- Meeting Schedule
- Group Members
The Capital Lite Working Group is a result of discussions that took place during multiple VC panel discussions in 2011 that were chaired by GSA’s ECCEO Council and the publication of the paper The Capital-Lite Semiconductor Model: Revitalizing Semiconductor Startup Investment. The purpose of this Working Group is to foster discussion regarding the current state of funding for semiconductor start-ups; postulate alternative models and solutions; and ultimately turn our discussion into actionable events that will benefit our industry by encouraging entrepreneurship and innovation.
To create a seamless consortium of representatives from the entire semiconductor ecosystem that fully cooperate in enabling start-ups to prosper and return significant multiples to all its constituents and to establish a pipeline of funded, innovative semiconductor companies with an appropriate capital structure to make this the largest segment in tech financing.
To develop, promote and execute expanded investment models that can be used by semiconductor start-ups to innovate and prosper.
- Invigorate semiconductor start-up investment and subsequent returns
- Enable high quality innovation
- Stimulate sustainable M&A and new IPO deal flow
- CEOs, CFOs, and senior leadership from within the entire semiconductor ecosystem, OEMs, VCs, Finance, Banking and M&A executives
- Identify concerns in existing funding models for semiconductor start-ups
- Quantify the problem within the semiconductor industry
- Postulate the impact of the problem to the semiconductor industry and the markets served by this industry
- Propose alternative solutions; e.g. Capital-lite
- Build internal consensus and solicit external feedback
- Solicit industry participation and support
- Agree on and implement solution(s)
Working Group Chair
Matt Rhodes, CEO, Semitech Semiconductor
No meetings are scheduled at this time. Please check back at a later date.
May 1, 2013
- SK Innovation Center (PDF, 1.2MB) / SK telecom Americas
Nov 7, 2012
- Capital Lite Working Group Update (PDF, 1.7 MB)
Mar 14, 2012
Jan 24, 2012
Dec 7, 2011
Oct 13, 2011
- Capital Lite Concepts, Working Group Meeting (PDF, 496 KB)
Oct 6, 2011
- Semiconductor Investment – Redefining the Funding Model (PDF, 496 KB)
Sept 13, 2011
- Capital Lite Organizational Meeting SEP 13 (PDF, 248 KB)
Sept 1, 2011
- Capital-Lite Funding Models for Semiconductor Start-ups (PDF, 587 KB)
- Semiconductor Investment Returns, 2002 – 2011 (PDF, 189 KB)
May 24, 2011
- State of VC Funding for Semiconductor Start-Ups (PDF, 689 KB)
Innovation Center (PDF, 269 KB)
This white paper by SK telecom Americas outlines their funding model to seed new start-ups, mitigate risk, and ensure a successful exit.
Innovation Evolution in the Semiconductor Industry
Authors: Ken Lawler, General Partner, Silicon Ventures; Warren Savage, President and CEO, IPextreme; and Michael Fancher, Associate Professor of Nanoeconomics, College of Nanoscale Science and Engineering
Capital Lite Business Model Strategies & Tools: A Startup’s Guide to Surviving an Investment Drought
This white paper focuses on invigorating semiconductor start-ups to enable high quality innovation, increased investment and subsequent returns, and stimulate sustainable M&A, as well as new IPOs.
Capital-Lite Semiconductor Model: Revitalizing Semiconductor Startup Investment (PDF, 98 KB)
Authors: Amer Haider, Vice President of Corporate and Business Development, Cavium and Awais Nemat, former Vice President of Enterprise Business Unit, Marvell Semiconductors
Startup Outlook 2012 Report (PDF, 886 KB)
Author: Silicon Valley Bank
A Lean Fabless Semiconductor Business Model (PDF, 285 KB)
Author: Andreas Olofsson, Adapteva, Inc.
2012 Meeting Minutes
- NOV 21, 2012 Working Group Minutes (PDF)
2011 Meeting Minutes
Contact Wade Giles for membership information.
Cadence to Acquire Jasper
Tuesday, April 22, 2014
Cadence Design Systems Inc., based in San Jose, Calif., intends to acquire Jasper Design Automation Inc. of Mountain View, Calif., for $170 million in cash, thus adding Jasper's highly regarded formal analysis toolkit -- verification apps built on the JasperGold platform -- to Cadence's already comprehensive System Development Suite.
NXP backs Senseg's electrostatic touch
Monday, April 14, 2014
Senseg Oy (Espoo, Finland), a developer of electrostatically-generated touch feedback for smartphones, has raised $6 million in a Series B round of funding led by NXP Semiconductors NV. The investment included the participation of existing investors Ambient Sound Investments, and Finnvera Venture Capital. This brings the total raised by Senseg to about $12 million.
FocalTech to Acquire Orise Through Share Swaps
Tuesday, April 8, 2014
Touchscreen controller IC vendor FocalTech Systems will acquire LCD driver IC supplier Orise Technology through share swaps, according to the two companies. Under the plan, each FocalTech share will be exchanged for 4.8 Orise shares, with effective date for the merger set on January 2, 2015. Although Orise will be the surviving company after the merger, FocalTech will take up the control over the new company. Additionally, Orise will also change its name to FocalTech later.
Ineda Systems Secures $17M in Series B Funding from Key Partners
Tuesday, April 8, 2014
Ineda Systems, a developer of low-power SoCs (system on a chip) for use in the fast-growing wearables and Internet of Things (IoT) market segment, today announced that it has raised $17M in Series B funding. The funding will be used to further develop Ineda's new class of highly integrated, ultra-low power semiconductor and software products that are aimed at the wearable device segment. These SoCs will be applicable to a multitude of devices such as smartwatches, health and fitness trackers and other wearable devices, as well as IoT.
Freescale Enters into Definitive Agreement to Purchase Mindspeed ARM Processor Business from MACOM
Monday, April 7, 2014
Freescale Semiconductor has entered into a definitive agreement to purchase the Comcerto CPE communications processor business of Mindspeed Technologies, Inc. This business includes a series of multicore, ARM-based embedded processors and associated software, a talented team, and Tier One customers spanning the globe.
Nujira Closes $20M Funding
Thursday, April 3, 2014
Nujira Ltd, a Cambridge, UK-based developer of Envelope Tracking (ET) technology, closed a $20m (£12.2m) funding round. Backers included Amadeus Capital Partners, Climate Change Capital, Environmental Technologies Fund, SAM Private Equity and NES Partners as well as new investors GAM (on behalf of its GAM Star Technology strategy), Investec and other institutional and high net worth clients.
ON Semiconductor to Acquire Truesense Imaging, Inc.
Wednesday, April 2, 2014
ON Semiconductor Corporation, driving energy efficient innovations, today signed a definitive agreement to acquire Truesense Imaging, Inc., a provider of high-performance image sensor devices addressing a wide range of industrial end-markets including machine vision, surveillance, traffic monitoring, medical and scientific imaging, and photography. The acquisition of Truesense Imaging strongly complements ON Semiconductor's image-sensor business by vastly expanding its technology portfolio and adding more than 200 new customers.
Crossbar Closes Series C Funding of $25M
Monday, March 31, 2014
Crossbar, Inc., a start-up company pioneering Resistive RAM (RRAM) technology, today announced it has completed a $25 million Series C funding in an oversubscribed round. Participating in the round were Crossbar's existing investors Artiman Ventures, Kleiner Perkins Caufield & Byers, Northern Light Venture Capital and the University of Michigan. In addition, new investors included SAIF Partners, Korea Investment Partners, CBC-Capital and Tao Venture Capital Partners, validating the mass-market opportunity and global appeal of the Crossbar technology.
EnVerv Announces Closing of $15.4M Series C Investment Round
Monday, March 24, 2014
EnVerv Inc., an innovative fabless semiconductor company and a leading provider of high performance communications and metering System on Chip (SoC) solutions for the Advanced Metering Infrastructure (AMI), smart grid, solar and other grid connectivity markets, announced today the closing of its $15.4M round of series C financing with participation from Cassiopeia Capital Partners, Cisco, UMC Capital and existing investors Benchmark Capital, NEA and Walden International.
Mentor Graphics Acquires Berkeley Design Automation to Advance Nanometer Analog/Mixed-Signal Verification
Friday, March 21, 2014
Mentor Graphics Corp. today announced that it has acquired Berkeley Design Automation, Inc. (BDA), a recognized leader in nanometer analog, mixed-signal, and RF circuit verification. With over one hundred customers worldwide, BDA uniquely addresses nanometer circuit design challenges via its Analog FastSPICE™ unified verification platform and exceptional vertical-application expertise. The acquisition of BDA aligns with Mentor's goal to deliver technologies with superior performance and automation for the growing challenges of Analog/Mixed-Signal (AMS) verification.
Glo Completes $30M Series D Financing Round
Wednesday, March 19, 2014
Glo AB of Ideon Science Park, Lund, Sweden, which provides light source solutions for displays, illumination and automotive sectors using its proprietary nLED technology, has completed a $30m Series D round of financing. The firm will use the funds to add to its product portfolio, team, and strategic partnerships.
Aquantia Completes $16M Series G Financing
Monday, March 17, 2014
Aquantia, the market leader of high-speed Ethernet connectivity solutions for data centers, mobile and Enterprise infrastructure, today announced the completion of series G financing for $16 million. Xilinx Inc., led the round and existing investors provided additional capital.
Top Ten MEMS Startup Qualtré Secures $8M Strategic Round
Monday, March 17, 2014
Qualtré, Inc., the leading developer of next generation silicon MEMS inertial sensors, announced today that it has finalized an $8 million Series C strategic round of investment from a new strategic investor and from Matrix Partners and Pilot House Ventures, contributors to Qualtré's previous rounds.
VIS Reportedly to Acquire an 8-inch Fab From Nanya Technology
Tuesday, March 11, 2014
Vanguard International Semiconductor (VIS) reportedly will acquire an 8-inch fab from Taiwan-based Sumpro Electronic, an affiliate of Nanya Technology. The deal is expected to be finalized on March 14.
Silicon Labs Acquires Low-Power Analog IC Products
Monday, March 3, 2014
Silicon Labs, a leader in high-performance, analog-intensive, mixed-signal ICs, today announced the purchase of the full product portfolio and intellectual property of California-based Touchstone Semiconductor Inc., an early-stage power management technology company and provider of high-performance, low-power analog IC products. Silicon Labs purchased the assets of Touchstone for $1.5 million.
Teledyne DALSA Lands Funding to Expand MEMS and Infrared Imaging Capabilities
Thursday, February 27, 2014
The semiconductor division of Teledyne DALSA, based in Bromont, Québec, is receiving a financial commitment totaling $13 million from Investissement Québec to expand its MEMS and infrared imaging manufacturing capabilities. The funding consists of a $3 million grant to increase MEMS production capacity in Bromont and $10 million to develop advanced infrared imaging products at the company's Bromont and Montreal facilities.
Newlans Raises $15M Series B Led by Intel Capital
Monday, February 24, 2014
Boston Business Journal
Newlans, an Acton, Mass.-based maker of broadband analog signal processing devices, announced today it raised $15 million in Series B funding led by California-based Intel Capital.
RF Micro to Buy TriQuint to Boost Mobile Chips Business
Monday, February 24, 2014
Chipmaker RF Micro Devices Inc. will buy peer TriQuint Semiconductor Inc for about $1.6 billion to capture a larger share of the market for chips supplied to Apple Inc and Samsung Electronics Co Ltd.
MACOM Acquires Nitronex, LLC
Thursday, February 13, 2014
M/A-COM Technology Solutions Inc., a leading supplier of high performance analog, RF, microwave and millimeter wave products, today announced that it has acquired Nitronex, LLC, a leader in the design and manufacture of gallium nitride (GaN) based RF solutions. The acquisition of Nitronex is expected to provide MACOM with fundamental and innovative GaN-on-Silicon epitaxial and pendeoepitaxial semiconductor process technology and materials for use in RF applications, establishing MACOM's growing GaN technology portfolio as one of the broadest in the industry.
Swisscom Ventures Backs Lemoptix to Put Micro-Projection Tech in Mobile Phones, HUDs and Wearables
Thursday, February 13, 2014
Lemoptix has secured an undisclosed investment amount from the venture arm of Swiss Telco: Swisscom Ventures and existing investors, TechCrunch reported. Based in Switzerland, Lemoptix has developed technology that allows the embedding of micro-projectors in devices like mobile phones, automotive heads-up displays and wearable displays.
Cadence Acquires High Speed Interface IP Assets of TranSwitch Corporation, Further Expanding IP Portfolio for Mobile/Consumer Market
Wednesday, February 12, 2014
Wall Street Journal
Adding to its rapidly expanding IP portfolio, Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that it has acquired the high speed interface IP assets of TranSwitch Corporation and has also hired its experienced IP development team.
Microchip Technology Announces Acquisition of Supertex, Inc.
Monday, February 10, 2014
Microchip Technology Incorporated, a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, and Supertex Incorporated today announced that Microchip has signed a definitive agreement to acquire Supertex for $33 per share in cash, which represents a total equity value of about $394 million, and a total enterprise value of about $246 million, after excluding Supertex's cash and investments on its balance sheet of approximately $148 million.
Powervation Closes $5.5M Funding Round
Monday, February 10, 2014
Powervation Ltd., the leader in Intelligent Digital Power IC solutions, today announced it has recently raised a $5.5M C1 funding round which will enable it to further accelerate growth, product development, and market adoption of its Digital Power platform at leading cloud and communications infrastructure OEMs.
WLCSP Completes IPO and Begins Trading Publicly on the Shanghai Stock Exchange
Monday, February 10, 2014
Infinity Group announced today that portfolio company Wafer Level Chip Scale Package (WLCSP) has listed on the Shanghai Stock Exchange and has raised US$118M with an IPO price of US$780M.
Cadence to Enhance High-Level Synthesis Offering with Acquisition of Forte Design Systems
Wednesday, February 5, 2014
The Wall Street Journal
Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that it has entered into a definitive agreement to acquire Forte Design Systems, a provider of SystemC-based high-level synthesis (HLS) and arithmetic IP.