Demise of Just-in-Time Manufacturing Has Been Greatly Exaggerated
Frank Lavety General Manager, Kandou Close up of examining of test sample of microchip transistor under the microscope in laboratory. Equipment for testing Read More..
Via PUF Technology as a Root of Trust in IoT Supply Chain
A Study on PUF Technology as Silicon "InbornID" Paper Submitted by Teddy Kyung Lee, CTO, ICTK Root of Trust in IoT Supply Chain The Read More..
10X Thinking: The Deca Technologies Story
Garry Pycroft, VP of Sales and Marketing, Deca Technologies Inc. In a report issued by KPMG, the Global Semiconductor Alliance and the Consumer Electronics Read More..
Test Challenges for Next-Generation NAND Flash
Mobile phones and tablets are driving eMMC volume, pushing faster speeds and transitioning into UFS and other higher speed interfaces. Other applications such as Read More..
Cooking With Technology: Our Recipe, Your Secret Sauce
Tom Quan, Deputy Director, TSMC It has been half a century since the invention of the IC and subsequent mass production by pioneering integrated Read More..
New Product Introduction Process for Heterogeneous 2.5D Devices
Javier DeLaCruz, Senior Director of Engineering, eSilicon For the past few years, the most popular topics in the 2.5D space have been: The design Read More..
Embedded Die Packaging Technologies Enable Innovative 2D and 3D Structures for Portable Applications
Ron Huemoeller, SVP, Advanced Product and Platform Development, Amkor Technology, Inc. Corey Reichman, Director, Advanced Product Development, Amkor Technology, Inc. Curtis Zwenger, Senior Director, Read More..