Wafer & Assembly Pricing Surveys and Reports are based on data gathered directly from participating semiconductor companies. The data is collected confidentially and tabulated in aggregate to provide benchmark data for pricing trends and cost estimations. The online survey is continuously updated to reflect new technology nodes and trends.

NOTE: Companies participating in the Wafer Fabrication & Assembly Pricing Survey will receive a complimentary copy of the reports below. If you are a fabless company or an IDM that is purchasing wafers directly from an established foundry relationship, outsourcing assembly services and is interested in participating, contact Shungo Saito.

Wafer Fabrication Pricing Report

The report’s interactive, online report query capability allows user to select pertinent data points, from wafer fabrication parameters such as:

  • Process – CMOS, compound semiconductors, SOI
  • Process Geometry – from 10nm up to 500nm+
  • Wafer Size – 150mm, 200mm, 300mm

***Results are based on the data collected during the latest survey and may not include all parameters listed above.

An Executive Summary provides a written and graphical analysis of industry and pricing trends, such as shown below.

Assembly Pricing Report

The Assembly Pricing Report is available as a stand-alone report or packaged with the Wafer Fabrication Pricing Report.  The report shows pricing trends for outsourced assembly services for fabless and IDMs. The data is collected confidentially and tabulated in aggregate.

The report’s interactive, online report query capability allows user to select pertinent data points, from assembly parameters such as:

  • Package Family – BGA, CSP, MCP, QFN, xQFP, SOIC and others
  • # Leads / Balls
  • Substrate data
  • Wire Type

***Results are based on the data collected during the latest survey and may not include all parameters listed above.

An Executive Summary provides a written and graphical analysis of pricing trends, such as shown below.