Via PUF Technology as a Root of Trust in IoT Supply Chain

A Study on PUF Technology as Silicon "InbornID" Paper Submitted by Teddy Kyung Lee, CTO, ICTK Root of Trust in IoT Supply Chain The introduction of internet communication is a complete game-changer in human life. Internet connection means unlimited freedom. Wherever we are, we can reach anywhere else in the world with the connection. The number of endpoints in the network increases exponentially as many IoT devices and mobile devices are connected to the network. However, at the same time, the chances of sensitive data being stolen or compromised are also increased in the sea of unlimited freedom space, where Read More

Via PUF Technology as a Root of Trust in IoT Supply Chain2020-05-04T08:45:29-05:00

10X Thinking: The Deca Technologies Story

Garry Pycroft, VP of Sales and Marketing, Deca Technologies Inc. In a report issued by KPMG, the Global Semiconductor Alliance and the Consumer Electronics Association, survey results revealed that two-thirds of integrated circuit (IC) manufacturers currently expect to derive 80% of their revenue from consumer electronics in the next five years. However, the report also showed that new consumer products themselves achieve a faster time-tomarket than the IC devices required for them to function. As such, IC manufacturers must find new ways to design, fabricate and deliver products faster, and at a competitive price. Deca Technologies introduced a breakthrough solution Read More

10X Thinking: The Deca Technologies Story2014-03-26T22:42:56-05:00

Test Challenges for Next-Generation NAND Flash

Mobile phones and tablets are driving eMMC volume, pushing faster speeds and transitioning into UFS and other higher speed interfaces. Other applications such as Ultrabooks and enterprise storage solutions are spurring SSD growth, demanding even greater quality and higher speeds for both ONFi and Toggle NAND interfaces. Market research firm, IC Insights, forecasts that over the next four years the NAND Flash market to have the third-highest revenue-growth rate among all semiconductor segments as well as stronger bit growth than DRAM. To keep up with market demands, NAND technology is rapidly evolving – in fact, intrinsically shifting. All major NAND Read More

Test Challenges for Next-Generation NAND Flash2014-03-26T22:37:53-05:00

Cooking With Technology: Our Recipe, Your Secret Sauce

Tom Quan, Deputy Director, TSMC It has been half a century since the invention of the IC and subsequent mass production by pioneering integrated device manufacturers (IDMs). Many semiconductor companies rose to dominance in the next three decades without challenge until the foundry model emerged in the mid-1980s and our world was never the same. Established by TSMC's Dr. Morris Chang, the foundry and subsequent fabless industries were born over 25 years ago. It is indisputable as we look at the world's leading IC companies now and see how many are pure fabless enterprises, that they have succeeded based solely Read More

Cooking With Technology: Our Recipe, Your Secret Sauce2014-03-26T22:34:57-05:00

New Product Introduction Process for Heterogeneous 2.5D Devices

Javier DeLaCruz, Senior Director of Engineering, eSilicon For the past few years, the most popular topics in the 2.5D space have been: The design tools Foundry processes for through-silicon vias, temporary bonding and bump architecture The assembly process, such as what is first bonded to what The industry is at the point where the open variables on these topics are narrowing, and other critical aspects need to get far better attention. The new product introduction (NPI) process for heterogeneous 2.5D devices opens up a lot of possibilities but also creates many complications that need to be considered early in the Read More

New Product Introduction Process for Heterogeneous 2.5D Devices2014-03-26T22:33:18-05:00

Embedded Die Packaging Technologies Enable Innovative 2D and 3D Structures for Portable Applications

Ron Huemoeller, SVP, Advanced Product and Platform Development, Amkor Technology, Inc. Corey Reichman, Director, Advanced Product Development, Amkor Technology, Inc. Curtis Zwenger, Senior Director, Package Development, Amkor Technology, Inc. Modularization has become a critical focus throughout the semiconductor industry resulting in sophisticated packaging approaches to address the desire for miniaturization and increased levels of integration. At the lower end, the long standing incumbent technology that has customarily addressed this, Multichip Modules (MCM), leverages traditional multichip attach methods using standard and advanced organic substrates. At the highest end, the most advanced technology platform (2.5D TSV) leverages silicon interposers with metal vias Read More

Embedded Die Packaging Technologies Enable Innovative 2D and 3D Structures for Portable Applications2014-03-26T22:20:25-05:00