Working Groups | Global Semiconductor Alliance (GSA)Global Semiconductor Alliance (GSA)

Working Groups

WORKING GROUPS

GSA provides an opportunity for our members to form individual working groups to address the technical and business challenges unique to their specific ecosystem.

GSA’s industry- and technology-specific working groups discuss common issues and concerns, accelerate technology and increase efficiencies.

MEETINGS	HIGHLIGHTS	PROJECTS
GSA MEMS Working Group Meeting June 12, 2013 Sunnyvale, CA, USA GSA 3D IC Working Group Meeting July 17, 2013 San Jose, CA, USA GSA Intellectual Property (IP) Working Group Meeting July 18, 2013 San Jose, CA, USA GSA AMS Working Group Meeting August 21, 2013 San Jose, CA, USA » More meetings	MEMS in Medical Applications AMFitzgerald presentation shows wealth of opportunity for MEMS Sensors in healthcare. Fabricating 2.5D, 3D, & 5.5D Devices Tezzaron presentation focuses on manufacturing considerations for 2.5D & 3D IC stacks 3D IC integration and ESD Certus Semiconductor presentation takes a deep dive into how ESD design practices are impacted by 3D IC stacks AMS Working Group Tackles Standardized PDK THe team is nearing completion of PDK Quality Checklist and whitepaper addressing rationale for using existing standards-based PDK. See Projects	AMS Standardized PDK Driven by OpenPDK and iPDK efforts, team develops PDK Quality Checklist and rationale AMS Process Control Monitor Building on previous efforts, team is updating the PCM Checklist 3D IC Assembly & Test Flows with 2.5D & 3D stacks coming to market, the team addresses emerging assembly & test flows, delineating the pros and cons of several prominent flows Wafer & Assembly Pricing Survey Team is overhauling the Wafer & Assembly Pricing Survey and Results to improve and update the questions and reporting