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The GSA EMTECH Interest Group is a platform for GSA members to discuss opportunities and challenges in the industry and share their ideas with peers and partners across various emerging technologies within the semiconductor ecosystem.

The May 2024 GSA EMTECH on the Horizon Webinar Series has invited BJ (Byung Joon) Han, CEO and Co-Founder of Silicon Box to share his insights on the New Era of Efficient Semiconductor Interconnect.

New Era of Efficient Semiconductor Interconnect

Date/Time:

  • Tuesday, May 21, 2024 | 5 – 6 PM Pacific Time
  • (Wednesday, May 22 | 8 – 9 AM Singapore Time)

Speaker:

BJ (Byung Joon) Han
CEO and Co-Founder, Executive Board Director
Silicon Box

Moore’s Law has reached it’s limits (!) causing massive disruption to semiconductor supply chains and bottlenecks in advanced chip manufacturing. Where are we? How did we get here? And what is the industry doing to overcome the critical challenges to support and scale the most promising technologies of tomorrow? AI, LLMs, electronic vehicles, mobile, healthcare, space industries… you name it, they all need these chips.

In the New Era of Efficient Semiconductor Interconnect webinar, Silicon Box CEO and co-founder, Dr. Byung Joon (BJ) Han will discuss his perspective on the state of the industry, and how advanced packaging is increasingly being seen as a key part of the answer to previous questions. Dr. Han will discuss current technical concepts and paradigm shifts he’s witnessed in semiconductor back-end manufacturing that are culminating at this moment; and how various industry stakeholders from designers and engineers to suppliers and customers, can take advantage of chiplet architecture and the latest in advanced packaging solutions to take meaningful risks and reap rich rewards by unlocking latent creativity, and through the next-gen applications they will dare to empower.

Author

Byung Joon

BJ (Byung Joon) Han
CEO and Co-Founder / Executive Board Director
Silicon Box

Dr. Byung-Joon (BJ) Han is the co-founder and CEO @ Silicon Box. He served as Chief Technology Officer, President, Chief Executive Officer, and Chairman of the Board for JCET STATS Chippac – the world’s No. 3 OSAT – where he worked for twenty years (1999-2019). Dr. Han brings his know-how and expertise in advanced packaging to Silicon Box, and to address the current lack of chiplet integration infrastructure.

In the prior 14 years, he held positions at AT&T Bell Labs, IBM Research, and Anam Semiconductor (later Amkor). Dr. Han is a consultant at Bain and holds directorships at several important semiconductor firms and innovation initiatives.

Dr. Han was a member of the main committee for Singapore President’s Science and Technology Awards, a member of the National Research Foundation of Singapore and a Director at the Intellectual Property Office of Singapore. He served as Director for the
International Electronics Manufacturing Initiative from 2005-2017. Dr. Han holds over 300 patents.

Dr. Han received his PhD from Columbia University in the City of New York, and completed the Advanced Management Program at Harvard University.

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