Mixed-Signal Working Group

  • Overview
  • Meeting Schedule
  • Presentations
  • Minutes
  • Checklists
  • Projects
  • News


What's New in this Group?

Mixed-Signal technologies are critical components of semiconductor development. Real world data is inherently analog in nature and must be converted to digital signals for computational analysis. Fueled by tremendous advancements in process technologies,  mixed signal applications are among the fastest growing market segments within the semiconductor industry today. But with these advanced process technologies come new challenges to mixed signal design: analog-digital co-design, functional verification, test, and modeling on the technical side and resource management and collaboration among design teams and partners on the human side.


Promote the discussion, information exchange, and collaboration impacting both the technical and the human resource challenges that the AMS industry is facing, in order to have a positive impact on industry growth and profitability.


Provide a non-competitive forum for the mixed signal community to explore and discuss critical aspects of successful implementation including scaling, integration, DFM, verification, test, and power efficiencies and identify key elements that can improve efficiencies, design productivity, and profitability.

  • Improve the development environment through joint efforts leading to widespread adoption of interoperable PDK.
  • Generate mixed signal specific checklists that improve user understanding of foundry offerings and needs (PDK, PCM, …), while minimizing errors and improving interaction between foundries and fabless designers.
  • Discuss novel and creative approaches to closing the gap between digital and analog design.
  • Identify opportunities for enhanced integration and modularization capability: advanced packaging, SoCs, MEMS, etc.
  • Explore improved modeling techniques, such as RF Modeling, Analog Modeling with FinFET technology.

Contact Information

Harrison Beasley
Director, Technology
E hbeasley@gsaglobal.org

Working Group Chair
Dr. Abhijit Gupta, Director, Foundry Technology, SanDisk

Meeting Schedule

What's New in this Group?

Mixed Signal

Q4 2015 Meeting

Date: November 11, 2015
Time: 2:00 p.m. – 5:00 p.m.
Location: SanDisk, Milpitas, CA

Overview & Registration

The Great Miniaturization: Systems and Packaging” November 10-11, 2015
Santa Clara, CA.; Presented by MEPTEC and SEMI
Device integration, and especially advanced packaging, drive electronic systems personal mobility – in your pocket, on your wrist, inside your body, in your home, in your car dashboard, almost everywhere. These systems must sense, collect and process data, communicate, and manage its use of power. As these electronics proliferate, highly-integrated electronic systems all the way to the cloud must accommodate this tsunami of data produced by mobile, wearable, and remote sensing. Packaging technologies, manufacturing solutions, as well as the business models that support production, must evolve to meet the challenges that this new era of mobile miniaturization will produce.

Q1 2016 Meeting

Date: February 17, 2016
Time: 2:00 p.m. – 5:00 p.m.
Location: Silicon Valley

Q2 2016 Meeting

Date: May 18, 2016
Time: 2:00 p.m. – 5:00 p.m.
Location: Silicon Valley

Q3 2016 Meeting

Date: August TBD, 2016
Time: 2:00 p.m. – 5:00 p.m.
Location: Silicon Valley


What's New in this Group?

August 19, 2015

  • AMS WG Overview (PDF, 595 KB) /  Abhijit Gupta, SanDisk
  • FD-SOI Analog Focus(PDF, 4,320 KB) / Andreia Cathelin, STMicro
  • 28FD-SOI: Cost Effective Low Power Solution / Kelvin Low, Samsung
  • FD-SOI at 22nm (PDF, 1,904 KB) / Jamie Scheffer, GLOBALFOUNDRIES

February 19, 2015

November 12, 2014

August 20, 2014

May 7, 2014

February 20, 2014

  • AMS WG Overview (PDF, 446 KB) /  Abhijit Gupta, SanDisk
  • The Future of Mixed-Signal Verification  Helene Thibieroz, Synopsys
  • Mixed-Signal IP Verification on Advanced Process Nodes, Bob Lefferts, Synopsys

November 14, 2013

August 21, 2013

May 15, 2013

February 13, 2013

November 14, 2012

November 7, 2012

August 22, 2012

May 21, 2012


What's New in this Group?
2015 Meeting Minutes
2014 Meeting Minutes
2013 Meeting Minutes
2012 Meeting Minutes


 What's New in this Group?
PDK Quality Checklist and User’s Guide

A foundry PDK is critical to the design team; therefore, ensuring accurate communication and documentation flow with the foundry is very desirable.  This document serves as a combination ingredients and “nutrition facts label” for an Analog / Mixed Signal / RF PDK. This document helps you obtain a better understanding of the source data, completeness, and quality of the PDK, before using it to design ICs or to modify it to fit into your in-house design flow.

This document contains a summary of the PDK, including relevant contact information, foundry process documents, and electronic design automation (EDA) tools supported.  It includes details of the PDK such as the database used by the EDA software, language the PDK’s PCells are written in, and standards followed such as iPDK (IPL) or OPDK (Si2).  It also includes a device list with the deliverables and tests performed for each device.  A Checklist Users Guide is included.

MS/RF Process Control Monitoring (PCM) Checklist

Provides a recommended list of parameters that foundries should measure (i.e., test); a uniform way to measure each parameter (i.e., describe the measurement); and a consistent way to describe the test data.

MS/RF Process Checklist

Identifies the different elements of a foundry’s AMS/RF process and its ability to fulfill a semiconductor company’s needs; it serves as a basic set of guidelines for measuring available items in an AMS/RF foundry process; and it is an efficient way to communicate information in a consistent format across all foundries.

Mixed-Signal/RF SPICE Model Checklist

A document completed by the SPICE model developer and delivered with each new release of an SPICE model. This document helps developers better understand the source data, completeness and quality of the model before using it to design ICs or to re-extract it to fit into specific product needs. A Checklist Users Guide and Checklist Taxonomy & Definitions are also available for download.


What's New in this Group?
Designing for Mixed-Signal Foundry Interoperability

The working group analyzed tool support for schematic and layout migration of mixed signal circuits to new process nodes or a different foundry.  This paper summarizes the tools evaluated and provides a comparison table, allowing the mixed signal designer to determine which tool best supports their needs.

Presentations to Project Team:

June 23, 2014

May 7, 2014

Apr 16, 2014

To participate in biweekly teleconferences, contact hbeasley@gsaglobal.org

Foundry Interoperability can be thought of as the ability to port a design from one foundry PDK to another foundry PDK at the same process node.

With the capability to more easily migrate, or to design for Foundry Interoperability, design teams stand to gain by using fewer resources for migration, enabling a faster time to market, and having the ability to more cost effectively second source products.

Foundries also benefit with less customer support for migration, faster time to tapeout, and lower threshold to design wins.  IP providers can support multiple foundries with fewer resources.

Building on the standardized PDK effort, this project team is performing a thorough analysis of existing tools capability and working with foundries to identify gaps.  The end goal is make design migration as simple as possible, by providing the industry with existing tools analysis, and a path to enhanced capability.

The Analog / Mixed Signal working group has released the following documents.

1)  Motivation for Using Standardized PDK

This paper addresses PDK standardization efforts, including  iPDK and OpenPDK.  We address the goals of each effort, as well as commonality and deltas between them.  The business case for and obstacles to using a standardized PDK are presented.   We postulate the impact on foundries, fabless designers, and EDA vendors.

2)  PDK (Process Development Kit) Quality Checklist & User’s Guide

The PDK Quality Checklist and User’s Guide is an enhanced update to the 2008 GSA PDK Checklist.  This document is completed by the PDK developer and delivered with each new release of an Analog / Mixed Signal / RF PDK. This checklist will allow  design teams and foundries to more easily communicate needs, capabilities, and expectations for process PDKs.


What's New in this Group?

PDKs Can Enable an Open Market for Interposer and 3D Solutions
Tuesday, November 25, 2014
3D InCites
As an integral part of the established integrated circuit (IC) supply chain, Outsourced Assembly and Test (OSAT) companies offer IC packaging services on the open market, independent of the chip manufacturer or foundry. OSATs are a subset of the total worldwide IC packaging market, since some IC package assembly is still performed in-house at integrated semiconductor manufacturers (ISM).

Texas Instruments announces 22B copper wire bond technology units shipped
Friday, October 17, 2014
Solid State Technology
Texas Instruments today announced it has shipped more than 22 billion units of copper wire bonding technology from its internal assembly sites and is now in production for major high reliability applications including automotive and industrial. The majority of TI's existing analog and CMOS silicon technology nodes have been qualified with copper, and all new TI technologies and packages are being developed with copper wire bond. Along with its quality, reliability and cost benefits, copper wire offers equal or better manufacturability compared to gold. It also delivers 40 percent higher electrical conductivity to give customers a boost in overall product performance with a number of TI's analog and embedded processing parts.

Litho Options Sparse After 10nm
Thursday, October 16, 2014
Semiconductor Engineering
With EUV's viability still uncertain, multi-patterning may be the cheapest option at 7nm. Beyond that, 3D architectures could be a game changer. Leading-edge foundries are ramping up their 16nm/14nm logic processes, with 10nm and 7nm in R&D. Barring a major breakthrough in Lithography [KC], chipmakers will use 193nm immersion and multiple patterning for both 16nm/14nm and 10nm.

200mm fabs: Older but thriving
Wednesday, October 15, 2014
EETimes Asia
With shrinking device geometries, semiconductor companies are upgrading to larger wafer sizes to reap cost benefits resulting from larger number of dice per wafer. Worldwide, many fabs moved to 300mm wafers more than a decade ago, and Europeans are now talking about the 450mm transition as "opportunities for Europe." The case notwithstanding, there is still plenty of life remaining in 200mm fabs, according to IC Insights, noting that not all semiconductor devices can take advantage of the cost savings 300mm wafers can provide.


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