WORKING GROUPS

GSA provides an opportunity for our members to form individual working groups to address technical and business challenges unique to their specific ecosystem. 

GSA’s industry- and technology-specific working groups discuss common issues and concerns, accelerate technology and increase efficiency.

   

3Q15 MEMS Working Group
Wednesday September 23
Santa Clara, CA

3Q15 Quality Working Group
Wednesday September 23
Milpitas, CA

4Q15 3D-IC Meeting
Wednesday October 21
San Jose, CA

4Q15 IP Meeting
Thursday October 22, 2015
Mountain View, CA

» More meetings
 

New Product Introduction

Introducing new products that meet your intended market window with the right features and cost structure is critical to overall success.  We are developing New Product Introduction (NPI) guidelines, looking at all phases of product introduction, from Feasibility to Ramp to Production. We will define best practices and requirements for passing development gates.

GSA-ESDA-3D-IC_ESD_Whitepaper

Electrostatic Discharge (ESD) impacts semiconductor devices throughout fabrication, assembly, test, and usage.  With the onset of advanced packaging technology such as 2.5D/3D, ESD remains an issue, now requiring special consideration.  GSA, along with the ESD Association and academia have spent several months investigating this phenomenon.  Contact hbeasley@gsaglobal.org for details.

IP Source Selection Tool
Risk analysis and mitigation is critical in determining the source (Internal New, Internal Existing, Third Party) of required IP for your next design.  Two versions of this tool are now available, a generic version, and a version for SerDes acquisition.

 

MEMS Product Design Documentation Quality Checklist
MEMS designers require additional information from the foundry than their CMOS counterparts.  Team is developing a Quality Checklist for Product Design Documentation to ensure MEMS designers are able to gather required information more easily.

Quality Maturity Model

Every semiconductor company has an extensive supply chain.  However, the quality maturity level can vary greatly between suppliers.  The Quality team is defining a Quality Maturity Model, based on the Capability Maturity Model Index, to help evaluate current and potential supplier’s quality. Contact hbeasley@gsaglobal.org for details or to participate.

Known Good Die
A critical aspect of successfully integrating silicon from multiple sources into a 3D-IC package is the quality of each die.  Can each die be guaranteed to perform as expected when received, when integrated into a 3D stack, and when shipped to the customer?  We intend to generate a best practices checklist, providing insight and guidance for both the producers and consumers of KGD.  To participate in this project, please contact the GSA Director of Technology.