WORKING GROUPS

GSA provides an opportunity for our members to form individual working groups to address technical and business challenges unique to their specific ecosystem. 

GSA’s industry- and technology-specific working groups discuss common issues and concerns, accelerate technology and increase efficiency.

   

2Q15 3D-IC WG Meeting
April 14, 2015
Fremont, CA

2Q15 IP WG Meeting
April 16, 2015
Sunnyvale, CA

3Q15 3D-IC WG Meeting
Wednesday July 15, 2015
Santa Clara, CA

3Q15 IP WG Meeting
Thursday July 19, 2015
Mountain View, CA

» More meetings
 

MEPTEC’s Enabling the Internet of Things:
Foundations of MEMS Process, Design, Packaging & Test

05-20-15
San Jose, CA
This event aims to showcase advances in core technologies that form the foundation of the creation of MEMS-based products. Experts from the field will present the latest innovations in MEMS fabrication processes, packaging, assembly, and test. Insight will be provided as to new technologies, materials and software that will fuel the creation of new devices coupled with traditional MEMS technologies to address new markets and new requirements for the Internet of Things.

GSA-ESDA-3D-IC_ESD_Whitepaper

Electrostatic Discharge (ESD) impacts semiconductor devices throughout fabrication, assembly, test, and usage.  With the onset of advanced packaging technology such as 2.5D/3D, ESD remains an issue, now requiring special consideration.  GSA, along with the ESD Association and academia have spent several months investigating this phenomenon.  Contact hbeasley@gsaglobal.org for details.

IP Source Selection Tool
Risk analysis and mitigation is critical in determining the source (Internal New, Internal Existing, Third Party) of required IP for your next design.  Two versions of this tool are now available, a generic version, and a version for SerDes acquisition.

 

MEMS Product Design Documentation Quality Checklist
MEMS designers require additional information from the foundry than their CMOS counterparts.  Team is developing a Quality Checklist for Product Design Documentation to ensure MEMS designers are able to gather required information more easily.

Merger & Acquisition Due Diligence for Supply Chain, Operations, and Manufacturing

M&A are a fact of life in the semiconductor industry. Everyone has, or will likely experience this during their career.  This transition can be less painful if we use lessons learned from previous M&A to generate due diligence checklists.   Feedback may be sent to hbeasley@gsaglobal.com

Quality Maturity Model

Every semiconductor company has an extensive supply chain.  However, the quality maturity level can vary greatly between suppliers.  The Quality team is defining a Quality Maturity Model, based on the Capability Maturity Model Index, to help evaluate current and potential supplier’s quality. Contact hbeasley@gsaglobal.org for details or to participate.