cadence Design Systems, VP-GM EMEA for IBM Technology and hold executive and management positions at Rockwell Semiconductor, GEC-Plessey Semiconductor, Matra Harris Semiconductors and Philips Semiconductors. Guillaume is also an investor and the Chairman of Thalia and Blueshift Memory and holds a MSc in Material Science and an MBA from INSEAD.
Maurice Geraets
Managing Director NXP Netherlands & VP Innovation
NXP Semiconductors N.V.
Managing Director at NXP Semiconductors Netherlands B.V. and Vice President Innovation. Maurice has 25 years of experience in the IT and electronics industry and works at NXP Semiconductors since 2002. In his current position he focuses on disruptive innovations for ‘secure connections for a smarter world’. This concerns e.g. intelligent transport systems (ITS) and automated driving. Next to his role at NXP, Maurice is active in the governance of the 1 billion Euro Dutch SmartwayZ program, is board member of several associations on automotive and mobility, is member of the High Level ITS Advisory Group to the European Commission and is member of the management committee of the European public private partnership AENEAS.
Dr. Udo-Martin Gomez
Dr. Udo-Martin Gomez
EVP, Engineering Sensors
Robert Bosch GmbH
Since January 2013, Dr. Udo Gómez is Chief Technical Officer of Bosch Sensortec GmbH – a fully-owned subsidiary of Robert Bosch GmbH. He is responsible for research and development of microelectro- mechanical sensors (MEMS) for consumer electronics, smartphones, security systems, industrial technology and logistics.
Dr. Gómez was born in Aalen, Germany. He studied physics at the University of Stuttgart, Germany. After graduation in 1994, he completed a doctorate in physics in 1997. From 1998 to 1999, he worked as post doctoral fellow at California Institute of Technology (Pasadena, California, USA).
Dr. Gómez began his career at Robert Bosch GmbH in 1999 at Corporate Sector Research and Advanced Engineering as research engineer in the area of microsystems technology.
In 2003, he joined the Automotive Electronics Division of Robert Bosch GmbH, where he was given the overall responsibility for the development of a new MEMS-based inertial sensor cluster for ESP applications.
Since 2006, Dr. Gómez worked in various management positions at Automotive Electronics, where he was responsible for Advanced Engineering of MEMS Sensors and held the position as Chief Expert for MEMS sensor technology.
Before joining Bosch Sensortec GmbH in January 2013, he was part of the office of the Board of Management (2010 – 2012) and was appointed Office Director for the Deputy Chairman of the Board of Management at Robert Bosch GmbH.
Since 2014, Dr. Gómez is Deputy Chairman of the Board of VDE/VDI-Society Microelectronics, Microsystems and Precision Engineering (GMM).
Dr. Georges Karam
Dr. Georges Karam
President & CEO
Sequans Communications S.A.
Dr. Georges Karam is President and chief executive officer of Sequans Communications. Before founding Sequans Communications, Georges Karam was vice president of cable access for Juniper Networks, running the cable engineering and marketing departments and managing the cable sales launch in EMEA. He joined Juniper Networks when the company acquired Pacific Broadband Communications (PBC), where he was vice president of engineering and general manager for Europe. At PBC he was the first key executive to join the company and was instrumental to success. Georges has served in a variety of senior management positions at Alcatel, SAGEM and Philips. He is a senior member of IEEE, has authored numerous technical and scientific papers, and holds several patents in digital communications.
Gennady Krasnikov
Gennady Krasnikov
CEO
Molecular Electronic Research Institute (MERI)
Academician of the Russian Academy of Sciences and a head of Molecular Electronics Research Institute Gennady Krasnikov is a world-renowned scientist in the field of semiconductor physics, semiconductor devices, VLSI technology development and manufacturing.
Since graduating from National Research University of Electronic Technology (MIET) in 1981 Gennady Krasnikov successfully combines scientific and commercial work. Starting his activity as an engineer in Molecular Electronics Research Institute and Mikron Fab he was appointed Director General of the company in early 1991 and now retains position at the Research Institute cooperating with world famous scientific centers, technical universities and design labs: IMEC, CEA-Leti, Technische Universiteit Delft, Ecole Speciale de Lausanne, Aselta, Leland Stanford Junior University, Mapper Lithography and others.
Mr. Krasnikov’s extensive experience of the semiconductor technology and industry granted him a number of honored national titles: Member of the State Presidential Council on science, technology and education of Russia, Head of the Interdepartmental Council of the leading designers of Russia, Chairman of the Scientific Council of the Russian Academy of Sciences “Physical and Chemical Fundamentals of Semiconductor Materials”, member of the Supervisory Board of the Novosibirsk National Research University and the National Research University of Electronic Technology, Honorary Doctor of the St. Petersburg National Research Academic University of the Russian Academy of Sciences, member of the Scientific Advisory Council of Nonprofit Organization the Foundation for the Development of the Center for Elaboration and Commercialization of New Technologies.
Gennady Krasnikov is author and co-author of more than 360 scientific publications, 4 scientific monographs and holds more than 40 author’s certificates and patents. He was awarded multiple honorable national and international awards such as the “Order of Honor” (in 1999), the Order “For Merit to the Fatherland” (in 2008), the “Order of Friendship” (in 2014), the State Prize of the Russian Federation (in 2014) and with two Russian Federation government prizes in science and technology (in 1999, 2009), UNESCO medal for contributions to the development of nanoscience and nanotechnologies (in 2016).
Jutta Meier
Jutta Meier
Interim Chief Executive Officer and Chief Financial Officer
IQE
Jutta Meier is the Interim Chief Executive Officer and Chief Financial Officer at IQE, the leading supplier of advanced compound semiconductor wafer products and material solutions to the global semiconductor industry. She leads the company’s strategic direction and oversees its financial operations, driving IQE’s growth and transformation as the world’s only pure-play epitaxy provider with a global footprint and a critical enabler of the technology that powers the digital world. Jutta brings over 25 years of experience in senior finance roles at leading global semiconductor companies.
Jutta joined IQE from Intel Corporation, where she was the Financial Planning and Analysis Lead at Intel Foundry Services from 2021 to 2023, where she worked closely with business group leaders to create business structures and processes to accelerate growth and influence strategy and investment decisions.
From 2009 to 2020, Jutta held senior finance roles at GlobalFoundries, including VP of Finance for Corporate FP&A and Investor Relations. Here, she established global best practices and supported the integration of IBM’s Microelectronics division.
Jutta began her career at Advanced Micro Devices, managing inventory, audit, and product costing in international manufacturing sites. She also holds an MBA from Technische Universität Dresden.
Karin Raj
Karin Raj
Chief Technology Officer Europe
Nokia
Karin Raj currently serves as the Chief Technology Officer Europe for Nokia.
She has held a variety of senior commercial and technical positions in both Ericsson and Huawei, working across diverse markets such as Asia, Europe, and North America. Karin also has extensive experience from smaller deep-tech companies having served as the CTO of a nanotech start-up, and a high-precision micro-mechanics company, respectively. She holds a Master’s degree in Engineering Physics from the Royal Institute of Technology, Stockholm, and an MBA in International Business from Uppsala University. She also serves as a Director on the Boards of Sivers Semiconductors, a leader in wireless and optical technologies, and Zamin Group, a global ferrometals mining conglomerate.
Claire Wang
Claire Wang
EVP & COO – Power & Sensor Systems Division
Infineon
Claire Wang joined Infineon Technologies AG in April 2023 as the Chief Operation Officer and Board Member of the Power and Sensing Systems Division. She has more than 20 years of experience in semiconductor and electronic component manufacturing industries with various senior leadership positions in NXP, Nexperia and TE Connectivity with a strong focus on Supply Chain Management, Operations and working with subcontracting manufacturers.
While based in Taiwan, the Netherlands, US, and Germany, she has managed global teams and gained a diversified view of how to establish and lead a productive team across different continents.
Vegard Wollan
Vegard Wollan
Chief Executive Officer
Nordic Semiconductor
Vegard Wollan was appointed Chief Executive Officer of Nordic Semiconductor in January 2024. He started his career with Nordic VLSI, which later became Nordic Semiconductor. As one of the inventor teams behind the AVR microcontroller technology, Vegard, in 1996, joined Atmel as VP and General Manager of the Touch and MCU Business Unit. Atmel was acquired by Microchip Technology in 2016, and Vegard went on to establish MyWo. In 2021, MyWo was merged into TouchNetix, a global innovation leader in touch technologies, where Vegard was the CEO previous to joining Nordic Semiconductor.
Vegard is based in Trondheim and Oslo, Norway. He holds an M.S. degree from the Norwegian University of Science and Technology in Computer Science and Electrical Engineering, Trondheim.