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Seattle, WA, 05/01/2024 - SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, and Lumotive, a pioneer in optical semiconductor technology for 3D sensing, announced today that the companies have collaborated on the production implementation Read More..
Seattle, WA, 04/16/2024 - Collaboration to drive expansion of Lumotive's solid-state beam steering chips for automotive, robotics, drone and security applications Lumotive, a pioneer in optical semiconductor technology for 3D sensing, today announced a strategic Read More..
CAMPBELL, Calif., 04/09/2024 - Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that Rebellions, a pioneering AI semiconductor startup, will deploy FlexNoC interconnect IP plus Magillem Read More..
London, UK, 04/08/2024 - Imagination Technologies today unveils the next product in the Catapult CPU IP range, the Imagination APXM-6200 CPU: a RISC-V application processor with compelling performance density, seamless security and the artificial intelligence Read More..
San Jose, CA, 03/19/2024 - Cycuity, an innovator of semiconductor security solutions, has introduced comprehensive new features for its Radix technology, including advanced security analysis and design exploration capabilities, schematic visualizations, and guided security workflows. Read More..
Durham, UK, 03/28/2024 - Pragmatic was honoured to welcome HRH The Princess Royal as she officially opened Pragmatic Park – home of the UK’s first 300mm semiconductor fabrication line (fab) – located near Durham, UK. Read More..
Durham, UK, 03/27/2024 - Pragmatic Semiconductor was honoured to welcome HRH The Princess Royal to officially open the UK’s first 300mm semiconductor wafer fabrication line (fab) at Pragmatic Park in Durham. The advanced manufacturing facility Read More..
Seattle, 04/01/2024 - SEATTLE, April 1, 2024 – ATREG, Inc., the premier global firm in the semiconductor industry for brokering and executing the exchange of advanced technology cleanroom manufacturing assets, announced today that the acquisition Read More..
Advanced packaging advances next wave of innovation in global chips manufacturing TEMPE, Ariz. – March 19, 2024 – Arizona State University (ASU) and Deca Technologies (Deca), a premier provider of advanced wafer- and panel-level packaging Read More..